银纳米线基透明导电薄膜研究进展
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摘要
随着电子产品不断向小型化和便携式等方向发展,在柔性衬底上制备薄膜电子器件引起了人们越来越多的关注。其中柔性透明导电薄膜作为电子器件必备部件之一已成为重要的研究方向。传统的氧化铟锡材料因其柔韧性差等问题限制了在柔性器件中应用。银纳米线由于优异的导电导热性、良好的机械稳定性、可接受的价格和氧化物仍具有一定的导电性等特点,被认为是最具潜力替代氧化铟锡的下一代柔性透明导电材料。本文介绍了银纳米线基透明导电薄膜的相关理论和制备方法、以及国内外银纳米线基透明导电薄膜的研究进展,并对未来的发展方向进行了展望。
Along with the miniaturization and portability of the electronic products, preparation of thin film electronic devices on a flexible substrate has attracted more and more attention. The flexible transparent conductive film as a necessary component of electronic device has become an important research direction. The traditional materials of indium tin oxide restrict the applications in flexible devices due to their poor flexibility. Silver nanowire has many characteristics such as excellent thermal conductivity, good mechanical stability,acceptable price and its oxide still has certain conductivity. So it is considered to be the most promising alternative to indium tin oxide for the next generation of flexible transparent conductive materials. This paper introduces the related theory of transparent conductive film and preparation methods, as well as the research progress of silver nanowires based transparent conductive films, and prospects the future development.
Along with the miniaturization and portability of the electronic products, preparation of thin film electronic devices on a flexible substrate has attracted more and more attention. The flexible transparent conductive film as a necessary component of electronic device has become an important research direction. The traditional materials of indium tin oxide restrict the applications in flexible devices due to their poor flexibility. Silver nanowire has many characteristics such as excellent thermal conductivity, good mechanical stability,acceptable price and its oxide still has certain conductivity. So it is considered to be the most promising alternative to indium tin oxide for the next generation of flexible transparent conductive materials. This paper introduces the related theory of transparent conductive film and preparation methods, as well as the research progress of silver nanowires based transparent conductive films, and prospects the future development.
引文
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[2]Kang Saewon,Kim Taehyo,Cho Seungse et al.Nano Lett[J],2015,15(12):7933
[3]Lee Phillip,Ham Jooyeun,Lee Jinhwan et al.Advanced Functional Materials[J],2014,24(36):5671
[4]Lagrange Mélanie,Langley Daniel P,Giusti Ga?l et al.Nanoscale[J],2015,7(41):17 410
[5]Sorel Sophie,Lyons Philip E,De Sukanta et al.Nanotechnology[J],2012,23(18):185 201
[6]Chang Junghao,Chiang Kaiming,Kang Haowei et al.Nanoscale[J],2015,7(10):4572
[7]Jia Yonggao,Chen Chao,Jia Dan et al.ACS Appl Mater Interfaces[J],2016,8:9865
[8]Liang Jiajie,Li Lu,Tong Kwing et al.ACS Nano[J],2014,8(2):1590
[9]Leem Dong Seok,Edwards Angharad,Faist Mark et al.Adv Mater[J],2011,23(38):4371
[10]Lee Jung Yong,Connor Stephen T,Cui Yi et al.Nano Lett[J],2008,8(2):689
[11]Madaria Anuj R,Kumar Akshay,Zhou Chongwu.Nanotechnology[J],2011,22(24):245 201
[12]Sachse Christoph,Meskamp Lars Müller,Bormann Ludwig et al.Organic Electronics[J],2013,14(1):143
