铜/铝复合板界面化合物生长规律和导热性能
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摘要
利用热处理工艺模拟实际服役工况,通过扫描电镜(SEM)、EBSD和XRD分析铜/铝复合板经不同热处理温度和时间后,结合界面处金属间化合物(IMCs)的组成、结构和生长规律,建立生长模型,并测定铜/铝复合板的热扩散系数,研究铜/铝复合板界面组织结构特征与导热性能之间的关系。结果表明:IMCs层厚度随热处理温度和时间的增加而增加;热处理温度超过500℃时,界面层出现Al_4Cu_9、AlCu、Al_2Cu_3和Al_2Cu_4种IMCs;界面IMCs厚度与时间呈幂函数关系,各层生长速率与温度之间满足Arrhenius关系;随着IMCs厚度的增加,铜/铝复合板的热扩散系数下降,导热性能下降。同时,研究结果为优化铜/铝复合板制备工艺和建立应用准则提供理论基础和科学依据。
The actual service conditions were simulated by different heat treatment processes. The interfacial intermetallic compounds(IMCs) component, structure and growth law were investigated by scanning electron microscopy(SEM), EBSD and X-Ray diffraction, and the growth model was established. The thermal diffusivity α was measured and the relationship between interfacial structure characteristics and thermal conductivity of Cu/Al composite sheet was studied. The results indicate that the IMCs are Al_4Cu_9, AlCu, Al_2Cu_3 and Al_2Cu during above 500 ℃ treatment.The interfacial layer width increases with the increase of the hot treatment temperature and time. The interfacial thickness and annealing time follow the power function relation, the growth rates of the intermetallic phase layers and annealing temperature comply with the Arrhenius relation. With the total thickness of the interfacial IMCs increasing during annealing, the thermal diffusivity of Cu/Al composite decreases. The results provide the theoretical and scientific basis for the optimizing of the preparation process of Cu/Al composite sheet and establishing the application criteria.
The actual service conditions were simulated by different heat treatment processes. The interfacial intermetallic compounds(IMCs) component, structure and growth law were investigated by scanning electron microscopy(SEM), EBSD and X-Ray diffraction, and the growth model was established. The thermal diffusivity α was measured and the relationship between interfacial structure characteristics and thermal conductivity of Cu/Al composite sheet was studied. The results indicate that the IMCs are Al_4Cu_9, AlCu, Al_2Cu_3 and Al_2Cu during above 500 ℃ treatment.The interfacial layer width increases with the increase of the hot treatment temperature and time. The interfacial thickness and annealing time follow the power function relation, the growth rates of the intermetallic phase layers and annealing temperature comply with the Arrhenius relation. With the total thickness of the interfacial IMCs increasing during annealing, the thermal diffusivity of Cu/Al composite decreases. The results provide the theoretical and scientific basis for the optimizing of the preparation process of Cu/Al composite sheet and establishing the application criteria.
引文
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[14]AMANI H,SOLTANIEH M.Intermetallic phase formation in explosively welded Al/Cu bimetals[J].Metallurgical&Materials Transactions B,2016,47(4):2524-2534.
[15]CHEN C Y,HWANG W S.Effect of annealing on the interfacial structure of aluminum-copper joints[J].Materials Transactions,2007,48(7):1938-1947.
[16]XU H,LIU C,SILBERSCHMIDT V V,PRAMANA S S,WHITE T J,CHEN Z,ACOFF V L.Behavior of aluminum oxide,intermetallics and voids in Cu-Al wire bonds[J].Acta Materialia,2011,59(14):5661-5673.
[17]张建宇,贲利华,初娣,吴春京.铜铝液相扩散结合的动力学分析[J].中国有色金属学报,2015,25(9):2478-2483.ZHANG Jian-yu,BEN Li-hua,CHU Di,WU Chun-jing.Kinetics analysis of liquid phase diffusion bonding between Cu and Al[J].The Chinese Journal of Nonferrous Metals,2015,25(9):2478-2483.
[18]PARKER W J,JENKINS R J,BUTLER C P,ABBOTT G L.Flash method of determining thermal diffusivity,heat capacity,and thermal conductivity[J].Journal of Applied Physics,1961,32(9):1679-1684.
