飞秒激光刻蚀FR-4覆铜板成形微细线路研究
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摘要
随着微电子技术飞速发展,电路板集成度的不断提高,产品研发周期的持续缩短,对于微细导电线路以及快速样板制作提出更迫切的需求。针对以上问题,本文采用飞秒激光进行覆铜板直接刻蚀的工艺研究,探索不同激光工艺参量(平均功率、扫描速度、扫描次数、离焦量、线间距)对刻蚀深度和底面粗糙度的影响规律。通过正交试验,探究各工艺参数对刻蚀深度和底面粗糙度的影响大小。结果表明:无论是以刻蚀深度还是以刻蚀粗糙度为加工质量的衡量指标,都是扫描次数的影响最大,扫描速度的影响最小。此外,通过综合平衡法得到最优工艺参数。利用飞秒激光冷加工和选择性刻蚀的特性,实现FR-4覆铜板表面线宽50μm、线间距20μm的微细线路高质量刻蚀加工。
With the rapid development of microelectronics,the integration of PCB keeps improving and the R&D period of the products continues shortening,leads to the increasingly urgent demands for micro conductive lines and rapid template production. To solve the above problems,a study on the direct etching of copper clad laminate by femtosecond laser is performed in this paper,the effect of femtosecond laser processing parameters(such as average power,scanning speed,scanning times,defocusing amount and line spa) on the laser processing quality of copper clad laminate are researched.The influence of processing parameters on etching depth and bottom roughness is explored through orthogonal test. The results shows that the influence of the scanning times is the greatest and the scanning speed is the smallest no matter the etching depth or the etching roughness is considered as the measure index. In addition,the optimum processing parameters are obtained by the comprehensive balance method. Finally conductive lines with a width of 50 μm and a line spacing of 20 μm are produced on FR-4 copper clad laminate with the cold processing and selective etching characteristics of femtosecond laser.
With the rapid development of microelectronics,the integration of PCB keeps improving and the R&D period of the products continues shortening,leads to the increasingly urgent demands for micro conductive lines and rapid template production. To solve the above problems,a study on the direct etching of copper clad laminate by femtosecond laser is performed in this paper,the effect of femtosecond laser processing parameters(such as average power,scanning speed,scanning times,defocusing amount and line spa) on the laser processing quality of copper clad laminate are researched.The influence of processing parameters on etching depth and bottom roughness is explored through orthogonal test. The results shows that the influence of the scanning times is the greatest and the scanning speed is the smallest no matter the etching depth or the etching roughness is considered as the measure index. In addition,the optimum processing parameters are obtained by the comprehensive balance method. Finally conductive lines with a width of 50 μm and a line spacing of 20 μm are produced on FR-4 copper clad laminate with the cold processing and selective etching characteristics of femtosecond laser.
引文
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[11] LING Lei,LOU Qihong,YE Zhenhuan,et al.Ablation of circuit board by pulsed UV laser[J].Chinese Journal of Lasers,2003,(10):953-955.(in Chinese)凌磊,楼祺洪,叶震寰,等.紫外激光刻蚀多层线路板初步研究[J].中国激光,2003,(10):953-955.
[12] Anisimov S I,Kapeliovich B L,Perelman T L.Electron emission from metal surfaces exposed to ultrashort laser pulses[J].Zhurnal Eksperimentalnoi I Teoreticheskoi Fiziki,1974,66(776):776-781.
[13] Chichkov BN,Momma C,Notes S,et al.Femtosecond,picosecond and nanosecond laser ablation of solids[J].Appl.Phys.A,1996,63(2):109-115.
[14] Corkum PB,Brunel F,Sherman NK.Thermal response of metals to ultrashort-pulse laser exitation[J].Phys.Rev.Lett.,1998,61(25):2886-2889.
[15] Christensen B H,Vestentoft K,Balling P.Short-pulse ablation rates and the two-temperature model[J].Applied Surface Science,2007,253(15):6347-6352.
[16] SHI Keming,WANG Mingdi,CHEN Tianyu,et al.Study on technology and quality of etching copper clad laminate with femtosecond laser[J].Applied Laser,2018,38(1):81-88.(in Chinese)施克明,王明娣,陈添禹,等.飞秒激光扫描刻蚀覆铜板工艺及质量研究[J].应用激光,2018,38(1):81-88.
