不同槽型结构挠性基板对光纤应力应变的影响
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摘要
为分析层压过程中不同槽型结构挠性基板对光纤应力应变的影响,采用COMSOL软件对光纤埋入不同槽型(U形、梯形、矩形)挠性基板的层压工艺进行仿真,分析槽型结构尺寸对光纤偏移量的影响,得到最优槽型结构。仿真结果表明,光纤埋入矩形槽挠性基板可降低光纤在层压过程产生的偏移量,且最优的矩形槽槽型结构的宽度与深度分别为125、145μm,此时光纤最大应力和最大偏移量分别为19.89 MPa、2.0403μm。
In order to analyze the influence of different grooved structure flexible substrates on the stress and strain of the fiber under the lamination process, the COMSOL software was used to simulate the lamination process of the fiber embedded in different groove type(U-shaped, trapezoidal, rectangular) flexible substrates. The influence of the size of the structure on the fiber offset gives the optimal slot structure. The results show that the fiber embedded in the rectangular groove flexible substrate can reduce the offset of the fiber during the lamination process, and the width and depth of the optimal rectangular slot structure are 125 and 145 μm, respectively. The maximum stress and maximum offset of the fiber at this time are 19.89 MPa and 2.0403 μm, respectively.
In order to analyze the influence of different grooved structure flexible substrates on the stress and strain of the fiber under the lamination process, the COMSOL software was used to simulate the lamination process of the fiber embedded in different groove type(U-shaped, trapezoidal, rectangular) flexible substrates. The influence of the size of the structure on the fiber offset gives the optimal slot structure. The results show that the fiber embedded in the rectangular groove flexible substrate can reduce the offset of the fiber during the lamination process, and the width and depth of the optimal rectangular slot structure are 125 and 145 μm, respectively. The maximum stress and maximum offset of the fiber at this time are 19.89 MPa and 2.0403 μm, respectively.
引文
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[2] ZHOU Dejian,CHENG Lei.The domestic and international research situation of photoelectric interconnection technology[J].Advanced Materials Research,2013(760):383-387.
[3] 吴松,黄春跃,梁颖,等.热循环加载条件下焊点形态参数对板级光互连模块对准偏移影响分析[J].电子学报,2015,43(6):1179-1184.
[4] 成磊,周德俭,吴兆华.光电互联PCB热循环可靠性研究[J].机械强度,2017,39(4):904-908.
[5] 陈建.用于PCB光互连的聚合物光波导垂直耦合器的研究[D].成都:电子科技大学,2016,17(7):10-13.
[6] HSU S H,TSOU C Y,WANG C M,et al.10 Gb/s optical interconnection on flexible optical waveguide in electronic printed circuit board[J].Optics &Photonics Journal,2013,3(2B):252-255.
[7] SHI F S,BAMIEDAKIS N,VASIL′EV P P,et al.Flexible multimode polymer waveguide arrays for versatile high-speed short-reach communication links[J].Journal of Lightwave Technology,2018,6(99):11-13.
[8] 成磊,周德俭,吴兆华.基于断裂机理的板级电路光纤埋入结构设计[J].机械工程学报,2016,52(9):158-164.
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