超声波作用下Cu/Sn固-液界面IMCs层的形成与演变
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摘要
利用超声波辅助钎焊工艺方法对Cu/Sn/Cu结构进行钎焊实验,研究超声波辅助作用下Cu/Sn固-液界面金属间化合物(IMCs)的形成与演变过程。结果表明:无超声作用时界面处Cu-Sn金属间化合物形貌逐渐由平直状转变为凹凸的扇贝状,其中Cu_6Sn_5的形成主要受扩散控制,而Cu_3Sn层的形成则是由反应控制。施加超声波后,通过观察不同超声条件下Cu-Sn金属间化合物形貌的微观结构演变,提出破碎-溶解模型。通过改变超声时间来控制界面Cu-Sn金属间化合物的厚度,从而改善钎焊接头性能。
The Cu/Sn/Cu structure was brazed by ultrasonic assisted soldering. The formation and evolution of Cu-Sn intermetallic compounds(IMCs) by ultrasonic assisted soldering process were investigated. The results indicate that the morphologies of interfacial Cu-Sn intermetallic compounds(IMCs) are gradually transformed from planar shape to scallop-like shape without ultrasonic, in which the formation mechanism of Cu_6 Sn_5 is mainly controlled by diffusion, and the formation mechanism of Cu_3 Sn layer is controlled by the reaction. After applying ultrasonic, a crush-dissolution model is proposed by observing the evolution of the microstructure of Cu-Sn intermetallic compounds with different ultrasonic conditions. The thickness of the interfacial Cu-Sn intermetallic compounds is controlled by changing the ultrasonic time, which will improve the performance of the brazed joint.
The Cu/Sn/Cu structure was brazed by ultrasonic assisted soldering. The formation and evolution of Cu-Sn intermetallic compounds(IMCs) by ultrasonic assisted soldering process were investigated. The results indicate that the morphologies of interfacial Cu-Sn intermetallic compounds(IMCs) are gradually transformed from planar shape to scallop-like shape without ultrasonic, in which the formation mechanism of Cu_6 Sn_5 is mainly controlled by diffusion, and the formation mechanism of Cu_3 Sn layer is controlled by the reaction. After applying ultrasonic, a crush-dissolution model is proposed by observing the evolution of the microstructure of Cu-Sn intermetallic compounds with different ultrasonic conditions. The thickness of the interfacial Cu-Sn intermetallic compounds is controlled by changing the ultrasonic time, which will improve the performance of the brazed joint.
引文
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[23]ZHANG Hui-wen,CUI Wei,HE Jing-shan,YAN Jiu-chun,YANG Shi-qin.Formation and evolution of intermetallic compounds at interfaces of Cu/Al joints by ultrasonicassisted soldering[J].Journal of Materials Processing Technology,2015,223:1-7.
[24]LUAN Tian-min,GUO Wei-bing,YANG Sheng-hua,MAZhi-ping,HE Jing-shan,YAN Jiu-chun.Corrigendum to“Effect of intermetallic compounds on mechanical properties of copper joints ultrasonic-soldered with Sn-Zn alloy”[J].Mater.Process.Technol.248(2017)123-129][J].Journal of Materials Processing Technology,2018,251:93-94.
[25]MA Zhi-ping,ZHAO Wei-wei,YAN Jiu-chun,LI Da-cheng.Interfacial reaction of intermetallic compounds of ultrasonicassisted brazed joints between dissimilar alloys of Ti6Al4Vand Al4Cu1Mg[J].Ultrasonics Sonochemistry,2011,18(5):1062-1067.
[26]JI Hong-jun,QIAO Yun-fei,LI Ming-yu.Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn-0.7Cu solder for high temperature packaging application[J].Scripta Materialia,2015,110:19-23.
[2]胡永达,李元勋,杨邦朝.微电子封装技术[M].科学出版社,2015.HU Yong-da,LI Yuan-xun,YANG Bang-chao.Microelectronic packaging technology[M].Science Press,2015.
[3]FAN X,RANOUTA A,DHIMAN H.Effects of package level structure and material properties on solder joint reliability under impact loading[J].IEEE Transactions on Components Packaging&Manufacturing Technology,2013,3(1):52-60.
[4]鞠国魁,韦习成,孙鹏,刘建影.界面金属间化合物对铜基Sn-3.0Ag-0.5Cu焊点拉伸断裂性能的影响[J].中国有色金属学报,2007,17(12):1936-1942.JU Guo-kui,WEI Xi-cheng,SUN Peng,LIU Jian-ying.Effects of interfacial IMC on tensile fracture behavior of Sn-0.3Ag-0.5Cu solder joints on copper substrates[J].The Chinese Journal of Nonferrous Metals,2007,17(12):1936-1942.
[5]HANG C,TIAN Y,ZHANG R.YANG D.Phase transformation and grain orientation of Cu-Sn intermetallic compounds during low temperature bonding process.Journal of Materials Science Materials in Electronics,2013,24(10):3905-3913.
[6]柯常波,周敏波,张新平.Sn/Cu互连体系界面金属间化合物Cu6Sn5演化和生长动力学的相场法模拟[J].金属学报,2014,50(3):294-304.KE Chang-bo,ZHOU Min-bo,ZHANG Xin-ping.Phase field simulation on microstructure evolution and growth kinetics of Cu6Sn5 intermetallic compound during early interfacial reaction in Sn/Cu soldering system[J].Acta Metallurgica Sinica,2014,50(3):294-304.
