Ka波段五路收发高频前端
|
摘要
收发前端是现代微波毫米波系统中的重要组成部分。小型化、高精度、高可靠性是精确制导系统的主要发展方向。本文基于毫米波精确制导原理,采用混合集成电路技术实现Ka波段五路收发高频前端。该前端具有五个发射通道、五个接收通道、两个测试通道和一个射检通道,在常温、高低温和振动条件下可以完成扫频、点频切换功能、通道以及波束切换功能、发射功率管理功能和自检功能。
本文针对Ka波段五路收发高频前端设计中所遇到的关健问题展开研究,主要工作体现在以下几个方面:
首先,基于介质集成波导(SIW)工艺和定向耦合器原理,设计出了一种新型的三路零相位功率分配/合成器。该功分器插损小、隔离度高、三路功率和相位不平衡度小、尺寸也较小。如果采用半模介质集成波导,尺寸还可以减小一半。同时本文还设计了X波段和Ka波段两个Wilkinson功分器用于收发前端。
其次,基于半模介质集成波导(HMSIW)工艺和K/J阻抗变换理论,设计了一种新型的X波段窄带滤波器。该滤波器带宽很窄、插损小,选择性好,带外抑制度高,仿真和测试结果吻合,非常适用于小型化、高性能滤波器设计。同时本文还设计了C波段半波长开环谐振器带通滤波器、Ka波段E面膜片波导带通滤波器、Ka波段平行耦合线带通滤波器和微带带阻滤波器等4种性能良好的滤波器用于收发前端。
然后,根据系统指标和方案,设计了译码、与门等数字逻辑电路有效地用于控制收、发支路13个通道18路开关的切换管理。
最后,对收发前端FPGA控制电路、DDS扫频源、PLL点频源、本振链路以及收发支路等组成部分进行合理布局,保证了整个系统的小型化和可靠性。
测试结果表明:收发高频前端五个发射通道输出功率为(28±1)dBm,同时可以完成步进6dB衰减、最大18dB衰减的功率管理要求;发射信号杂散小于-50dBc;发射通道间隔离度大于45dB;五个接收通道增益为(30±0.5)dBm,噪声系数小于5dB;接收通道间隔离度大于45dB。该收发前端达到指标要求。
Transceiver front-end is an important part of the modern microwave and millimeter wave system. Miniaturization, high precision and high reliability are the main developing directions for the precise guiding system. Based on millimeter wave precise guiding theory, the high-frequency Ka-band transceiver front-end with five channels has been achieved by employing the hybrid integrated circuit technology. The front-end has five transmitting channels, five receiving channels, two testing channels and a radio self-testing channel. Whenever at room temperature, high-low temperature or the vibration conditions it could complete the functions including switching between sweeping frequency and spot-frequency, switching among channels, switching beams, transmission power management and self-test function
In this paper, key problems relevant to the high-frequency Ka-band transceiver with five channels have been researched. The main research work focuses on the following aspects.
First of all, based on substrate integrated waveguide (SIW) technology and directional coupler theory, a new type of three-way with zero-phase difference power divider / combiner is designed. This power splitter has the advantages of low insertion loss, high isolation, small size, tiny three-way power and phase imbalance. If it is made of the half-mode substrate integrated waveguide, the size could be reduced by half. Meanwhile, the X-band and Ka-band Wilkinson power dividers used in the transceiver have also been designed.
Secondly, based on half-mode substrate integrated waveguide (HMSIW) technology and K / J impedance transforming theory, a new type of narrow-band filter in X-band has been designed. The filter has very narrow bandwidth, small insertion loss, good selectivity, high suppression beyond the pass band, and excellent agreement with the simulation and test data. It is suitable for small, high-performance filter design. In this paper, at the same time, a C-band band pass filter employing half-wave open-loop resonator, a Ka-band E-metal band pass filter using waveguide, a Ka-band parallel band-pass filter by using coupled line and a band stop filter have been also designed. All of these four kinds of good performance filters have been used in the transceiver front-end.
Thirdly, according to specification goals and programs of the system, the decoding circuits, door circuits and other digital logic circuits which are used to control 18 switches in the 13 channels of the transceiver have been designed.
Finally, control circuits in the transceiver front-end including FPGA, DDS swept source, PLL frequency point source, local oscillator chains and the transceiver components are distributed rationally to ensure the overall system’s miniaturization and reliability.
