封装结构强电磁脉冲多物理效应并行计算程序研制
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摘要
介绍了自主研发的强电磁脉冲多物理效应并行计算程序JEMS-CDS-System的情况,该程序采用时域有限元方法,基于JAUMIN并行自适应结构网格支撑框架研制,并行效能高,可扩展性强,且支持动态负载平衡。通过算例测试表明,该程序对于键合线的电-热-应力失效过程的最高温度与范式等效应力计算结果与COMSOL软件计算结果吻合较好;SiP功率放大模块的热-应力耦合天河2高性能计算平台并行计算结果表明,该程序在CPU1024核时,具有38.1%并行效率。
This paper presents the study of massively parallel simulation of multi-physics effect with electromagnetic pluses excitation using a high-performance computing scheme based on JAUMIN.Our in-house time-domain finite element parallel program JEMS-CDS-System is employed for simulating the electro-thermo-mechanical responses of bonding wire arrays and their highest temperatures and von Mises stress are captured and validated in comparison with those of the commercial simulator COMSOL.The thermo-mechanical responses of a part of SiP are simulated and parallel efficiency of our parallel program is assessed by the experiment of its strong parallel scalability.Our parallel program can reach a speedup of 6.095 and strong scalability efficiency of 38.1% on 1024 CPU cores.
This paper presents the study of massively parallel simulation of multi-physics effect with electromagnetic pluses excitation using a high-performance computing scheme based on JAUMIN.Our in-house time-domain finite element parallel program JEMS-CDS-System is employed for simulating the electro-thermo-mechanical responses of bonding wire arrays and their highest temperatures and von Mises stress are captured and validated in comparison with those of the commercial simulator COMSOL.The thermo-mechanical responses of a part of SiP are simulated and parallel efficiency of our parallel program is assessed by the experiment of its strong parallel scalability.Our parallel program can reach a speedup of 6.095 and strong scalability efficiency of 38.1% on 1024 CPU cores.
引文
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[3]Tong Jie,Zhu Guodong,Hu Jun,et al.Study on electro-thermo-mechanical responses of bonding wires arrays used for the package design of LDMOSFET-based RF amplifier[C]//IEEE Electrical Design of Advanced Packaging and Systems.2017:211-213.
[4]Zhou Wei,Zhou Liang,Lin Liang,et al.Electro-thermal-stress interactions of LDMOS FET induced by DCI RF-pulses[J].IEEE Transactions on Electromagnetic Compatibility,2014,56(5):1178-1184.
[5]Sandia National Laboratories.Engineering Physics Integrated Codes[EB/OL].http://www.sandia.gov/asc/integrated_codes.html
[6]Liu Qingkai,Zhao Weibo,Cheng Jie,et al.A programming framework for large scale numerical simulations on unstructured mesh[C]//Proceedings of the 2nd IEEE International Conference on High Performance and Smart Computing(IEEE HPSC).2016.
[7]Tong Jie,Zhu Guodong,Hu Jun,et al.Study on electro-thermo-mechanical responses of bonding wires arrays used for the package design of LDMOSFET-based RF amplifier[C]//IEEE Electrical Design of Advanced Packaging and Systems.2017:211-213.
[8]Kong Fanzhi,Yin Wenyan,Mao Junfa,et al.Electro-thermo-mechanical characterizations of various wire bonding interconnects illuminated by an electromagnetic pulse[J].IEEE Transactions on Advanced Packaging,2010,33(3):729-737.
[9]林良.高性能射频半导体功率器件设计及其在无线通信中的应用研究[D].上海:上海交通大学,2016.(Lin Liang.Design of high performance RF semiconductor power device and its application in wireless communication.Shanghai:Shanghai Jiaotong University,2016)