Understanding non-parabolic solidification kinetics in Ni-based alloys during TLP bonding via thermo-kinetic modelling

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• 作者：Kewu Bai^a ; ^{baikw@ihpc.a-star.edu.sg} ; Fern Lan Ng^b ; Teck L. Tan^a ; ^{tantl@ihpc.a-star.edu.sg} ; Tao Li^b ; Dayou Pan^b
• 关键词：Transition metal alloys and compounds ; Transient liquid phase bonding ; Diffusion ; Kinetics ; Phase diagrams ; Thermodynamic modeling
• 刊名：Journal of Alloys and Compounds
• 出版年：2017
• 出版时间：30 March 2017
• 年：2017
• 卷：699
• 期：Complete
• 页码：1084-1094
• 全文大小：4130 K
• 卷排序：699

文摘

We developed a model to simulate the TLP bonding process controlled by both diffusion and precipitation. The designed brazing process using the model can significantly save brazing cost. The model can be extended to simulate different alloy systems.