摘要
采用电子束物理气相沉积(EB-PVD)制备了纳米钼颗粒弥散强化铜基复合材料(Mo体积含量为2.5%~10.8%),对其材料微观结构、钼含量和硬度、电阻率关系进行了研究。结果表明:Cu-Mo复合材料中铜基体由柱状晶铜组成,Mo颗粒平均直径为2.4~8.1 nm;随着钼含量增加,铜基体柱状晶宽度逐渐减小,Mo颗粒平均直径逐渐增加,硬度、电阻率逐渐增加;EB-PVD制备的Cu-Mo复合材料主要强化机制为Orowan机制。
Mo particle reinforced copper composites with 2.5vol%~10.8vol%Mo were prepared by electron beam physical vapor deposition(EB-PVD).The microstructure,hardness and electrical resistivity were investigated.The results show that the Cu matrix is composed of columnar microcrystalline and the average grain size of Mo is 2.4-8.1 nm;the columnar crystal width of copper matrix decreases,while hardness and electrical resistivity of the composites increase with the increase of the Mo content.The strengthening mechanism of the composites by EB-PVD is mainly the Orowan mechanism.
引文
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