基于嵌入式系统的MCM基板测试技术研究
|
摘要
随着测试测量技术的不断发展和用户需求的不断增长,嵌入式技术在测试测量领域中的应用日益广泛。基于嵌入式系统的MCM测试测量技术可以极大地增强测量的智能性与灵活性,拓展测量功能,实现MCM多层布线基板通断信息采集与测量之间的有机结合。
本文设计实现了ARM嵌入式系统硬件平台,通过对不同测试方法的对比分析,重点介绍一种单探针和双探针结合的R-C探针通断测量法,并提出了适于MCM多层布线基板通断测试的界定法测试概念。该技术主要应用于工艺布线密度高,基板面积较大,表面质量要求高,收缩率非线性,网络数及点数量多的MCM多层布线基板。
通过对ARM嵌入式系统硬件平台、MCM多层布线基板R-C界定测试法的结合,致力于实现实用化、一体化的MCM多层布线基板通断测试设备。
With the development of testing & measurement technology and the increase of customer’s requirement, the application of embedded technology in the testing & measurement area is increasing broadly .Based on the embedded system, testing & measurement technology enhance the flexibility of itself and expand the function in this area. As a result, it is accomplished that the combination of the information gathering for MCM substrate with measurement.
This paper includes two parts: ARM embedded system hardware platform, short-and-open testing for MCM substrate .Among the testing for MCM substrate, a single probe method and dual-probes method based on the R-C theory are analyzed and compared. After that, a brand-new concept is brought—the bounding box, which focus on the MCM substrate with multi-networks.
The combination of the ARM embedded system hardware platform and short-and-open testing for MCM substrate would have a very important promotion to the practical and integrated measuring instruments.
本文设计实现了ARM嵌入式系统硬件平台,通过对不同测试方法的对比分析,重点介绍一种单探针和双探针结合的R-C探针通断测量法,并提出了适于MCM多层布线基板通断测试的界定法测试概念。该技术主要应用于工艺布线密度高,基板面积较大,表面质量要求高,收缩率非线性,网络数及点数量多的MCM多层布线基板。
通过对ARM嵌入式系统硬件平台、MCM多层布线基板R-C界定测试法的结合,致力于实现实用化、一体化的MCM多层布线基板通断测试设备。
With the development of testing & measurement technology and the increase of customer’s requirement, the application of embedded technology in the testing & measurement area is increasing broadly .Based on the embedded system, testing & measurement technology enhance the flexibility of itself and expand the function in this area. As a result, it is accomplished that the combination of the information gathering for MCM substrate with measurement.
This paper includes two parts: ARM embedded system hardware platform, short-and-open testing for MCM substrate .Among the testing for MCM substrate, a single probe method and dual-probes method based on the R-C theory are analyzed and compared. After that, a brand-new concept is brought—the bounding box, which focus on the MCM substrate with multi-networks.
The combination of the ARM embedded system hardware platform and short-and-open testing for MCM substrate would have a very important promotion to the practical and integrated measuring instruments.
引文
[1] Samsung Electronics. 《S3C2410X USER’S MANUAL》.Revision 1.2 2003 年
[2] 夏靖波、王航、陈雅蓉,《嵌入式系统原理与开发》,西安电子科技大学出版社,2006 年 2 月
[3] 谢凯,《基于嵌入式系统的通用电子测量仪器硬件平台的研究》,西安电子科技大学硕士学位论文,2006 年 3 月
[4] Jean J.Labrosse、劭贝贝(译). 《嵌入式实时操作系统 uC/OS –II》.第二版. 2003.5
[5] Michael Barr. 《Programming Embedded System in C and C++》. O'Reilly Publisher .1999.1
[6] 马忠梅、马广云等. 《ARM 嵌入式处理器结构与应用基础》. 北京航空航天大学出版社.2002.1
[7] 王田苗. 《嵌入式系统设计与实例开发》. 清华大学出版社. 2003.10
[8] 张嵛 《32 位嵌入式系统硬件设计与调试》 机械工业出版社 2005 年 7 月
[9] 胡大可.《MSP430 超低功耗单片机原理与应用》 北京航空航天大学出版社,2001
[10] 《精细测量技术》 TI 研讨会
[11] 周渭、于建国 刘海霞 《测试与计量技术基础》 西安电子科技大学出版社
[12] 刘君华《现代检测技术与测试系统设计》西安交通大学出版社
[13] Joseph A Conti ,《MCM TESTING USING A MOVING PROBER TESTER 》, Integri-Test Corporation , New York , U.S.A
[14] Rao R.Tummala,Eugene J.Rymaszewski,Alan G.Klopfenstein 等编,中国电子学会封装专业委员会及电子封装丛书编辑委员会 组织译校 《微电子封装手册》,第二版,北京,电子工业出版社
[15] 杨邦朝,张经国主编,《多芯片组件 MCM 技术及其应用》,电子科技大学出版社
[16] Wang Laung-Temg,McCluskey Edward J.Built-in Self-test for Sequential Machcines. International Test Conference 1987 IEEE:334-341
[17] Posse K E, A Design-for-Testability Architecture for Multichip Modules.International Test Conference.1991.