Test results show that output power of five transmits channels of the high-frequency transceiver front-end is about(28±1)dBm. 6dB attenuation (18dB at most) in every step can be reached. Transmit spurious are less than -50 dBc. Isolation among transmit channels is greater than 45 dB. Gain and noise figure of the five receive channels is (30±0.5)dB and better than 5 dB respectively. Isolation between the receive channel ports is greater than 45 dB. All design goals of the transceiver front-end are achieved.
本文针对Ka波段五路收发高频前端设计中所遇到的关健问题展开研究,主要工作体现在以下几个方面:
首先,基于介质集成波导(SIW)工艺和定向耦合器原理,设计出了一种新型的三路零相位功率分配/合成器。该功分器插损小、隔离度高、三路功率和相位不平衡度小、尺寸也较小。如果采用半模介质集成波导,尺寸还可以减小一半。同时本文还设计了X波段和Ka波段两个Wilkinson功分器用于收发前端。
其次,基于半模介质集成波导(HMSIW)工艺和K/J阻抗变换理论,设计了一种新型的X波段窄带滤波器。该滤波器带宽很窄、插损小,选择性好,带外抑制度高,仿真和测试结果吻合,非常适用于小型化、高性能滤波器设计。同时本文还设计了C波段半波长开环谐振器带通滤波器、Ka波段E面膜片波导带通滤波器、Ka波段平行耦合线带通滤波器和微带带阻滤波器等4种性能良好的滤波器用于收发前端。
然后,根据系统指标和方案,设计了译码、与门等数字逻辑电路有效地用于控制收、发支路13个通道18路开关的切换管理。
最后,对收发前端FPGA控制电路、DDS扫频源、PLL点频源、本振链路以及收发支路等组成部分进行合理布局,保证了整个系统的小型化和可靠性。
测试结果表明:收发高频前端五个发射通道输出功率为(28±1)dBm,同时可以完成步进6dB衰减、最大18dB衰减的功率管理要求;发射信号杂散小于-50dBc;发射通道间隔离度大于45dB;五个接收通道增益为(30±0.5)dBm,噪声系数小于5dB;接收通道间隔离度大于45dB。该收发前端达到指标要求。
Transceiver front-end is an important part of the modern microwave and millimeter wave system. Miniaturization, high precision and high reliability are the main developing directions for the precise guiding system. Based on millimeter wave precise guiding theory, the high-frequency Ka-band transceiver front-end with five channels has been achieved by employing the hybrid integrated circuit technology. The front-end has five transmitting channels, five receiving channels, two testing channels and a radio self-testing channel. Whenever at room temperature, high-low temperature or the vibration conditions it could complete the functions including switching between sweeping frequency and spot-frequency, switching among channels, switching beams, transmission power management and self-test function
In this paper, key problems relevant to the high-frequency Ka-band transceiver with five channels have been researched. The main research work focuses on the following aspects.
First of all, based on substrate integrated waveguide (SIW) technology and directional coupler theory, a new type of three-way with zero-phase difference power divider / combiner is designed. This power splitter has the advantages of low insertion loss, high isolation, small size, tiny three-way power and phase imbalance. If it is made of the half-mode substrate integrated waveguide, the size could be reduced by half. Meanwhile, the X-band and Ka-band Wilkinson power dividers used in the transceiver have also been designed.
Secondly, based on half-mode substrate integrated waveguide (HMSIW) technology and K / J impedance transforming theory, a new type of narrow-band filter in X-band has been designed. The filter has very narrow bandwidth, small insertion loss, good selectivity, high suppression beyond the pass band, and excellent agreement with the simulation and test data. It is suitable for small, high-performance filter design. In this paper, at the same time, a C-band band pass filter employing half-wave open-loop resonator, a Ka-band E-metal band pass filter using waveguide, a Ka-band parallel band-pass filter by using coupled line and a band stop filter have been also designed. All of these four kinds of good performance filters have been used in the transceiver front-end.
Thirdly, according to specification goals and programs of the system, the decoding circuits, door circuits and other digital logic circuits which are used to control 18 switches in the 13 channels of the transceiver have been designed.
Finally, control circuits in the transceiver front-end including FPGA, DDS swept source, PLL frequency point source, local oscillator chains and the transceiver components are distributed rationally to ensure the overall system’s miniaturization and reliability.
