非共价键表面修饰的石墨烯/聚合物复合材料研究进展
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  • 英文篇名:Research Progress on Graphene/Polymer Composites with Non-covalent Surface Modification
  • 作者:王昊 ; 张辉 ; 张继华 ; 赵云峰
  • 英文作者:WANG Hao;ZHANG Hui;ZHANG Ji-hua;ZHAO Yun-feng;Aerospace Research Institute of Materials & Processing Technology;State Key Laboratory of New Ceramics and Fine Processing,School of Materials Science and Engineering,Tsinghua University;
  • 关键词:石墨烯 ; 非共价键表面修饰 ; 复合材料 ; 力学性能 ; 电学性能
  • 英文关键词:graphene;;non-covalent surface modification;;composite;;mechanical property;;electrical property
  • 中文刊名:CLGC
  • 英文刊名:Journal of Materials Engineering
  • 机构:航天材料及工艺研究所;清华大学材料学院新型陶瓷与精细工艺国家重点实验室;
  • 出版日期:2018-07-12 14:02
  • 出版单位:材料工程
  • 年:2018
  • 期:v.46;No.422
  • 语种:中文;
  • 页:CLGC201807007
  • 页数:9
  • CN:07
  • ISSN:11-1800/TB
  • 分类号:48-56
摘要
石墨烯具有优异的力学、电学和热学等性能,被广泛应用于聚合物基复合材料的改性研究中。石墨烯表面惰性,与聚合物相容性较差,难以在复合材料中充分发挥优异的性能,因此需要对其进行表面修饰。与共价键表面修饰方法相比,对石墨烯进行非共价键表面修饰,可以在改善其表面活性的同时维持原始结构,更适合构筑高性能聚合物功能复合材料。本文综述了石墨烯非共价键表面修饰的研究进展,分析了采用非共价键修饰的石墨烯填充的复合材料结构与性能间的关系,讨论了复合材料存在的界面结合较弱问题,提出了复合材料低成本制备、微观结构精确调控的发展前景。
        Graphene possesses excellent mechanical,electrical and thermal properties,which has been wildly used in modification of polymer composites.However,graphene has poor compatibility with polymers due to its surface inactive properties.This weakness restricts the composites performances,so it is necessary to make a surface modification for graphene.The non-covalent surface modification method can protect the pristine structure of graphene and improve the surface activity,and this is suitable for building high performance functional composites.The current developments of the non-covalent surface modification on graphene were summarized,and the relationship between the structure and properties of composites filled by functional graphene were illustrated.Finally,some existing problems about weak interfacial strength of graphene based polymer composites were discussed.At the same time,its future perspective of low cost production and accurate microstructure control was proposed.
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