[7]LI Yuan-xing,ZHAO Wei-wei,LENG Xue-song,FUQiu-jiao,WANG Lei,YAN Jiu-chun.Microstructure evolution and mechanical properties of ultrasonic-assisted soldering joints of 2024 aluminum alloys[J].Transaction of Nonferrous Metals of China,2011,21(9):1937-1943.
[8]LIU Yang,LI Hong-ying,JIANG Hao-fan,LU Xiao-chao.Effects of heat treatment on microstructure and mechanical properties of ZA27 alloy[J].Transaction of Nonferrous Metals of China,2013,23(3):642-649.
[9]HASANABADI M,SHAMSIPUR A,NAJAFI SANI H,OMIDVAR H,SAKHAEI S.Interfacial microstructure and mechanical properties of tungsten carbide brazed joints using Ag-Cu-Zn+Ni/Mn filler alloy[J].Transaction of Nonferrous Metals Society of China,2017,27(12):2638-2646.
[10]CHINNAM R K,FAUTEUX C,NEUENSC-WANDER J,JANCZAK-RUSCH J.Evolution of the microstructure of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidification[J].Acta Materialia,2011,59(4):1474-1481.
[11]XIAO Yong,JI Hong-jun,LI Ming-yu,KIM Jong-myung.Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal[J].Materials&Design,2013,52(24):740-747.
[12]LIU J,ZHAO H,LI Z,SONG X,DONG H,ZHAO Y,FENGJ.Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonicassisted transient liquid phase soldering[J].Journal of Alloys&Compounds,2017,692:552-557.
[13]JI Hong-jun,HAO Chen,LI Ming-yu.Effect of ultrasonic transmission rate on microstructure and properties of the ultrasonic-assisted brazing of Cu to alumina[J].Ultrasonics Sonochemistry,2017,34:491-495.
[14]KWAK B H,JEONG M H,KIM J W,LEE B,LEE H J,PARK Y B.Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bump[J].Microelectronic Engineering,2012,89(1):65-69.
[15]刘积厚,赵洪运,李卓霖,宋晓国,董红杰,赵一璇,冯吉才.Cu/Sn/Cu超声-TLP接头的显微组织与力学性能[J].金属学报,2017(2):227-232.LIU Ji-hou,ZHAO Hong-yun,LI Zhuo-lin,SONG Xiao-guo,DONG Hong-jie,ZHAO Yi-xuan,FENG Ji-cai.Microstructures and mechanical properties of Cu/Sn/Cu structure ultrasonic-TLP joint[J].Acta Metallurgica Sinica,2017(2):227-232.
[16]PARK M S,ARROYAVE R.Formation and growth of intermetallic compound Cu6Sn5,at early stages in lead-free soldering[J].Journal of Electronic Materials,2010,39(12):2574-2582.
[17]周敏波,马骁,张新平.BGA结构Sn-3.0Ag-0.5Cu/Cu焊点低温回流时界面反应和IMC生长行为[J].金属学报,2013,49(3):341-350.ZHOU Min-bo,MA Xiao,ZHANG Xin-ping.The interfacial reaction and intermetallic compound growth behavior of BGA structure Sn-3.0Ag-0.5Cu/Cu solder joint at low reflow temperatures[J].Acta Metallurgica Sinica,2013,49(3):341-350.
[18]LEE B J,NONG M H,LEE H M.Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation[J].Acta Materialia,1997,45(5):1867-1874.
[19]MA D,WANG W D,LAHIRI S K.Scallop formation and dissolution of Cu-Sn intermetallic compound during solder reflow[J].Journal of Applied Physics,2002,91(5):3312-3317.
[20]SHANG P J,LIU Z Q,PANG X Y,LI D X,SHANG J K.Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates[J].Acta Materialia,2009,57(16):4697-4706.
[21]VIROT M,CHAVE T,NIKITENKO S I,SHCHUKIN D G,ZEMB T,M?HWALD H.Acoustic cavitation at the water-glass interface[J].Journal of Physical Chemistry C,2010,114(30):13083-13091.
[22]LI Yuan-xing,LENG Xue-song,CHENG Sheng,YANJiu-chun.Microstructure design and dissolution behavior between 2024 Al/Sn with the ultrasonic-associated soldering[J].Materials&Design,2012,40:427-432.
[23]ZHANG Hui-wen,CUI Wei,HE Jing-shan,YAN Jiu-chun,YANG Shi-qin.Formation and evolution of intermetallic compounds at interfaces of Cu/Al joints by ultrasonicassisted soldering[J].Journal of Materials Processing Technology,2015,223:1-7.
[24]LUAN Tian-min,GUO Wei-bing,YANG Sheng-hua,MAZhi-ping,HE Jing-shan,YAN Jiu-chun.Corrigendum to“Effect of intermetallic compounds on mechanical properties of copper joints ultrasonic-soldered with Sn-Zn alloy”[J].Mater.Process.Technol.248(2017)123-129][J].Journal of Materials Processing Technology,2018,251:93-94.
[25]MA Zhi-ping,ZHAO Wei-wei,YAN Jiu-chun,LI Da-cheng.Interfacial reaction of intermetallic compounds of ultrasonicassisted brazed joints between dissimilar alloys of Ti6Al4Vand Al4Cu1Mg[J].Ultrasonics Sonochemistry,2011,18(5):1062-1067.
[26]JI Hong-jun,QIAO Yun-fei,LI Ming-yu.Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn-0.7Cu solder for high temperature packaging application[J].Scripta Materialia,2015,110:19-23.