Test results show that output power of five transmits channels of the high-frequency transceiver front-end is about(28±1)dBm. 6dB attenuation (18dB at most) in every step can be reached. Transmit spurious are less than -50 dBc. Isolation among transmit channels is greater than 45 dB. Gain and noise figure of the five receive channels is (30±0.5)dB and better than 5 dB respectively. Isolation between the receive channel ports is greater than 45 dB. All design goals of the transceiver front-end are achieved.
引文
[1]郭修煌.精确制导技术.北京:国防工业出版社,1999
[2]陈定昌,袁起,范金荣.精确制导武器发展趋势.现代防御技术,2000,第4期
[3]杨树谦.国外精确制导技术发展述评.飞航导弹,2001,第6期
[4]夏思宇.精确制导技术及其现状与发展.航空科学技术,2003,第1期
[5] Powell, J.R. (QinetiQ Ltd.); Munday, P.D.; Tang, W.H.A.; Hunt, R.C.; Gunton, D.J.“MMIC and module design and performance for millimetric transceiver front-ends for transport applications”.IEEE MTT-S International Microwave Symposium Digest, 2006 IEEE MTT-S International Microwave Symposium Digest, 2006, p 1497-1500
[6] Hong, Seungpyo (Dept. of Electrical and Computer Engineering, Texas A and M University); Coutant, Matthew R.; Chang, Kai.“An ultra wideband transmit/receive module operating from 10 to 35 GHz for phased array applications”.IEEE MTT-S International Microwave Symposium Digest, 2006 IEEE MTT-S International Microwave Symposium Digest, 2006, p 2007-2010
[7] Kok, Yon-Lin (TRW); Ahmadi, Morteza; Wang, Huei; Allen, Barry R.; Lin, Tzuen;“Ka-band monolithic single-chip transceiver using sub-harmonic mixer”.IEEE MTT-S International Microwave Symposium Digest, v 1, 1998, p 309-311
[8] Van Vliet, F.E. (TNO Phys. and Electronics Laboratory); De Boer, A.“Fully-integrated core chip for X-band phased-array T/R modules”.IEEE MTT-S International Microwave Symposium Digest, v 3, 2004 IEEE MITT-S International Microwave Symposium Digest, 2004, p 1753-1756
[9] Berenz, J. (TRW Inc, Redondo Beach, CA, USA); LaCon, M.; Luong, M.“Single chip Ka-band transceiver”.IEEE MTT-S International Microwave Symposium Digest, v 2, 1991, p 517-520
[10] .Maruhashi, K.; Ito, M.; Kishimoto, S.; Ohata, K.;“60-GHz-band LTCC module technology for wireless gigabit transceiver applications”Radio-Frequency Integration Technology: Integrated Circuits for Wideband Communication and Wireless Sensor Networks, 2005. Proceedings. 2005 IEEE International Workshop on30 Nov.-2 Dec. 2005 Page(s):131 - 134 Digital Object Identifier 10.1109/RFIT.2005.1598892
[11] Lee, C.-H.; Sutono, A.; Han, S.; Laskar, J.;“A compact LTCC Ku-band transmitter module with integrated filter for satellite communication applications”, Microwave Symposium Digest, 2001 IEEE MTT-S International Volume 2, 20-25 May 2001 Page(s):945 - 948 vol.2 Digital Object Identifier 10.1109/MWSYM.2001.967048
[12] Chang-Ho Lee; Sutono, A.; Sangwoo Han; Kyutae Lim; Pinel, S.; Tentzeris, E.M.; Laskar, J.;“A compact LTCC-based Ku-band transmitter module”Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on]Volume 25, Issue 3, Aug. 2002 Page(s):374 - 384 Digital Object Identifier 10.1109/TADVP.2002.805315
