基于深度学习优化SSD算法的硅片隐裂检测识别
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  • 英文篇名:Detect and Recognize Hidden Cracks in Silicon Chips Based on Deep Learning SSD Algorithm
  • 作者:田晓杰 ; 程耀瑜 ; 常国立
  • 英文作者:TIAN Xiaojie;CHENG Yaoyu;CHANG Guoli;Information and Communication Engineering,North University of China;
  • 关键词:隐裂检测 ; SSD ; 纹理滤波 ; 状态向量 ; 密集连接卷积网络
  • 英文关键词:Hidden crack detection;;Single shot multibox detector;;Texture filtering;;State vector machine(SVM);;Dense Net
  • 中文刊名:JCYY
  • 英文刊名:Machine Tool & Hydraulics
  • 机构:中北大学信息与通信工程学院;
  • 出版日期:2019-01-15
  • 出版单位:机床与液压
  • 年:2019
  • 期:v.47;No.475
  • 语种:中文;
  • 页:JCYY201901009
  • 页数:6
  • CN:01
  • ISSN:44-1259/TH
  • 分类号:44-48+68
摘要
针对传统的通过机器视觉和机器学习算法检测识别硅片隐裂所存在的精度低、识别率差、检测耗时长的问题,提出一种新的检测方法,即采用优化的单个深度神经网络来检测图像中的目标的方法 (Single Shot MultiBox Detector,SSD),对SSD的特征提取网络融合了密集连接卷积网络(Densely Connected Convolutional Networks,Dense Net),解决了原网络对低于0. 1 mm的裂痕提取困难的缺点。通过实验,优化后的SSD检测算法对低于0. 01 mm裂纹检测精度比传统的通过纹理滤波和SVM分类检测算法提高了22%,比没有优化的SSD算法检测准确率提高了6%。证明了本文作者所提方法的有效性。
        By machine vision and machine learning algorithms for traditional low existed in the recognition of the wafer cracked detection precision,the recognition rate is poor,and testing takes a long time of problem,a new detection method was proposed. The optimized neural network to detect targets in the images of the single depth method of single shot multi Box detector( SSD),feature extraction of SSD combined with dense connectivity convolution network( Dense Net),the defection difficulty of extracting crack of less than 0. 1 mm was solved in the original network. Through the experiment,the optimized SSD detection algorithm improved the detection accuracy of crack under 0. 01 mm by 22% as compared with the traditional texture filtering and state vector machine( SVM) classification detection algorithm. The detection accuracy is 6% higher than the non-optimized SSD algorithm. The validity of this method is proved.
引文
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