Gold electrodes have been deposited by transfer printing (TP) on a thiol-functionalized self-assembledmonolayer (SAM) on silicon substrate. A sequential chemical route is reported to incorporate thiol groups(-SH) on a preformed long alkyl chain SAM on silicon. The structural characterizations of the functionalizedsurfaces are described and confirm success of each chemical step (overall yield of 20%). The electrical
measurements of the silicon-molecules-gold TP junctions are compared with junctions made by a classicalvacuum evaporation of gold. The temperature-dependent electrical
measurements show that the silicon/alkyl/Au TP junctions exhibit a purely temperature-independent tunnel behavior, while a slight temperature-dependentbehavior is observed at a low bias (
V < 0.5 V) for the junctions with evaporated Au electrodes.
Admittancespectroscopy
measurements confirm the better dielectric behavior of TP junctions.