[13] Kyutae Lim; Obatoyinbo, A.; Sutono, A.; Chakraborty, S.; Chang-Ho Lee; Gebara, E.; Raghavan, A.; Laskar, J. A highly integrated transceiver module for 5.8 GHz OFDM communication system using multi-layer packaging technology”Microwave Symposium Digest, 2001 IEEE MTT-S International Volume 3, 20-25 May 2001 Page(s):1739 - 1742 vol.3 Digital Object Identifier 10.1109/MWSYM.2001.967242
[14] Lee, C.-H.; Chakraborty, S.; Sutono, A.; Yoo, S.; Heo, D.; Laskar, J.;“Broadband highly integrated LTCC front-end module for IEEE 802.11a WLAN applications”; Microwave Symposium Digest, 2002 IEEE MTT-S InternationalVolume2,2-7 June 2002 Page(s):1045-1048 Digital Object Identifier 10.1109/MWSYM.2002.1011816
[15] Gauthier, G.; Bertinet, J.P.; Schroth, J.“Low-Cost Ka-Band Transmitter for VSAT Applications”. Microwave Symposium Digest, 2006. IEEE MTT-S International June 2006 Page(s):1398 - 1401 Digital Object Identifier 10.1109/MWSYM.2006.249530
[16] Young Chul Lee; Chul Soon Park;“A 60GHz strip line BPF for LTCC system-in-package applications”. Microwave Symposium Digest, 2005 IEEE MTT-S International12-17 June 2005 Page(s):4 pp. Digital Object Identifier 10.1109/MWSYM.2005.1516950
[17] Heyen, J.; von Kerssenbrock, T.; Chernyakov, A.; Heide, P.; Jacob, A.F;Novel LTCC/BGA modules for highly integrated millimeter-wave transceivers”. Microwave Theory and Techniques, IEEE Transactions on Volume 51,Issue 12, Dec. 2003 Page(s):2589 - 2596 .Digital Object Identifier 10.1109/TMTT.2003.819210
[18] Jong-Hoon Lee; Kidera, N.; DeJean, G.; Pinel, S.; Laskar, J.; Tentzeris, M.M.;“A V-band front-end with 3-D integrated cavity filters/duplexers and antenna in LTCC technologies”Microwave Theory and Techniques, IEEE Transactions on Volume 54, Issue 7, July 2006 Page(s):2925 - 2936 Digital Object Identifier 10.1109/TMTT.2006.877440
[19] Park, Jongbae; Kim, Junchul; Lu, Albert Chee W.; Shim, Yujeong; Kim, Joungho;“Noise Isolation in LTCC-Based X/Ku-Band Transceiver SiP Using Double-Stacked Electromagnetic Bandgap Structure”. Electromagnetic Compatibility, 2007. ISEMC 2007. IEEE International Symposium on9-13 July 2007 Page(s):1 - 6 Digital Object Identifier 10.1109/ISEMC.2007. 186
[20] Ponchak, G.E.; Donghoon Chun; Jong-Gwan Yook; Katehi, L.P.B.;“The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages”. Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on]Volume 23, Issue 1, Feb. 2000 Page(s):88 - 99 Digital Object Identifier 10.1109/6040.826766
[21] Ingram, D.L.; Sjogren, L.; Kraus, J.; Nishimoto, M.; Siddiqui, M.; Sing, S.; Cha, K.; Huang, M.; Lai, R.;“A highly integrated multi-functional chip set for low cost Ka-band transceiver”.Microwave Symposium Digest, 1998 IEEE MTT-S InternationalVolume 1, 7-12 June 1998 Page(s):301 - 304 vol.1 Digital Object Identifier 10.1109/MWSYM.1998. 689379
[22] .Guo, Y.X. (Institute for Infocomm Research); Ong, L.C.; Luo, B.; Chia, M.Y.W.; Karppinen, M.; Kautio, K.; Makinen, J.-T.; Ollila, J.“An LTCC optical transceiver for radio-over-fiber”.35th European Microwave Conference 2005 - Conference Proceedings, v 1, 35th European Microwave Conference 2005 - Conference Proceedings, 2005, p 121-123
[23] .Pergola, Luca (Department of Information Technology and Electrical Engineering, Swiss Federal Institute of Technology, Eidgenossische Technische Hochschule Zurich); Gindera, Ralf; Jager, Dieter; Vahldieck, Rudiger.“An LTCC-based wireless transceiver for radio-over-fiber applications”.IEEE Transactions on Microwave Theory and Techniques, v 55, n 3, March, 2007, p 579-587