[17] DU Qiu.Research on forming squarely thin-walled parts by accurately hybrid laser formation[D].Suzhou:Soochow University,2016.(in Chinese)杜秋.激光复合精确成形方形薄壁件技术研究[D].苏州:苏州大学,2016.
[2] ZHU Datong.Base material of PCB-basic technology of copper clad laminate (Continued to 12)[J].Printed Circuit Information,1998,(2):40-46.(in Chinese)祝大同.PCB基材——覆铜箔板技术基础(续十二)[J].印制电路信息,1998(2):40-46.
[3] DENG Qing,ZHANG Wenyan,WEI Lili.Experimental study on pyrolysis of FR4 waste printed circuit board[J].Journal of Ningbo University of Technology,2013,25(2):69-73.(in Chinese)邓青,张文琰,魏莉莉.FR4型废弃印刷线路板热解的实验研究[J].宁波工程学院学报,2013,25(2):69-73.
[4] ZENG Zhinan,LI Ruxin.Technology of femtosecond laser[M].Beijing:National Defense Industry Press,2016:1-2.(in Chinese)曾志男,李儒新.飞秒激光技术[M].北京:国防工业出版社,2016:1-2.
[5] ZHANG Zhigang.Technology of femtosecond laser[M].Beijing:Science Press,2017:438-446.(in Chinese)张志刚.飞秒激光技术[M].北京:科学出版社,2017:438-446.
[6] Aos A,Martin S,Paul F.Laser processing of rigid and flexible PCBs[J].Optics and Lasers in Engineering,2014,58:109-113.
[7] Joohan K,Haewoon C.Flexible printed circuit boards laser bonding using a laser beam homogenization process[J].Optics & Lasers in Engineering,2012,50(11):1643-1653.
[8] Mur J,Podobnik B,Poberaj I.Laser beam steering approaches for microstructuring of copper layers[J].Optics & Laser Technology,2017,88:140-146.
[9] ZHANG Fei,ZEN Xiaoyan,et al.Laser etching and cutting printed board by 355 nm and 1064 nm diode pumped solid state lasers[J].Chinese Journal of Lasers,2008,(10):1637-1643.(in Chinese)张菲,曾晓雁,李祥友,等.355nm和1064nm全固态激光器刻蚀印刷线路板[J].中国激光,2008,(10):1637-1643.
[10] YU Xiaofei,HE Wei,WANG Shouxu,et al.Research on blind via drilling using UV laser[J].Printed Circuit Information,2011,(4):62-66.(in Chinese)余小飞,何为,王守绪,等.紫外光激光加工盲孔的工艺研究[J].印制电路信息,2011,(4):62-66.
[11] LING Lei,LOU Qihong,YE Zhenhuan,et al.Ablation of circuit board by pulsed UV laser[J].Chinese Journal of Lasers,2003,(10):953-955.(in Chinese)凌磊,楼祺洪,叶震寰,等.紫外激光刻蚀多层线路板初步研究[J].中国激光,2003,(10):953-955.
[12] Anisimov S I,Kapeliovich B L,Perelman T L.Electron emission from metal surfaces exposed to ultrashort laser pulses[J].Zhurnal Eksperimentalnoi I Teoreticheskoi Fiziki,1974,66(776):776-781.
[13] Chichkov BN,Momma C,Notes S,et al.Femtosecond,picosecond and nanosecond laser ablation of solids[J].Appl.Phys.A,1996,63(2):109-115.
[14] Corkum PB,Brunel F,Sherman NK.Thermal response of metals to ultrashort-pulse laser exitation[J].Phys.Rev.Lett.,1998,61(25):2886-2889.
[15] Christensen B H,Vestentoft K,Balling P.Short-pulse ablation rates and the two-temperature model[J].Applied Surface Science,2007,253(15):6347-6352.
[16] SHI Keming,WANG Mingdi,CHEN Tianyu,et al.Study on technology and quality of etching copper clad laminate with femtosecond laser[J].Applied Laser,2018,38(1):81-88.(in Chinese)施克明,王明娣,陈添禹,等.飞秒激光扫描刻蚀覆铜板工艺及质量研究[J].应用激光,2018,38(1):81-88.
[17] DU Qiu.Research on forming squarely thin-walled parts by accurately hybrid laser formation[D].Suzhou:Soochow University,2016.(in Chinese)杜秋.激光复合精确成形方形薄壁件技术研究[D].苏州:苏州大学,2016.