文摘
Front Cover: Electroconductive hydrogel is covalently bonded to titanium implant surface via thiol-ene “click” chemistry, followed by the introduction of polypyrrole into the hydrogel network by electropolymerization. It provide a new direction for the modification of implantable bioelectronic devices to improve the integration between tissue and implant material. Further details can be found in the article by Guoxin Tan,* Yan Liu, Lei Zhou, Kongyou Ouyang, Zhengao Wang, Peng Yu, and Chengyun Ning on page 1423.