[18] Storey T, Lapihuska C,Atwood E, et al.A test Methodology to Support an Asem Foundry. International Test Conference. 1994.426-435
[19] Kornegay K T, Kaushik Roy. Integrated Test Solutions and Economics for MCMs.International Test Conferences,1995.193-201
[20] Andrew Flint,Test Strategies for a Family of Complex MCMs, International Test Conference,1994.436-445
[21] Amold Halperin.Latent Open Defect Detection Using Phase-Sensitives Nonlinearity Detection Technique.IEEE Transactions on Components, Packaging and Manufacturing Technology, 1995,18(2):358-365
[22] R.W.Jackson and D.M.Pozar."Full-Wave Analysis of Microstrip Open-End and Gap Discontinuities,” IEEE Trans.Microwave Theory Tech,”MTT-33(10)”: pp.1036-1042,1985
[23] S.Yao et al.“A Multi-Probe Approach for MCM Substrate Testing” IEEE Trans. Computer-Aided Design Integrated Circuits Sys.,CADICS-13(1): pp.389-398,1992
[24] R.Kambe:“MCM Substrate with High Capacitance”,IEEE Trans.Components Packaging Manuf.Technol.,CPMT-18(1):1995
[25] W.Blood and W.Yip.“Electrical Analysis of a Thin Film Multichip Module Substrate”,IEEE Multi-Chip Module Conference,1992
[26] K.Smith and G.Rinne.“MCMs:Approaches for Testing and Troubleshooting”,High Speed Digital Symposium and Exhibition,1992
[27] 梁超,时万春,王玉卿,《设计中的内置自测试》,国外电子测量技术,1998,(3):2-7
[28] 林传骝,P1149.4 混合信号测试总线综述,国外电子测量技术,1998,(3):6-6
[29] 陈光瑀,潘中良,《可测性设计技术》.北京:电子工业出版社,1997.288-292
[30] 孟红霞,时万春.《从芯片测试和板测试方法综合 MCM 测试策略》.国外电子测量技术,1999.(2):2-6
[31] 沈绪榜,《可测试性设计的 JTAGF 方法》.小型微型计算机系统,1991,12:10-18
[2] 夏靖波、王航、陈雅蓉,《嵌入式系统原理与开发》,西安电子科技大学出版社,2006 年 2 月
[3] 谢凯,《基于嵌入式系统的通用电子测量仪器硬件平台的研究》,西安电子科技大学硕士学位论文,2006 年 3 月
[4] Jean J.Labrosse、劭贝贝(译). 《嵌入式实时操作系统 uC/OS –II》.第二版. 2003.5
[5] Michael Barr. 《Programming Embedded System in C and C++》. O'Reilly Publisher .1999.1
[6] 马忠梅、马广云等. 《ARM 嵌入式处理器结构与应用基础》. 北京航空航天大学出版社.2002.1
[7] 王田苗. 《嵌入式系统设计与实例开发》. 清华大学出版社. 2003.10
[8] 张嵛 《32 位嵌入式系统硬件设计与调试》 机械工业出版社 2005 年 7 月
[9] 胡大可.《MSP430 超低功耗单片机原理与应用》 北京航空航天大学出版社,2001
[10] 《精细测量技术》 TI 研讨会
[11] 周渭、于建国 刘海霞 《测试与计量技术基础》 西安电子科技大学出版社
[12] 刘君华《现代检测技术与测试系统设计》西安交通大学出版社
[13] Joseph A Conti ,《MCM TESTING USING A MOVING PROBER TESTER 》, Integri-Test Corporation , New York , U.S.A
[14] Rao R.Tummala,Eugene J.Rymaszewski,Alan G.Klopfenstein 等编,中国电子学会封装专业委员会及电子封装丛书编辑委员会 组织译校 《微电子封装手册》,第二版,北京,电子工业出版社
[15] 杨邦朝,张经国主编,《多芯片组件 MCM 技术及其应用》,电子科技大学出版社
[16] Wang Laung-Temg,McCluskey Edward J.Built-in Self-test for Sequential Machcines. International Test Conference 1987 IEEE:334-341
[17] Posse K E, A Design-for-Testability Architecture for Multichip Modules.International Test Conference.1991.
[18] Storey T, Lapihuska C,Atwood E, et al.A test Methodology to Support an Asem Foundry. International Test Conference. 1994.426-435
[19] Kornegay K T, Kaushik Roy. Integrated Test Solutions and Economics for MCMs.International Test Conferences,1995.193-201
[20] Andrew Flint,Test Strategies for a Family of Complex MCMs, International Test Conference,1994.436-445
[21] Amold Halperin.Latent Open Defect Detection Using Phase-Sensitives Nonlinearity Detection Technique.IEEE Transactions on Components, Packaging and Manufacturing Technology, 1995,18(2):358-365
[22] R.W.Jackson and D.M.Pozar."Full-Wave Analysis of Microstrip Open-End and Gap Discontinuities,” IEEE Trans.Microwave Theory Tech,”MTT-33(10)”: pp.1036-1042,1985
[23] S.Yao et al.“A Multi-Probe Approach for MCM Substrate Testing” IEEE Trans. Computer-Aided Design Integrated Circuits Sys.,CADICS-13(1): pp.389-398,1992
[24] R.Kambe:“MCM Substrate with High Capacitance”,IEEE Trans.Components Packaging Manuf.Technol.,CPMT-18(1):1995
[25] W.Blood and W.Yip.“Electrical Analysis of a Thin Film Multichip Module Substrate”,IEEE Multi-Chip Module Conference,1992
[26] K.Smith and G.Rinne.“MCMs:Approaches for Testing and Troubleshooting”,High Speed Digital Symposium and Exhibition,1992
[27] 梁超,时万春,王玉卿,《设计中的内置自测试》,国外电子测量技术,1998,(3):2-7
[28] 林传骝,P1149.4 混合信号测试总线综述,国外电子测量技术,1998,(3):6-6
[29] 陈光瑀,潘中良,《可测性设计技术》.北京:电子工业出版社,1997.288-292
[30] 孟红霞,时万春.《从芯片测试和板测试方法综合 MCM 测试策略》.国外电子测量技术,1999.(2):2-6
[31] 沈绪榜,《可测试性设计的 JTAGF 方法》.小型微型计算机系统,1991,12:10-18