变压器绝缘纸热阻特性的理论分析与实验研究
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摘要
利用双热流计法设计实验,在同一温度下对不同厚度绝缘纸的热阻进行测量,得到关于单位面积热阻与厚度的关系,通过对实验数据的分析实现接触热阻和体热阻的分离,以求得该温度下绝缘纸的导热系数和接触热阻。由AFM表面微观形貌图对每个热流通道的接触分热阻建立锥截体模型,并选用Hertz弹性模型描述接触表面的弹性形变,再利用高斯分布求得表面凸起的接触概率,即可求得表面接触热阻的大小,实验结果表明,绝缘纸的平均导热系数为0. 069 8W/(m·K),绝缘纸与紫铜间面积接触热阻为0. 002 67m~2K/W,接触热阻的数值计算值为0. 002 45 m~2K/W。绝缘纸与紫铜间面积接触热阻的实验值与数值分析结果的相对偏差为8. 98%。
Using double heat flow meter method design experiment,measuring thermal resistance of different thickness insulating paper at the same temperature,the relationship between the thermal resistance and the thickness of the insulating material per unit area was obtained. Realize the separation of thermal contact resistance and thermal body resistance through the analysis of experimental data,so as to obtain the thermal conductivity and thermal contact resistance of the insulating paper at this temperature. The frustum model is established for each heat channel using AFM micro surface map,and use Hertz model to describe the elastic deformation of the contact surface,the contact probability distribution obtained by Gauss surface distribution,then solve the surface thermal contact resistance's value. The experimental results show that the average thermal conductivity of insulating paper is 0. 069 8 W/( m·K),and the thermal contact resistance between insulating paper and copper is 0. 002 67 m~2 K/W,and the numerical value of contact resistance is 0. 002 45 m~2 K/W. The relative deviation between the experimental value and the calculated value is 8. 98%.
Using double heat flow meter method design experiment,measuring thermal resistance of different thickness insulating paper at the same temperature,the relationship between the thermal resistance and the thickness of the insulating material per unit area was obtained. Realize the separation of thermal contact resistance and thermal body resistance through the analysis of experimental data,so as to obtain the thermal conductivity and thermal contact resistance of the insulating paper at this temperature. The frustum model is established for each heat channel using AFM micro surface map,and use Hertz model to describe the elastic deformation of the contact surface,the contact probability distribution obtained by Gauss surface distribution,then solve the surface thermal contact resistance's value. The experimental results show that the average thermal conductivity of insulating paper is 0. 069 8 W/( m·K),and the thermal contact resistance between insulating paper and copper is 0. 002 67 m~2 K/W,and the numerical value of contact resistance is 0. 002 45 m~2 K/W. The relative deviation between the experimental value and the calculated value is 8. 98%.
引文
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[4]TYLAVSKY D,MAO X,MCCULLA G A.Transformer thermal modeling:Improving reliability using data quality control[J].IEEE Transactions on Power Delivery,2006,21(3):1357-1366.
[5]GHAREH M,SEPAHI L.Thermal modeling of drytransformers and estimating temperature rise[J].World Academy of Science Engineering and Technology,2008(45):290-292.
[6]TAPAN K,PURKAIT S P.Investigations of temperature effects on the dielectric response measurements of transformer oil-paper insulation system[J].IEEETransactions on Power Delivery,2008,23(1):252-260.
[7]RADAKOVIC Z R,SORGIC M S.Basics of detailed thermal-hydraulic model for thermal design of oil power transformers[J].IEEE Transactions on Power Delivery,2010,25(2):790-802.
[8]王丰华,周翔,高沛,等.基于绕组热分布的改进油浸式变压器绕组热点温度计算模型[J].高电压技术,2015,41(3):895-901.
[9]SAHA T K,DARVENIZA M,YAO Z T,et al.Investigating the effects of oxidation and thermal degradation on electrical and chemical properties of power transformers insulation[J].IEEE Transactions on Power Delivery,1999,14(4):1359-1367.
[10]杨世铭,陶文铨.传热学[M].第3版.北京:高等教育出版社,1998:3382.
[11]YANG J,WALTERMIRE S,CHEN Y,et al.Contact thermal resistance between individual multiwall carbon nanotubes[J].Applied Physics Letters,2011,96(2):630.
[12]YOVANOVICH M M.Four decades of research on thermal contact,gap,and joint resistance in microelectronics[J].IEEE Transactions on Components&Packaging Technologies,2005,28(2):182-206.
[13]THOMPSON,KATHRYN M.A multi-scale iterative approach for finite element modeling of thermal contact resistance[J].Massachusetts Institute of Technology,2007:1-99.
[14]黄志华,韩玉阁.用接触分热阻讨论接触热阻问题[J].上海交通大学学报,2001,35(8):1212-1215.
[15]JOHNSON K L.接触力学[M].北京:高等教育出版社,1992:96-119.
[16]SURHONE L M,TIMPLEDON M T,MARSEKEN SF.Thermal Contact Conductance[M].Berlin:Springer International Publishing,2014.
[17]赵剑锋,王安良,杨春信.接触传热表面粗糙度曲线的统计特征[J].低温工程,2003(4):49-56.