[24] Jung, Young-Bae (Electron. and Telecommun. Res. Inst.); Eom, Soon-Young; Jeon, Soon-Ik; Choi, Jae-Ick; Park, Han-Kyu.“The design of T/R module for X-band APAA system used in satellite communications”.IEEE MTT-S International Microwave Symposium Digest, v 2, 2002, p 1337-1340
[25] Dai, Yuefei (East China Research Institute of Electronic Engineering); Lv, Chunming; Xie, Quin; Han, Jun,“Double mode X-band T/R module based on LTCC”,CIE International Conference of Radar Proceedings, 2006 CIE International Conference on Radar, ICR 2006, 2007, p 4148588
[26] Sten E. GunnarssonI. Camilla Karnfelt'.“Single-chip 60 GHz transmitter and receiver MMICs in a GaAs mHEMT technology”. IEEE MTT-S International Microwave Symposium Digest, 2006, p 801-804
[27] W. Simon, J. Kassner,“Highly integrated KA-Band Tx frontend module including 8x8 antenna array”. IEEE, 2009
[28]潘光胜,“毫米波接收前端LTCC技术研究”,电子科技大学2005年硕士论文
[29]曾勇,“LTCC微波组件集成技术研究”,电子科技大学2007年硕士论文
[30]张凯,“毫米波LTCC收发组件研究”,电子科技大学2007年硕士论文
[31]张琦,苏东林,张德智,“基于LTCC多层基板的X波段T/R组件小型化设计”,现代电子技术》2007年第1期总第240期
[32]严伟,禹胜林,房迅雷,“基于LTCC技术的三维集成微波组件”,电子学报2005年第11期
[33]王周海,李雁,王小陆,郑林华,“X波段双通道T/R组件的L TCC基板电路的设计”,雷达科学与技术2005年第五期
[34] Shengzhang Zhang, Yubo Cui and Yujing Guan,”A Ka Band Transceiver Using LTCC Technology”, IEEE 2007 International Symposium on Microwave, Antenna, Propagation, and EMC Technologies For Wireless Communications
[35]文杰,“Ka波段精确制导收发前端的研究”,电子科技大学2008年硕士论文
[36]李平,“毫米波精确制导收发前端LTCC技术研究”,电子科技大学2009年硕士论文
[37] H.Furuyama, (in Japanese), JP Patent, Application no.H4-220881, July 1992
[38] M.Yamamoto and K.Itoh,“Slot-coupled microstrip antenna with a triplate line feed where paralledl-plate mode is suppressed,”Electron.Lett. , vol.33, no.6, pp.631-634,1997
[39] H.Uchinura, T.Takenoshit,and M.Fuji,,“Development of a laminated waveguide,”IEEE Trans.Microw.Theory Tech, vol.46, no 12,pp. 2438-2443,Dec.1998
[40]李皓.基片集成波导不连续性问题的研究.东南大学博士学位论文,2005.4
[41]岳桂芹.基于基片集成波导技术无源器件的研究.电子科技大学硕士学位论文,2008.5
[42]兰尧.基片集成波导的应用和仿真研究.电子科技大学硕士学位论文,2006.3
[43] Jia-Sheng Hong, and M.J.Lancaster, Microstrip Filters for RF/Microwave Applications, New York: Wiley, 2001
[44] Ka Fai Chang, Kam Weng Tam, Miniaturized Cross Coupled Filter with Second and Third Spurious Responses Suppression, IEEE microwave and wireless components letters, vol.15,NO.2,Feb,2005
[45] Rui-Jie Mao, Xiao-Hong Tang, Ling Wang, and Guo-Hong Du, Miniaturized Hexagonal Stepped Impedance Resonators and Their Applications to Filters, IEEE transactions on microwave theory and techniques, vol.56,NO.2,Feb,2008
[46] J.S.Hong, and M.J.Lancaster,‘Microstrip Filters for RF/ Microwave Application’. New York, NY: Wiley, 2001
[47] Y.Konishi , K.Venakada ;“The design of a bandpass filter with inductive strip-planar circuit mounted in waveguide”IEEE Trans. MTT , 1974;22 (10):869-878
[48] W. Hong, Y. Wang, Q. H. Lai, and B. Liu,“Half mode substrate integrated waveguide: A new guided wave structure for microwave and millimeter wave application,”in Proc. Joint 31st Int. Conf. Infr. Millim. Waves 14th Int. Conf. Terahertz Electron., Shanghai, China,Sep. 18–22, 2006.
