高频基材混压印制板的ICD问题探讨
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摘要
高频高速材料具有较好的电性能和耐热性,因为树脂中填料比较多,其特性就比较硬,易产生孔粗、钉头、灯芯、特别是内层连接缺陷(ICD)问题。本文主要从钻孔、除胶工序分析,通过试验验证的方法改善高频高速混压材料ICD的问题。
The high frequency and high speed materials have better electrical properties and heat resistance. Because there is more filler in the resin, its characteristic is hard, and is easy to cause problems of roughness, nail heading, wicking, especially inner connection defects(ICD). In this paper, it mainly analyzes the drilling and desmearing processes, and improves the problem of ICD for high frequency and high speed hybrid materials through test verification.
The high frequency and high speed materials have better electrical properties and heat resistance. Because there is more filler in the resin, its characteristic is hard, and is easy to cause problems of roughness, nail heading, wicking, especially inner connection defects(ICD). In this paper, it mainly analyzes the drilling and desmearing processes, and improves the problem of ICD for high frequency and high speed hybrid materials through test verification.
引文
[1]李丰.高频板ICD改善方法及钻孔参数优化研究[G].2013秋季国际PCB技术/信息论坛.
[2]冯立明.电镀工艺与设备[M].北京化学工业出版社.2005
[3]林金堵等.印制电路信息[J].2008.12
[2]冯立明.电镀工艺与设备[M].北京化学工业出版社.2005
[3]林金堵等.印制电路信息[J].2008.12