Effect of nano Al2O3 additions on the interfacial behavior and mechanical properties of eutectic Sn-9Zn solder on low temperature wetting and soldering of 6061 aluminum alloys
The preparation of composite solders by rapid solidification method is feasible. Al2O3 nano-particles can inhibit the growth of dendritic Sn-Zn eutectic. Al2O3 nano-particles can reduce the thickness of Al8ZnSn4 interface layer. Adding 1 wt% Al2O3 nanoparticles can improve wetting area and strength of soldered joint by 96.9% and 47.7%, respectively.