[49] B. Liu, W. Hong, Y. Q. Wang, Q. H. Lai, and K. Wu,“Half mode substrate integrated waveguide (HMSIW) 3 dB coupler,”IEEE Microw. Wireless Compon. Lett., vol. 17, no. 1, pp. 22–24, Jan. 2007
[50] Y.Q. Wang, W. Hong, Y. D. Dong, B. Liu, H.J. Tang, J.X. Chen, X.X. Yin and K. Wu,“Half mode substrate integrated waveguide (HMSIW) bandpass filter,”IEEE Microw. Wireless Compon. Lett., vol. 17, no.4, pp. 265–267, Apr. 2007
[51] Shuiping Zhou, Zhigang Wang, Ruimin Xu, and Dili Shen“A Novel X-band Half Mode Substrate Integrated Waveguide (HMSIW) Bandpass Filter”,2009 Asia Pacific Microwave Conference
[52]毛睿杰. Ka波段低噪声接收前端研究.成都:电子科技大学硕士学位论文,2005: 57~66
[53]税兰英. Q波段宽带四倍频器的研制.成都:电子科技大学硕士学位论文,2007:5~6
[54]黄香馥,陈天麒,张开智.微波固体电路.成都:成才电讯工程学院出版社, 1988
[55]廖承恩.微波技术基础.西安:西安电子科技大学出版社,1994
[56]赖邱亮.毫米波宽带收发组件技术研究.成都:电子科技大学硕士学位论文,2009: 27~43
[57] David M.Pozar(张肇仪等译) .微波工程.北京:电子工业出版社,2006年
[58]顾其铮,项家桢,袁孝康.微波集成电路设计.北京:人民邮电出版社,1978年
[59]薛良金.毫米波工程基础.哈尔滨:哈尔滨工业大学出版社,2004
[60]杨非.毫米波T/R组件的研究与设计.成都:电子科技大学硕士学位论文,2005:62~63.
[61]周水平,王志刚,李平,徐锐敏“基于介质集成波导(SIW)的三路零相位功率分配合成器”, 2009年全国微波毫米波会议
[2]陈定昌,袁起,范金荣.精确制导武器发展趋势.现代防御技术,2000,第4期
[3]杨树谦.国外精确制导技术发展述评.飞航导弹,2001,第6期
[4]夏思宇.精确制导技术及其现状与发展.航空科学技术,2003,第1期
[5] Powell, J.R. (QinetiQ Ltd.); Munday, P.D.; Tang, W.H.A.; Hunt, R.C.; Gunton, D.J.“MMIC and module design and performance for millimetric transceiver front-ends for transport applications”.IEEE MTT-S International Microwave Symposium Digest, 2006 IEEE MTT-S International Microwave Symposium Digest, 2006, p 1497-1500
[6] Hong, Seungpyo (Dept. of Electrical and Computer Engineering, Texas A and M University); Coutant, Matthew R.; Chang, Kai.“An ultra wideband transmit/receive module operating from 10 to 35 GHz for phased array applications”.IEEE MTT-S International Microwave Symposium Digest, 2006 IEEE MTT-S International Microwave Symposium Digest, 2006, p 2007-2010
[7] Kok, Yon-Lin (TRW); Ahmadi, Morteza; Wang, Huei; Allen, Barry R.; Lin, Tzuen;“Ka-band monolithic single-chip transceiver using sub-harmonic mixer”.IEEE MTT-S International Microwave Symposium Digest, v 1, 1998, p 309-311
[8] Van Vliet, F.E. (TNO Phys. and Electronics Laboratory); De Boer, A.“Fully-integrated core chip for X-band phased-array T/R modules”.IEEE MTT-S International Microwave Symposium Digest, v 3, 2004 IEEE MITT-S International Microwave Symposium Digest, 2004, p 1753-1756
[9] Berenz, J. (TRW Inc, Redondo Beach, CA, USA); LaCon, M.; Luong, M.“Single chip Ka-band transceiver”.IEEE MTT-S International Microwave Symposium Digest, v 2, 1991, p 517-520
[10] .Maruhashi, K.; Ito, M.; Kishimoto, S.; Ohata, K.;“60-GHz-band LTCC module technology for wireless gigabit transceiver applications”Radio-Frequency Integration Technology: Integrated Circuits for Wideband Communication and Wireless Sensor Networks, 2005. Proceedings. 2005 IEEE International Workshop on30 Nov.-2 Dec. 2005 Page(s):131 - 134 Digital Object Identifier 10.1109/RFIT.2005.1598892
[11] Lee, C.-H.; Sutono, A.; Han, S.; Laskar, J.;“A compact LTCC Ku-band transmitter module with integrated filter for satellite communication applications”, Microwave Symposium Digest, 2001 IEEE MTT-S International Volume 2, 20-25 May 2001 Page(s):945 - 948 vol.2 Digital Object Identifier 10.1109/MWSYM.2001.967048
