电子束物理气相沉积Cu-Mo复合材料微结构与性能研究
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摘要
采用电子束物理气相沉积(EB-PVD)制备了纳米钼颗粒弥散强化铜基复合材料(Mo体积含量为2.5%~10.8%),对其材料微观结构、钼含量和硬度、电阻率关系进行了研究。结果表明:Cu-Mo复合材料中铜基体由柱状晶铜组成,Mo颗粒平均直径为2.4~8.1 nm;随着钼含量增加,铜基体柱状晶宽度逐渐减小,Mo颗粒平均直径逐渐增加,硬度、电阻率逐渐增加;EB-PVD制备的Cu-Mo复合材料主要强化机制为Orowan机制。
Mo particle reinforced copper composites with 2.5vol%~10.8vol%Mo were prepared by electron beam physical vapor deposition(EB-PVD).The microstructure,hardness and electrical resistivity were investigated.The results show that the Cu matrix is composed of columnar microcrystalline and the average grain size of Mo is 2.4-8.1 nm;the columnar crystal width of copper matrix decreases,while hardness and electrical resistivity of the composites increase with the increase of the Mo content.The strengthening mechanism of the composites by EB-PVD is mainly the Orowan mechanism.
Mo particle reinforced copper composites with 2.5vol%~10.8vol%Mo were prepared by electron beam physical vapor deposition(EB-PVD).The microstructure,hardness and electrical resistivity were investigated.The results show that the Cu matrix is composed of columnar microcrystalline and the average grain size of Mo is 2.4-8.1 nm;the columnar crystal width of copper matrix decreases,while hardness and electrical resistivity of the composites increase with the increase of the Mo content.The strengthening mechanism of the composites by EB-PVD is mainly the Orowan mechanism.
引文
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[2]Li X,Song G P,Bu F Y et al.Rare Metals[J],2014,33(5):568
[3]Zhang X H,Lin C G,Cui S et al.Rare Metals[J],2014,33(2):191
[4]Zhuo H O,Tang J C,Ye N.Materials Science&Engineering A[J],2013,584:1
[5]Hussain Z,Othman R,Long B D et al.Journal of Alloys and Compounds[J],2008,464(1):185
[6]Sabooni S,Mousavi T,Karimzadeh F.International Journal of Modern Physics:Conference Series[J],2012,05:456
[7]Botcharova E,Freudenberger J,Schultz L.Journal of Materials Science[J],2004,39:5287
[8]Song Guangping(宋广平),Sun Yue(孙跃),He Xiaodong(赫晓东)et al.Rare Metal Materials and Engineering(稀有金属材料与工程)[J],2009,38(10):1856
[9]Movchan B A.Surface Engineering[J],2006,22(1):35
[10]Movchan B A,Demchishin A V,Badilenko G F.Thin Solid Films[J],1977,40:237
[11]Lin X,He X D,Sun Y et al.Applied Surface Science[J],2013,284:679
[12]He X D,Xin Y,Li M W et al.Journal of Alloys and Compounds[J],2009,467(1-2):347
[13]Qian Miaogen(钱苗根).Materials Surface Technology and Application Manual(材料表面技术及其应用手册)[M].Beijing:China Machine Press,1998:706
[14]Zhou Yu(周玉).Materials Analytical Methods(材料分析方法)[M].Beijing:China Machine Press,2004:70
[15]Li Xuedan(李学丹),Wan Yingchao(万英超),Jiang Xiangqi(姜祥祺)et al.Vacuum Deposition Technique(真空沉积技术)[M].Hangzhou:Zhejiang University Press,1994:107
[16]Zozulya E V,Ⅱ’inskii A I,Kolupaev.The Physics of Metals and Metallography[J],2011,111(2):159
[17]Srinivasan D,Corderman R,Subramanian P R.Materials Science Engineering A[J],2006,416:211