Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
- 作者：Mike Roellig ; Rainer Dudek ; Steffen Wiese ; Bjoern Boehme ; Berhard Wunderle ; Klaus-Juergen Wolter ; Bernd Michel
- 刊名：Microelectronics Reliability
- 出版年：2007
- 期刊代码：128_00262714
- 类别：et
- 出版时间：February-March 2007
- 卷：47
- 期：2-3
- 页码：187-195
- 文件大小：1179 K
摘要
The paper presents the method of generating lifetime-prediction-laws on special prepared very stiff specimen. The combination of thin- and thick-film technology allows building up test samples on ceramic very similar to electronic packages including the measurement issues. Influences of pad surface metallurgy, microstructure of solder, ineutectic solder alloys and assembly process parameter are regarded now. The investigation objects provide monitoring of electrical and mechanical damage process of SnAgCu solder bump. Different thermo-mechanical loads will be applied in temperature ranges of 0 to +80 °C, −40 to +125 °C and −50 to +150 °C, where the temperature gradient and cycle frequency also vary. A Variation of four different chip sizes allows the determination of fatigue laws for each temperature profile, to be able to compare in between them. The results of these tests will give universal lifetime-prediction laws for SnAgCu base solder joints. Main goals are to find coefficients for lifetime prediction models such as Coffin–Manson- or Norris–Landzberg-relation, which are transferable in between different electronic packages.