[12] Chang-Ho Lee; Sutono, A.; Sangwoo Han; Kyutae Lim; Pinel, S.; Tentzeris, E.M.; Laskar, J.;“A compact LTCC-based Ku-band transmitter module”Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on]Volume 25, Issue 3, Aug. 2002 Page(s):374 - 384 Digital Object Identifier 10.1109/TADVP.2002.805315
[13] Kyutae Lim; Obatoyinbo, A.; Sutono, A.; Chakraborty, S.; Chang-Ho Lee; Gebara, E.; Raghavan, A.; Laskar, J. A highly integrated transceiver module for 5.8 GHz OFDM communication system using multi-layer packaging technology”Microwave Symposium Digest, 2001 IEEE MTT-S International Volume 3, 20-25 May 2001 Page(s):1739 - 1742 vol.3 Digital Object Identifier 10.1109/MWSYM.2001.967242
[14] Lee, C.-H.; Chakraborty, S.; Sutono, A.; Yoo, S.; Heo, D.; Laskar, J.;“Broadband highly integrated LTCC front-end module for IEEE 802.11a WLAN applications”; Microwave Symposium Digest, 2002 IEEE MTT-S InternationalVolume2,2-7 June 2002 Page(s):1045-1048 Digital Object Identifier 10.1109/MWSYM.2002.1011816
[15] Gauthier, G.; Bertinet, J.P.; Schroth, J.“Low-Cost Ka-Band Transmitter for VSAT Applications”. Microwave Symposium Digest, 2006. IEEE MTT-S International June 2006 Page(s):1398 - 1401 Digital Object Identifier 10.1109/MWSYM.2006.249530
[16] Young Chul Lee; Chul Soon Park;“A 60GHz strip line BPF for LTCC system-in-package applications”. Microwave Symposium Digest, 2005 IEEE MTT-S International12-17 June 2005 Page(s):4 pp. Digital Object Identifier 10.1109/MWSYM.2005.1516950
[17] Heyen, J.; von Kerssenbrock, T.; Chernyakov, A.; Heide, P.; Jacob, A.F;Novel LTCC/BGA modules for highly integrated millimeter-wave transceivers”. Microwave Theory and Techniques, IEEE Transactions on Volume 51,Issue 12, Dec. 2003 Page(s):2589 - 2596 .Digital Object Identifier 10.1109/TMTT.2003.819210
[18] Jong-Hoon Lee; Kidera, N.; DeJean, G.; Pinel, S.; Laskar, J.; Tentzeris, M.M.;“A V-band front-end with 3-D integrated cavity filters/duplexers and antenna in LTCC technologies”Microwave Theory and Techniques, IEEE Transactions on Volume 54, Issue 7, July 2006 Page(s):2925 - 2936 Digital Object Identifier 10.1109/TMTT.2006.877440
[19] Park, Jongbae; Kim, Junchul; Lu, Albert Chee W.; Shim, Yujeong; Kim, Joungho;“Noise Isolation in LTCC-Based X/Ku-Band Transceiver SiP Using Double-Stacked Electromagnetic Bandgap Structure”. Electromagnetic Compatibility, 2007. ISEMC 2007. IEEE International Symposium on9-13 July 2007 Page(s):1 - 6 Digital Object Identifier 10.1109/ISEMC.2007. 186
[20] Ponchak, G.E.; Donghoon Chun; Jong-Gwan Yook; Katehi, L.P.B.;“The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages”. Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on]Volume 23, Issue 1, Feb. 2000 Page(s):88 - 99 Digital Object Identifier 10.1109/6040.826766
[21] Ingram, D.L.; Sjogren, L.; Kraus, J.; Nishimoto, M.; Siddiqui, M.; Sing, S.; Cha, K.; Huang, M.; Lai, R.;“A highly integrated multi-functional chip set for low cost Ka-band transceiver”.Microwave Symposium Digest, 1998 IEEE MTT-S InternationalVolume 1, 7-12 June 1998 Page(s):301 - 304 vol.1 Digital Object Identifier 10.1109/MWSYM.1998. 689379
