基片偏压改变对镁合金Ti/TiN膜质量的影响
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摘要
目的探讨基片偏压对镁合金Ti/TiN膜层质量的影响。方法利用多弧离子镀技术,在不同偏压条件下,对镁合金先镀Ti再镀TiN,通过SEM观察膜层形貌,通过划痕测定膜基结合性能,通过电化学工作站对比AZ31镁合金与不同偏压镀膜试样的耐蚀性。结果偏压为200V时,TiN膜层致密均匀且成膜速度快,膜层耐蚀性最好;偏压为200V时,基体结合最好且膜层较厚,有较好的耐蚀性。结论镀Ti膜时的偏压对随后镀TiN的质量有着显著的影响,以200V偏压的工艺镀TiN膜层质量最好,膜层致密,成膜速度快,耐蚀性优良。
Objective To explore the effect of substrate bias on the quality of Ti / Ti N film. Methods Making use of the technology of multi-arc ion plating,magnesium alloy was plated with Ti followed by Ti N plating under different bias voltage. The morphology of films was observed by SEM,the adhesion of the film with substrate was investigated by scratch tester,and the corrosion resistance of film samples plated with different bias was compared to that of AZ31 magnesium alloy through electrochemical working station. Results When the bias voltage was 200 V,the Ti N film was uniform and compact,the velocity of film formation was quick,and the corrosion resistance of the film was the best. When the bias voltage was 200 V,the film had the strongest bonding with the substrate and considerable thickness,besides,the corrosion resistance was relatively high. Conclusion Bias voltage during Ti plating of film had significant impact on the quality of the subsequent Ti N plating,and the coating quality was the best when the bias voltage was 200 V,the resulting film was compact,the velocity of film formation was fast,and the film had excellent corrosion resistance.
Objective To explore the effect of substrate bias on the quality of Ti / Ti N film. Methods Making use of the technology of multi-arc ion plating,magnesium alloy was plated with Ti followed by Ti N plating under different bias voltage. The morphology of films was observed by SEM,the adhesion of the film with substrate was investigated by scratch tester,and the corrosion resistance of film samples plated with different bias was compared to that of AZ31 magnesium alloy through electrochemical working station. Results When the bias voltage was 200 V,the Ti N film was uniform and compact,the velocity of film formation was quick,and the corrosion resistance of the film was the best. When the bias voltage was 200 V,the film had the strongest bonding with the substrate and considerable thickness,besides,the corrosion resistance was relatively high. Conclusion Bias voltage during Ti plating of film had significant impact on the quality of the subsequent Ti N plating,and the coating quality was the best when the bias voltage was 200 V,the resulting film was compact,the velocity of film formation was fast,and the film had excellent corrosion resistance.
引文
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[2]王宾,叶宏,闫忠琳,等.镁合金表面铝涂层研究进展[J].表面技术,2010,39(1):85—88.WANG Bin,YE Hong,YAN Zhong-lin,et al.The Researches of Al Coating on Magnesium Alloys[J].Surface Technology,2010,39(1):85—88.
[3]石西昌,杨慧兰,肖湘,等.AZ31镁合金表面化学镀镍工艺研究[J].腐蚀科学与防护技术,2009,21(4):370—373.SHI Xi-chang,YANG Hui-lan,XIAO Xiang,et al.Electroless Nickel Plating on AZ31 Magnesium Alloy Surface[J].Corrosion Science and Protection Technology,2009,21(4):370—373.
[4]王洁,丁毅,徐蔚,等.AZ31镁合金表面磷化工艺研究[J].表面技术,2006,35(2):55—56.WANG Jie,DING Yi,XU Wei,et al.The Surface Phosphating Treatment of AZ31 Magnesium Alloys[J].Surface Technology,2006,35(2):55—56.
[5]王雪敏,曾小勤,吴国松,等.磁控溅射在镁合金表面处理中的应用[J].铸造技术,2006,27(4):412—414.WANG Xue-min,ZENG Xiao-qin,WU Guo-song,et al.Application of Magnetron Sputtering on Magnesium Alloys Surface Treatment[J].Foundry Technology,2006,27(4):412—414.
[6]吴敏,吴柏林,梁平.镁及其合金表面处理研究现状[J].表面技术,2005,34(5):13—15.WU Min,WU Bai-lin,LIANG Ping.Development of Surface Treatment for Magnesium Alloys[J].Surface Technology,2005,34(5):13—15.
[7]王宾.AZ31镁合金Al合金化层的制备与性能研究[D].重庆:重庆理工大学,2010.WANG Bin.Preparation and Performance Study of Al Alloying on AZ31 Mg Alloy[D].Chongqing:Chongqing University of Technology,2010.
[8]陈光华,杨今漫,谢二庆.电弧离子镀Ti N/Ti Al N薄膜的制备及高温退火研究[J].兰州大学学报(自然科学版),1998,34(3):44—47.CHENG Guang-hua,YANG Jin-man,XIE Er-qin.Study on Preparation of Ti N,Ti Al N by Arc Ion Plating and High Temperature Annealing[J].Journal of Lanzhou University(Natural Sciences),1998,34(3):44—47.
[9]张钧,赵彦辉.多弧离子镀技术与应用[M].北京:冶金工业出版社,2007.ZHANG Jun,ZHAO Yan-hui.Multi Arc Ion Plating Technique and Application[M].Beijing:Metallurgical Industry Press,2007.
[10]车德良,钟彬,苟伟,等.多弧离子镀沉积过程中等离子体参数对薄膜沉积的影响[J].真空,2006,43(2):5—8.CHE De-liang,ZHONG Bin,GOU Wei,et al.Effect of Plasma Parameters on Deposition of Thin Film in Multi Arc Ion Plating[J].Vacuum,2006,43(2):5—8.
[11]PELLEG J,ZEVIN LZ,LUNGO S,et al.Reactive-sputterDeposition Ti N Films on Glass Substrates[J].Thin Solid Films,1991,197:117—128.
[12]刘天伟,鲜晓斌,武胜,等.不同偏压下铀表面多弧离子镀Ti N薄膜性能研究[J].稀有金属材料工程,2006,35(9):1437—1440.LIU Tian-wei,XIAN Xiao-bin,WU Sheng,et al.Properties of Ti N Films on Uranium Surface by Arc Ion Plating under Different Bias Voltage[J].Rare Metal Materials and Engineering,2006,35(9):1437—1440.
[13]王福贞,马文存.气相沉积应用技术[M].北京:机械工业出版社,2007.WANG Fu-zhen,MA Wen-cun.Vapor Deposition application Technology[M].Beijing:China Machine Press,2007.
[14]华敏奇,袁振海.划痕实验对特殊薄膜系结合力的检测与评价[J].分析测试技术与仪器,2002,8(4):218—225.HUA Min-qi,YUAN Zhen-hai.Testing and Evaluation of the Scratch Test on the Binding Force of Special Film System[J].Analysis and Testing Technology and Instruments,2002,8(4):218—225.
[15]师昌绪,李恒德,周廉.材料科学与工程手册[M].北京,化学工业出版社,2004.SHI Chang-xu,LI Heng-de,ZHOU Lian.Materials Science and Engineering Handbook[M].Beijing:Chemical Industry Press,2004.