Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles

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• 作者：Jagjiwan Mittal ; Kwang-Lung Lin
• 关键词：Cu ; diffusion ; nanoscale ; Sn ; soldering
• 刊名：Journal of Electronic Materials
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：46
• 期：1
• 页码：602-608
• 全文大小：
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Optical and Electronic Materials; Characterization and Evaluation of Materials; Electronics and Microelectronics, Instrumentation; Solid State Physics;
• 出版者：Springer US
• ISSN：1543-186X
• 卷排序：46

文摘

Diffusion of Cu inside Sn was studied through interfacial interactions between Cu and Sn nanoparticles without using any soldering additives. The studies conducted in this research revealed that the diffusion of Cu towards Sn nanoparticles was as high as 30 nm and 84 nm, respectively, when the Cu and Sn nanoparticles were heated at 150°C and 210°C under H₂/N₂. The atomic flux of Cu diffusion into the Sn nanoparticles during interfacial reactions at 150°C was higher than that of the Cu diffusion into bulk Sn. High Cu flux resulted in the formation of intermetallic compounds Cu₆Sn₅ at 150°C and Cu₆Sn₅ and Cu₃Sn at 210°C without an observable diffusion layer.