摘要
本文使用真空钎焊方法对TiAl／B-Ag72Cu／42CrMo进行了研究，分析了
TiAl／B-Ag72Cu／42CrMo钎焊接头组织。界面分析显示，当钎焊连接温度
低于830℃时，B-Ag72Cu／42CrMo的结合面末形成化合物，但当钎焊连接
温度大于830℃时，B-Ag72Cu／42CrMo的界面形成极薄的化合物反应层；
而TiAl／B-Ag72Cu的结合面上在任何钎焊温度下均有Al-Cu-Ti金属间化
合物产生。分析了连接界面化合物反应层的形成和长大机制。
In this paper, the vacuum brazing of the TiAl compound and 42CrMo steel was studied. Then the joint microstructure of TiAl/ B-Ag72Cu /42CrMo was analyzed. The results of vacuum brazing of the TiAl compound and 42CrMo steel show that when the brazing temperature is under 830癈, no icompound is formed at the boundary on the 42CrMo side; but when brazing temperature over 830癈, a narrow compound layer is found at the same place. While on the TiAl side, there is Al-Cu-Ti intermetallic compound at any brazing temperature; The forming and growth mechanism of brazing interface is outlined.
引文
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