高压CO_2流体环境电沉积镍的电场和流场分析
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摘要
在高压CO_2流体环境条件下,以具有深宽比的MEMS非硅微结构区域为研究对象,利用Matlab软件对电沉积镍过程中的电场和流场进行数值分析。结果表明,深宽比对微结构入口处电场电力线弯曲程度和稠密度有影响,导致入口处的电流密度分布不均,使得微结构中央电力线的密度与其边界处电力线密度的差异变大;具有深宽比结构的微器件,高压CO_2流体环境可以提高镍离子的传质速度,进而改善镍离子的扩散传质能力。
Under the condition of high pressure CO_2 fluid environment,the microstructure region of MEMS non-silicon with depth/width(h/d) ratio was investigated.The electric field and flow field in the process of electrodepositing nickel were analyzed by Matlab software.The results show that the h/d ratio has an effect on the bending degree and density of electric field lines,resulting in uneven distribution of current density at the entrance of the microstructure,then the difference of the density of electric field lines between the center and boundary of microstructure increases.For the h/d ratio micro device,the high pressure CO_2 fluid environment can increase the mass transfer speed of nickel ions,then the diffusion mass transfer ability of the nickel ions improved.
Under the condition of high pressure CO_2 fluid environment,the microstructure region of MEMS non-silicon with depth/width(h/d) ratio was investigated.The electric field and flow field in the process of electrodepositing nickel were analyzed by Matlab software.The results show that the h/d ratio has an effect on the bending degree and density of electric field lines,resulting in uneven distribution of current density at the entrance of the microstructure,then the difference of the density of electric field lines between the center and boundary of microstructure increases.For the h/d ratio micro device,the high pressure CO_2 fluid environment can increase the mass transfer speed of nickel ions,then the diffusion mass transfer ability of the nickel ions improved.
引文
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[2]Luo J K,Chu D P,Flewit A T,et al.Uniformity control of Ni thin-film microstructures deposited by though-mask plating[J].Journal of the Electrochemical Society,2005,152(1):C36-C41.
[3]Siwach T,Masahiro O.Environmentally benign electroless nickel plating using supercritical carbon-dioxide on hydrophilically modified acrylonitrile-butadiene-styrene[J].Applied Surface Science,2014,311:189-200.
[4]吴凯.金属镍及镍钴合金在高压CO2/表面活性剂/电镀液微乳液体系中的电沉积[D].上海:上海大学,2016.
[5]孟庆波,齐海东,卢帅,等.脉冲电镀Ni-Sn-Mn合金镀层工艺参数优化及耐蚀性[J].金属热处理,2018,43(6):142-148.Meng Qingbo,Qi Haidong,Lu Shuai,et al.Process parameter optimization and corrosion resistance of Ni-Sn-Mn alloy coating prepared by pulse electroplating[J].Heat Treatment of Metals,2018,43(6):142-148.
[6]戴玉明,张振忠,巴志新,等.脉冲电沉积时间对纳米晶镍镀层微观结构和性能的影响[J].金属热处理,2009,34(10):38-41.Dai Yuming,Zhang Zhenzhong,Ba Zhixin,et al.Influences of pulse electrodeposition time on microstructure and performance of nanocrystalline nickel plating[J].Heat Treatment of Metals,2009,34(10):38-41.
[7]岳彪,秦宗慧.双层微齿轮型腔镶块电铸均匀性Ansys模拟与优化[J].表面技术,2014,43(4):52-58.Yue Biao,Qin Zonghui,Ansys simulation and optimization of electroforming uniformity of double micro gear insert block[J].Surface Technology,2014,43(4):52-58.
[8]陈晖,汪红,李光杨,等.水平与垂直流动对微电铸镀层均匀性的影响[J].传感器与微系统,2011,30(6):20-23.Chen Hui,Wang Hong,Li Guangyang,et al.Influence of horizontal and vertical flow pattern on coating uniformity inside micro-structures during electrodeposition[J].Transducer and Microsystem Technologies,2011,30(6):20-23.