LTCC丝网印刷细微线条技术研究
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摘要
目前,LTCC基板已应用于高速、高密度的SiP模块中,对LTCC基板的细微线条制作工艺提出了更高的要求。主要从丝网网版制作、浆料黏度、网版间隙、刮板压力、刮板速度,以及刮板移动方向等方面出发,分别研究了这些因素对细微线条制作工艺及精度的影响,从而为实际生产提供指导作用,最终提升LTCC基板制造平台的工艺技术水平。
At present, LTCC substrates have been used in high-speed and high-density SiP modules, which put forward higher requirements for the fine line fabrication process of LTCC substrates. From screen plate making, paste viscosity, the clearance between the screen and substrate, squeegee pressure, squeegee speed and squeegee moving direction, the effects of these factors on the manufacturing process and accuracy of fine lines are studied respectively, so as to provide guidance for actual production and ultimately promote the technological level of LTCC substrate manufacturing platform.
At present, LTCC substrates have been used in high-speed and high-density SiP modules, which put forward higher requirements for the fine line fabrication process of LTCC substrates. From screen plate making, paste viscosity, the clearance between the screen and substrate, squeegee pressure, squeegee speed and squeegee moving direction, the effects of these factors on the manufacturing process and accuracy of fine lines are studied respectively, so as to provide guidance for actual production and ultimately promote the technological level of LTCC substrate manufacturing platform.
引文
[1]秦跃利,王春富,李彦睿,等.陶瓷穿孔三维互连(TCV)技术研究[J].电子工艺技术,2017,2:71-73.
[2]梁彤翔,孙文珍,王立铎,等.表面张力与丝网印刷精度[J]科学通报,1996,41:1721-1725.
[3]Chang C R,Jean J H.Crystallization Kinetics and Mechanism of Low Dielectric,Low Temperature,Cofirable Cao-B2O3-Sio2 Glass Ceramics[J].Journal of the American Ceramic Society,1999,82:17-25.
[4]谢廉忠.微波组件用带腔体LTCC基板制造技术[J].现代雷达,2006,28(6):66-68,72.
[2]梁彤翔,孙文珍,王立铎,等.表面张力与丝网印刷精度[J]科学通报,1996,41:1721-1725.
[3]Chang C R,Jean J H.Crystallization Kinetics and Mechanism of Low Dielectric,Low Temperature,Cofirable Cao-B2O3-Sio2 Glass Ceramics[J].Journal of the American Ceramic Society,1999,82:17-25.
[4]谢廉忠.微波组件用带腔体LTCC基板制造技术[J].现代雷达,2006,28(6):66-68,72.