基于微硅热丝的热流式加速度传感器
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摘要
微加速度传感器由微压电泵驱动的连续循环密闭气流流路、硅热丝传感器以及惠斯登电桥测量电路三部分组成。利用硅热丝可以检测射流气体偏转引起的电阻变化,并通过惠斯登电桥电路测量出对应的加速度。基于硅热阻效应原理和微纳加工技术,设计和制备了一种成本低、体积小、寿命长、耐冲击和振动的热流式微加速度传感器。利用ANSYS软件进行仿真,分析了连续循环密闭气流的流速分布图。基于光刻、硅刻蚀和键合等微纳加工技术,在绝缘衬底上的硅(SOI)基板上制备了基于微硅热丝的加速度传感器。经测试,硅丝(长400μm×宽4μm×高2μm)在室温下电阻为45 kΩ,电阻温度系数(TCR)为4.6×10-3/℃,传感器X和Y两个方向上的灵敏度为8 mV/g。使用该方法制备的热流式传感器具有体积小、耐冲击和灵敏度高等优势。
The micro-acceleration sensor is composed of a continuously circulating closed air flow path driven by a micro-piezoelectric pump,a silicon hot wire sensor and a Wheatstone bridge measuring circuit.The resistance variation caused by the deflection of the jet gas was detected with the silicon hot wire,and the corresponding acceleration was measured by the Wheatstone bridge circuit.Based on the principle of the silicon thermal resistance effect and micro-nano processing technology,a heat flow micro-acceleration sensor with low cost,small size,long life,shock resistance and vibration resistance was designed and prepared.The ANSYS software was used to simulate,and the flow velocity distribution diagram of the continuous circulating closed airflow was analyzed.Based on lithography,silicon etching,bonding and other micro-nano processing technology,an acceleration sensor based on the micro silicon hot wire was fabricated on the silicon-on-insulator(SOI)substrate.According to the test results,the silicon filament(400μm length×4μm width×2μm height)has a resistance of 45 kΩat room temperature,a temperature coefficient of resistance(TCR)of 4.6×10-3/℃,and a sensitivity of 8 mV/gin the direction Xor Y of the sensor.The heat flow sensor prepared by the method has the advantages of small volume,impact resistance and high sensitivity.
The micro-acceleration sensor is composed of a continuously circulating closed air flow path driven by a micro-piezoelectric pump,a silicon hot wire sensor and a Wheatstone bridge measuring circuit.The resistance variation caused by the deflection of the jet gas was detected with the silicon hot wire,and the corresponding acceleration was measured by the Wheatstone bridge circuit.Based on the principle of the silicon thermal resistance effect and micro-nano processing technology,a heat flow micro-acceleration sensor with low cost,small size,long life,shock resistance and vibration resistance was designed and prepared.The ANSYS software was used to simulate,and the flow velocity distribution diagram of the continuous circulating closed airflow was analyzed.Based on lithography,silicon etching,bonding and other micro-nano processing technology,an acceleration sensor based on the micro silicon hot wire was fabricated on the silicon-on-insulator(SOI)substrate.According to the test results,the silicon filament(400μm length×4μm width×2μm height)has a resistance of 45 kΩat room temperature,a temperature coefficient of resistance(TCR)of 4.6×10-3/℃,and a sensitivity of 8 mV/gin the direction Xor Y of the sensor.The heat flow sensor prepared by the method has the advantages of small volume,impact resistance and high sensitivity.
引文
[1]MUKHERJEE R,BASU J,MANDAL P,et al.A review of micromachined thermal accelerometers[J].Journal of Micromechanics&Microengineering,2017,27(12):123002-1-123002-18.
[2]LU Y S,WANG H W,LIU S H.An integrated accelerometer for dynamic motion systems[J].Measurement,2018,125(9):471-475.
[3]GHEORGHE M V.Advanced calibration method for 3-axis MEMS accelerometers[C]//Proceedings of International Semiconductor Conference(CAS).Sinaia,Romania,2016:81-84.
[4]刘发明,邱召运,姜广东.差分霍尔效应加速度测量方法及其线性实验模拟[J].现代电子技术,2010(6):203-206.
[5]刘宇,鞠文斌,刘羽熙.MEMS加速度传感器计量检测技术的研究进展[J].计测技术,2010(4):5-8.
[6]高立慧,赵振刚,张长胜,等.压电式加速度传感器振动信号采集系统[J].传感器与微系统,2016,35(10):100-102.
[7]LI C,ZHAO Y,CHENG R.A micro resonant acceleration sensor comprising silicon support with temperature isolator and quartz doubled ended tuning fork[C]//Proceedings of the 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems(NEMS).Waikiki Beach,HI,USA,2014:346-349.
[8]王占友,何琳.IEPE型智能加速度传感器的设计[J].舰船电子工程,2017,37(5):114-117.
[9]SHEHZAD K,SHI T,QADIR A,et al.Designing an efficient multimode environmental sensor based on graphene-silicon heterojunction[J].Advanced Materials Technologies,2017,2(4):1600262-1-1600262-10.
