Influence of applied electric field and mechanical boundary condition on the stress distribution at the crack tip in piezoelectric materials

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• 作者：Kumar ; Susmit ; Singh ; Raj N.
• 关键词：Finite element ; Fracture mechanics ; Piezoelectric ; Plane strain ; Stress distribution
• 刊名：Materials Science and Engineering ; A
• 出版年：1997
• 期刊代码：61_09215093
• 类别：ms
• 出版时间：July 15, 1997
• 卷：231
• 期：1-2
• 页码：1-9
• 文件大小：822 K

摘要

A finite element technique is used to study the stress distributions at the crack tip of a piezoelectric ceramic subject to the applied electric fields. Under a negative applied electric field (electric field opposite to the direction of poling), the assumption of crack surfaces to be free of surface traction as the mechanical boundary condition is found to be invalid. It is shown that the stress distributions at the crack tip under the negative applied electric field are different for the closed crack mechanical boundary condition than those for the traction-free crack surface mechanical boundary condition. Publisher: Elsevier Science Language of Publication: English Item Identifier: S0921-5093(97)00038-5 Publication Type: Article ISSN: 0921-5093 Cited by:

1. Liu, Bing; Chen, Zheng; Wang, Yongxin; Wang, Xining,"The effect of an electric field on the mechanical properties and microstructure of Al-Li alloy containing Ce"Materials Science and Engineering: A2001pp. 69-74
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2. Tian-hu, Hao,"Discussion on `influence of applied electric field and mechanical boundary condition on the stress distribution at the crack tip in piezoelectric materials¹'"Materials Science and Engineering: A2001pp. 316-318
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3. Wang, B.L.; Mai, Y.W.,"Fracture of a piezoelectric material layer bonded by two elastic layers"International Journal of Engineering Science2002pp. 1697-1727
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4. Tian-hu, Hao,"Discussion on "Influence of applied electric field and mechanical boundary condition on the stress distribution at the crack tip in piezoelectric materials". Compatibility of electrical and mechanical boundary conditions"Materials Science and Engineering: A2002pp. 350-350
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5. Kumar, Susmit; Singh, Raj N.,"Reply to discussion on `Influence of applied electric field and mechanical boundary condition on the stress distribution at the crack tip in piezoelectric materials'."Materials Science and Engineering: A2002pp. 351-351
   351_rtdooatctipm">Bibliographic Page351_rtdooatctipm&form=pdf&file=file.pdf">Full Text
6. Wang, B.L.; Mai, Yiu-Wing,"On the electrical boundary conditions on the crack surfaces in piezoelectric ceramics"International Journal of Engineering Science2003pp. 633-652
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Footnotes:

1. Kumar S, Singh RN, (1997), Influence of applied electric field and mechanical boundary condition on the stress distribution at the crack tip in piezoelectric materials, Materials Science and Engineering A231 pp 1-9.