钴含量对电铸镍钴合金模芯微纳结构复制质量的影响
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摘要
为探明电铸液中钴含量对仿荷叶表面镍钴合金模芯微纳结构复制质量的影响,采用阴极竖直旋转的微电铸技术,制备不同钴含量的仿荷叶表面镍钴合金模芯,采用扫描电子显微镜(SEM)、能谱仪(EDS)分析仿荷叶表面镍钴合金模芯表面的复制质量及成分。结果表明:由于铸层表面内应力的影响,在常规镍电铸中添加钴以后,仿荷叶镍钴合金模芯表面出现了波纹型的褶皱;观测模芯微观形貌发现其表面微米级的孔洞沿特定方向出现不同程度的拉伸,随着电铸液中钴含量(体积分数)的增加,拉伸程度先增加后降低(拉伸程度:钴含量0 g/L<钴含量40 g/L<钴含量10～30 g/L);铸层中添加元素钴有利于晶粒细化,随电铸液中钴含量的增加,模芯表面微纳结构越细小,复制质量越高。
To study the influence of cobalt additions on the replication quality about micro/nano-structures of lotus-leaf-like nickel-cobalt alloy insert, the vertical rotating cathode micro electroforming technology was used to manufacture various inserts. Scanning electron microscope(SEM) and energy dispersive spectrometer(EDS) were used to analyze the replication quality and composition. Results show that the influence of the internal stress on the electroforming surface causes the corrugation on the surface of lotus-leaf-like nickel-cobalt alloy insert after adding some cobalt in the normal electroforming.Additionally, the microstructure of the insert is affected by tensile stress according to the analysis of the microcosmic morphology of the insert, and the micro-level holes are stretched in a specific direction of different degrees. With the increase of the cobalt content in electrolyte, the level of stretch tends to increase and then decrease(level of stretch: cobalt addition0 g/L < cobalt addition 40 g/L < cobalt addition 10-30 g/L). Moreover, the addition of cobalt in the electroforming layer is propitious to grain refinement. Meanwhile, the replication quality becomes higher and nanostructures of the insert surface become smaller with the addition of the cobalt in electrolyte.
To study the influence of cobalt additions on the replication quality about micro/nano-structures of lotus-leaf-like nickel-cobalt alloy insert, the vertical rotating cathode micro electroforming technology was used to manufacture various inserts. Scanning electron microscope(SEM) and energy dispersive spectrometer(EDS) were used to analyze the replication quality and composition. Results show that the influence of the internal stress on the electroforming surface causes the corrugation on the surface of lotus-leaf-like nickel-cobalt alloy insert after adding some cobalt in the normal electroforming.Additionally, the microstructure of the insert is affected by tensile stress according to the analysis of the microcosmic morphology of the insert, and the micro-level holes are stretched in a specific direction of different degrees. With the increase of the cobalt content in electrolyte, the level of stretch tends to increase and then decrease(level of stretch: cobalt addition0 g/L < cobalt addition 40 g/L < cobalt addition 10-30 g/L). Moreover, the addition of cobalt in the electroforming layer is propitious to grain refinement. Meanwhile, the replication quality becomes higher and nanostructures of the insert surface become smaller with the addition of the cobalt in electrolyte.
引文
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[2]夏秋,刘峰,宋弘清,等.环氧底漆表面合成超疏水涂层减阻性能研究[J].真空科学与技术学报,2015(04):508-513.XIA Q,LIU F,SONG H F,et al.Characterization of superhydrophobic and drag reduction coatings on corrosion-resist epoxy painting[J].Chinese Journal of Vacuun Science and Rechnology,2015(04):508-513(in Chinese).
[3]WANG X,LIU X,ZHOU F,et al.Self-healing superamphiphobicity[J].Chemical Communications,2011,47(8):2324-2326.
[4]BALDACCHINI T,CAREY J E,ZHOU M,et al.Superhydrophobic surfaces prepared by microstructuring of silicon using a femtosecond laser[J].Langmuir,2006,22(11):4917-4919.
[5]GURAV A B,LATTHE S S,CHARLES K,et al.Porous water repellent silica coatings on glass by sol-gel method[J].Journal of Porous Materials,2011,18(3):361-367.
[6]Yu Q,Zeng Z,Zhao W,et al.Fabrication of adhesive superhydrophobic Ni-Cu-P alloy coatings with high mechanical strength by one step electrodeposition[J].Colloids&Surfaces A Physicochemical&Engineering Aspects,2013,427(24):1-6.
[7]CHANG K C,HSU M H,LU H I,et al.Room-temperature cured hydrophobic epoxy/graphene composites as corrosion inhibitor for cold-rolled steel[J].Carbon,2014,66:144-153.
[8]LIU Y,WANG X,FEI B,et al.Bioinspired,stimuli-responsive,multifunctional superhydrophobic surface with directional wetting,adhesion,and transport of water[J].Ad-vanced Functional Materials,2015,25(31):5047-5056.
[9]赵晓非,杨明全,章磊,等.仿生超疏水表面的制备与应用的研究进展[J].化工进展,2016(09):2818-2829.ZHAO X F,YANG M Q,ZHANG L,et al.Research progress in fabrication and application of bioinspired super-hydrophobic surface[J].Chemical Industry and Engineering Progress,2016(09):2818-2829(in Chinese).
[10]黄志平.基于结构仿生的鲨鱼皮微沟槽复制技术基础研究[D].大连:大连理工大学,2012.HUANG Z P.Basic study on replication technology of micro-riblets of shark skin based on structural bionics[D].Dalian:Dalian University of Technology,2012(in Chinese).
[11]LEE S M,KWON T H.Mass-producible replication of highly hydrophobic surfaces from plant leaves[J].Nanotechnology,2006,17(13):3189-3196.
[12]吕辉.微纳结构镍模芯电铸工艺及复制精度研究[D].长沙:中南大学,2015.LV H.Research on process technology and precision of electroformed mold insert with micro-nano structure[D].Changsha:Central South University,2015(in Chinese).
[13]黎醒.仿生超疏水表面模芯的电铸成型及性能研究[D].长沙:中南大学,2017.LI X.Research on the process and properties of electroformed insert with biomimetic super hydrophobic structure[D].Changsha:Central South University,2017(in Chinese).
[14]汪哲能,邱锡荣,杨博伟.电铸液中钴含量对镍钴合金电铸模芯性能的影响[J].材料保护,2016,49(1):59-62.WANG N Z,QIU X R,YANG B W.Effect of cobalt content in electroforming electrolyte on the properties of Ni-Co alloy electroforming inserts[J].Materials Protection,2016,49(1):59-62(in Chinese).
[15]杜爱华,龙晋明,裴和中,等.电铸镍钴合金中内应力的影响因素[J].电镀与装饰,2008,27(6):15-17.DU A H,LONG J M,PEI H Z,et al.Influential factors of inner stress in electroformed nickel-cobalt alloy[J].Electroplating and Finishing,2008,27(6):15-17(in Chinese).
[16]许伟长,戴品强,郑耀东.钴含量对电沉积纳米晶镍钴合金组织与力学性能的影响[J].中国有色金属学报,2010,20(1):92-99.XU W C,DAI P Q,ZHENG Y D.Effect of Co content on structures and mechanical properties of electrodeposited nanocrystallne Ni-Co alloys[J].The Chinese Journal of Nonferrous Metals,2010,20(1):92-99(in Chinese).
[17]GAO J C,JIN H M,ZHANG J Q,et al.Influence of depositing parameters on microstructure of Ni-Co pulse plating[J].Applied Mechanics&Materials,2011,84-85:86-90.