Mechanical property evaluation of TSV-Cu micropillar by compression method

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• 作者：Ting Gu (1)
  Ping Cheng (1)
  Su Wang (2)
  Huiying Wang (1)
  Xuhan Dai (1)
  Hong Wang (1)
  Guifu Ding (1)
  
• 关键词：TSV ; Cu ; mirco ; compression ; yield strength ; thermal treatment
• 刊名：Electronic Materials Letters
• 出版年：2014
• 出版时间：July 2014
• 年：2014
• 卷：10
• 期：4
• 页码：851-855
• 全文大小：538 KB
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• 作者单位：Ting Gu (1)
  Ping Cheng (1)
  Su Wang (2)
  Huiying Wang (1)
  Xuhan Dai (1)
  Hong Wang (1)
  Guifu Ding (1)
  
  1. National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, People’s Republic of China
  2. Shanghai Sinyang Semiconductor Materials Co., Ltd, Shanghai, 201616, China
  
• ISSN：2093-6788

文摘

A micro-compression test method was presented to evaluate the mechanical property of the TSV-Cu micropillar in this paper. Firstly, the test sample containing TSV-Cu micropillar was prepared by MEMS micromachining technology. Then, the mechanical property of TSV-Cu micropillar was measured by a self-made micro-compression system. Finally, the effect of thermal treatment on the mechanical property of TSV-Cu micropillar was studied. The experimental results showed that the average yield strength (σ 0.2) of the TSV-Cu micropillar was 167 MPa. But it decreased to 137 MPa after being thermally treated at 400°C for 1 hour, which was probably due to the increased grain size of Cu.