[2]GUEYDAN A,DOMENGèS B,HUG E.Study of the intermetallic growth in copper-clad aluminum wires after thermal aging[J].Intermetallics,2014,50(7):34-42.
[3]李小兵,祖国胤,王平.退火温度对异步轧制铜/铝复合板界面组织及力学性能的影响[J].中国有色金属学报,2013,23(5):1202-1207.LI Xiao-bing,ZU Guo-yin,WANG Ping.Effect of annealing temperature on microstructure and mechanical properties of Cu/Al clad sheet fabricated by asymmetrical roll bonding[J].The Chinese Journal of Nonferrous Metals,2013,23(5):1202-1207.
[4]TAVASSOLI S,ABBASI M,TAHAVVORI R.Controlling of IMCs layers formation sequence,bond strength and electrical resistance in Al-Cu bimetal compound casting process[J].Materials&Design,2016,108:343-353.
[5]XU H,QIN I,CLAUBERG H,CHYLAK B,ACOFF V.New observation of nanoscale interfacial evolution in micro Cu-Al wire bonds by in-situ high resolution TEM study[J].Scripta Materialia,2016,115:1-5.
[6]张炳雷.铜铝双金属结构在大功率LED散热器中的性能研究[J].中国照明电器,2013(4):23-25.ZHANG Bing-lei.Study on the thermal performance of Al-Cu composite structure heat sink for high power LEDs[J].China Light&Lighting,2013(4):23-25.
[7]FUNAMIZU Y,WATANABE K.Interdiffusion in the Al-Cu system[J].Materials Transactions Jim,1971,12(3):147-152.
[8]KOUTERS M H M,GUBBELS G H M,FERREIRA O D S.Characterization of intermetallic compounds in Cu-Al ball bonds:Mechanical properties,interface delamination and thermal conductivity[J].Microelectronics Reliability,2013,53(8):1068-1075.
[9]LEE W B,BANG K S,JUNG S B.Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing[J].Journal of Alloys&Compounds,2005,390(1/2):212-219.
[10]KIM I K,SUN I H.Effect of heat treatment on the bending behavior of tri-layered Cu/Al/Cu composite plates[J].Materials&Design,2013,47(9):590-598.
[11]YUAN H U,CHEN Y Q,LI LI,HU H D.Microstructure and properties of Al/Cu bimetal in liquid-solid compound casting process[J].Transactions of Nonferrous Metals Society of China,2016,26(6):1555-1563.
[12]HUG E,BELLIDO N.Brittleness study of intermetallic(Cu,Al)layers in copper-clad aluminium thin wires[J].Materials Science&Engineering A,2011,528(22):7103-7106.
[13]GUO Y,LIU G,JIN H,SHI Z Q,QIAO G J.Intermetallic phase formation in diffusion-bonded Cu/Al laminates[J].Journal of Materials Science,2011,46(8):2467-2473.
[14]AMANI H,SOLTANIEH M.Intermetallic phase formation in explosively welded Al/Cu bimetals[J].Metallurgical&Materials Transactions B,2016,47(4):2524-2534.
[15]CHEN C Y,HWANG W S.Effect of annealing on the interfacial structure of aluminum-copper joints[J].Materials Transactions,2007,48(7):1938-1947.
[16]XU H,LIU C,SILBERSCHMIDT V V,PRAMANA S S,WHITE T J,CHEN Z,ACOFF V L.Behavior of aluminum oxide,intermetallics and voids in Cu-Al wire bonds[J].Acta Materialia,2011,59(14):5661-5673.
[17]张建宇,贲利华,初娣,吴春京.铜铝液相扩散结合的动力学分析[J].中国有色金属学报,2015,25(9):2478-2483.ZHANG Jian-yu,BEN Li-hua,CHU Di,WU Chun-jing.Kinetics analysis of liquid phase diffusion bonding between Cu and Al[J].The Chinese Journal of Nonferrous Metals,2015,25(9):2478-2483.
[18]PARKER W J,JENKINS R J,BUTLER C P,ABBOTT G L.Flash method of determining thermal diffusivity,heat capacity,and thermal conductivity[J].Journal of Applied Physics,1961,32(9):1679-1684.