[10]王俊云.热对流式加速度传感器原理及应用[J].世界产品与技术,2006(3):58-62.
[11]杨拥军,吝海锋,师谦,等.微机械热对流加速度传感器可靠性研究[J].微纳电子技术,2003,40(7):317-320.
[12]徐爱东,张旭辉.微机械热对流加速度传感器的频响特性及补偿[J].微纳电子技术,2013,50(5):310-315.
[13]陈宏亮,马少杰,张英忠,等.三轴高g值加速度传感器的测试技术研究[J].传感技术学报,2018(2):175-179.
[14]FLASCHEL N,ARIZA D,DEZ S,et al.Thermal and hydrodynamic studies for micro-channel cooling for large area silicon sensors in high energy physics experiments[J].Nuclear Instruments and Methods in Physics Research Section:A,2017,863:26-34.
[15]JAMES F.Capacitive versus thermal MEMS for high-vibration applications[EB/OL].(2016-05-18)[2018-08-11].http://www.memsic.com/userfiles/files/WP_CapacitiveVsThermal2_Final.pdf.
[16]GARRAUD A,GIANI A,COMBETTE P,et al.A dual axis CMOS frontside bulk micromachined thermal accelerometer[C]//Proceedings of Design Test Integration and Packaging of MEMS/MOEMS.Seville,Spain,2010:67-72.
[17]NGUYEN H B,MAILLY F,LATORRE L,et al.Design of a monolithic 3-axis thermal convective accelerometer[C]//Proceedings of Design,Test,Integration and Packaging of MEMS/MOEMS,IEEE.Barcelona,Spain,2013:1-4.
[18]HE J,XIE J,HE X,et al.Analytical study and compensation for temperature drifts of a bulk silicon MEMS capacitive accelerometer[J].Sensors and Actuators:A,2016,239:174-184.
[2]LU Y S,WANG H W,LIU S H.An integrated accelerometer for dynamic motion systems[J].Measurement,2018,125(9):471-475.
[3]GHEORGHE M V.Advanced calibration method for 3-axis MEMS accelerometers[C]//Proceedings of International Semiconductor Conference(CAS).Sinaia,Romania,2016:81-84.
[4]刘发明,邱召运,姜广东.差分霍尔效应加速度测量方法及其线性实验模拟[J].现代电子技术,2010(6):203-206.
[5]刘宇,鞠文斌,刘羽熙.MEMS加速度传感器计量检测技术的研究进展[J].计测技术,2010(4):5-8.
[6]高立慧,赵振刚,张长胜,等.压电式加速度传感器振动信号采集系统[J].传感器与微系统,2016,35(10):100-102.
[7]LI C,ZHAO Y,CHENG R.A micro resonant acceleration sensor comprising silicon support with temperature isolator and quartz doubled ended tuning fork[C]//Proceedings of the 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems(NEMS).Waikiki Beach,HI,USA,2014:346-349.
[8]王占友,何琳.IEPE型智能加速度传感器的设计[J].舰船电子工程,2017,37(5):114-117.
[9]SHEHZAD K,SHI T,QADIR A,et al.Designing an efficient multimode environmental sensor based on graphene-silicon heterojunction[J].Advanced Materials Technologies,2017,2(4):1600262-1-1600262-10.
[10]王俊云.热对流式加速度传感器原理及应用[J].世界产品与技术,2006(3):58-62.
[11]杨拥军,吝海锋,师谦,等.微机械热对流加速度传感器可靠性研究[J].微纳电子技术,2003,40(7):317-320.
[12]徐爱东,张旭辉.微机械热对流加速度传感器的频响特性及补偿[J].微纳电子技术,2013,50(5):310-315.
[13]陈宏亮,马少杰,张英忠,等.三轴高g值加速度传感器的测试技术研究[J].传感技术学报,2018(2):175-179.
[14]FLASCHEL N,ARIZA D,DEZ S,et al.Thermal and hydrodynamic studies for micro-channel cooling for large area silicon sensors in high energy physics experiments[J].Nuclear Instruments and Methods in Physics Research Section:A,2017,863:26-34.
[15]JAMES F.Capacitive versus thermal MEMS for high-vibration applications[EB/OL].(2016-05-18)[2018-08-11].http://www.memsic.com/userfiles/files/WP_CapacitiveVsThermal2_Final.pdf.
[16]GARRAUD A,GIANI A,COMBETTE P,et al.A dual axis CMOS frontside bulk micromachined thermal accelerometer[C]//Proceedings of Design Test Integration and Packaging of MEMS/MOEMS.Seville,Spain,2010:67-72.
[17]NGUYEN H B,MAILLY F,LATORRE L,et al.Design of a monolithic 3-axis thermal convective accelerometer[C]//Proceedings of Design,Test,Integration and Packaging of MEMS/MOEMS,IEEE.Barcelona,Spain,2013:1-4.
[18]HE J,XIE J,HE X,et al.Analytical study and compensation for temperature drifts of a bulk silicon MEMS capacitive accelerometer[J].Sensors and Actuators:A,2016,239:174-184.