[13]Heo Soo Won,Lee Jang Yong,Song Ho Jun et al.Solar Energy Materials&Solar Cells[J],2011,95(11):3041
[14]Chiang Kaiming,Huang Zhengyu,Tsai Weilun et al.Organic Electronics[J],2017,43:15
[15]Jia Yonggao,Chen Chao,Jia Dan et al.ACS Appl Mater Interfaces[J],2016,8(15):9865
[16]Chen Youxin,Lan Wei,Wang Junya et al.Physica E[J],2016,76:88
[17]Chen S,Song L,Tao Z et al.Organic Electronics[J],2014,15(12):3654
[18]Xia Xingda,Yang Bingchu,Zhang Xiang et al.Mater Res Express[J],2015,2(7):075 009
[19]Kang Hong Suk,Choi Jaeho,Cho Wonhee et al.Mater Chem C[J],2016,4(41):9834
[20]Wang Jun,Jiu Jinting,Teppei Araki et al.Nano-Micro Lett[J],2015,7(1):51
[21]Xu Wei,Xu Qingsong,Huang Qijin et al.Journal of Materials Science&Technology[J],2016,32(2):158
[22]Madaria Anuj R,Kumar Akshay,Ishikawa Fumiaki N et al.Nano Res[J],2010,3(8):564
[23]Miao Jinlei,Liu Haihui,Li Wei et al.Langmuir[J],2016,32(21):5365
[24]Liu Ping(刘萍),Zeng Baoqing(曾葆青),Wang Yaxiong(王亚雄)et al.Materials Review A:Review(材料导报A:综述篇)[J],2017,31(4):6
[25]Pu Danfeng,Zhou Weixin,Chen Jun et al.RSC Adv[J],2015,5(122):100 725
[26]Lim Jong Wook,Cho Dayoung,Kim Jihoon et al.Solar Energy Materials&Solar Cells[J],2012,107(8):348
[27]Kang Sin Bi,Noh Yongjin,Na Seokin et al.Solar Energy Materials&Solar Cells[J],2014,122(3):152
[28]Finn David J,Lotya Mustafa,Coleman Jonathan N.ACS Appl Mater Interfaces[J],2015,7(17):9254
[29]Jiang Yaqiu,Xi Jun,Wu Zhaoxin et al.Langmuir[J],2015,31(17):4950
[30]Li Zhiling(李志凌).Thesis for Master Degree(硕士论文)[D].Chengdu:University of Electronic Science and Technology,2016
[31]Araki Teppei,Jiu Jinting,Nogi Masaya et al.Nano Res[J],2014,7(2):236
[32]Bergin Stephen M,Chen Yuhui,Rathmell Aaron R et al.Nanoscale[J],2012,4(6):1996
[33]Ahn Kwangguk,Kim Dongjae,Kim Onyu et al.Coat Technol Res[J],2015,12(5):855
[34]Leem Dong Seok,Edwards Angharad,Faist Mark et al.Adv Mater[J],2011,23(38):4371
[35]Zhang Chengpeng,Zhu Yuwen,Yi Peiyun et al.Micromech Microeng[J],2017,27(7):075 010
[36]Bid Aveek,Bora Achyut,Raychaudhuri A K et al.Physical Review B[J],2006,74(3):035 426
[37]Sorel Sophie,Lyons Philip E,De Sukanta et al.Nanotechnology[J],2012,23(18):185 201
[38]Hecht David,Hu Liangbing,Grüner George et al.Appl Phys Lett[J],2006,89(13):425
[39]Zhang Bo,Liu Danmin,Liang Yuntian et al.Materials Letters[J],2017,201:50
[40]Wang Jun,Jiu Jinting,Araki Teppei et al.Nano Micro Lett[J],2015,7(1):51
[41]Tokuno Takehiro,Nogi Masaya,Karakawa Makoto et al.Nano Res[J],2011,4(12):1215
[42]Jiu Jinting,Sugahara Tohru,Nogi Masaya et al.Nanoscale[J],2013,5(23):11 820
[43]Kim Sunho,Jeon Hak Rim,An Cheehong et al.Materials Letters[J],2017,193:63
[44]Tang Xingming,Xu Hongbo,Liu Ximing et al.International Conference on Electronic Packaging Technology[J],2016,17:1293
[45]Lee JuHyun,Shin HyunSu,Noh YongJin et al.Solar Energy Materials&Solar Cells[J],2013,114:15
[46]Sohn Hiesang,Woo Yun Sung,Shin Weonho et al.Applied Surface Science[J],2017,419:63
[47]Jing Maoxiang,Han Chong,Li Min et al.Nanoscale Research Letters[J],2014,9(1):588
[48]Huang Qijin,Shen Wenfeng,Fang Xingzhong et al.ACS Appl Mater Interfaces[J],2015,7(7):4299
[49]Liu Yang,Chen Yingying,Shi Rui et al.RSC Adv[J],2017,7(9):4891
[50]Lee Jinhwan,Lee Phillip,Lee Hyungman et al.Nanoscale[J],2012,4(20):6408