[22] .Guo, Y.X. (Institute for Infocomm Research); Ong, L.C.; Luo, B.; Chia, M.Y.W.; Karppinen, M.; Kautio, K.; Makinen, J.-T.; Ollila, J.“An LTCC optical transceiver for radio-over-fiber”.35th European Microwave Conference 2005 - Conference Proceedings, v 1, 35th European Microwave Conference 2005 - Conference Proceedings, 2005, p 121-123
[23] .Pergola, Luca (Department of Information Technology and Electrical Engineering, Swiss Federal Institute of Technology, Eidgenossische Technische Hochschule Zurich); Gindera, Ralf; Jager, Dieter; Vahldieck, Rudiger.“An LTCC-based wireless transceiver for radio-over-fiber applications”.IEEE Transactions on Microwave Theory and Techniques, v 55, n 3, March, 2007, p 579-587
[24] Jung, Young-Bae (Electron. and Telecommun. Res. Inst.); Eom, Soon-Young; Jeon, Soon-Ik; Choi, Jae-Ick; Park, Han-Kyu.“The design of T/R module for X-band APAA system used in satellite communications”.IEEE MTT-S International Microwave Symposium Digest, v 2, 2002, p 1337-1340
[25] Dai, Yuefei (East China Research Institute of Electronic Engineering); Lv, Chunming; Xie, Quin; Han, Jun,“Double mode X-band T/R module based on LTCC”,CIE International Conference of Radar Proceedings, 2006 CIE International Conference on Radar, ICR 2006, 2007, p 4148588
[26] Sten E. GunnarssonI. Camilla Karnfelt'.“Single-chip 60 GHz transmitter and receiver MMICs in a GaAs mHEMT technology”. IEEE MTT-S International Microwave Symposium Digest, 2006, p 801-804
[27] W. Simon, J. Kassner,“Highly integrated KA-Band Tx frontend module including 8x8 antenna array”. IEEE, 2009
[28]潘光胜,“毫米波接收前端LTCC技术研究”,电子科技大学2005年硕士论文
[29]曾勇,“LTCC微波组件集成技术研究”,电子科技大学2007年硕士论文
[30]张凯,“毫米波LTCC收发组件研究”,电子科技大学2007年硕士论文
[31]张琦,苏东林,张德智,“基于LTCC多层基板的X波段T/R组件小型化设计”,现代电子技术》2007年第1期总第240期
[32]严伟,禹胜林,房迅雷,“基于LTCC技术的三维集成微波组件”,电子学报2005年第11期
[33]王周海,李雁,王小陆,郑林华,“X波段双通道T/R组件的L TCC基板电路的设计”,雷达科学与技术2005年第五期
[34] Shengzhang Zhang, Yubo Cui and Yujing Guan,”A Ka Band Transceiver Using LTCC Technology”, IEEE 2007 International Symposium on Microwave, Antenna, Propagation, and EMC Technologies For Wireless Communications
[35]文杰,“Ka波段精确制导收发前端的研究”,电子科技大学2008年硕士论文
[36]李平,“毫米波精确制导收发前端LTCC技术研究”,电子科技大学2009年硕士论文
[37] H.Furuyama, (in Japanese), JP Patent, Application no.H4-220881, July 1992
[38] M.Yamamoto and K.Itoh,“Slot-coupled microstrip antenna with a triplate line feed where paralledl-plate mode is suppressed,”Electron.Lett. , vol.33, no.6, pp.631-634,1997
[39] H.Uchinura, T.Takenoshit,and M.Fuji,,“Development of a laminated waveguide,”IEEE Trans.Microw.Theory Tech, vol.46, no 12,pp. 2438-2443,Dec.1998
[40]李皓.基片集成波导不连续性问题的研究.东南大学博士学位论文,2005.4
[41]岳桂芹.基于基片集成波导技术无源器件的研究.电子科技大学硕士学位论文,2008.5
[42]兰尧.基片集成波导的应用和仿真研究.电子科技大学硕士学位论文,2006.3
[43] Jia-Sheng Hong, and M.J.Lancaster, Microstrip Filters for RF/Microwave Applications, New York: Wiley, 2001
[44] Ka Fai Chang, Kam Weng Tam, Miniaturized Cross Coupled Filter with Second and Third Spurious Responses Suppression, IEEE microwave and wireless components letters, vol.15,NO.2,Feb,2005
[45] Rui-Jie Mao, Xiao-Hong Tang, Ling Wang, and Guo-Hong Du, Miniaturized Hexagonal Stepped Impedance Resonators and Their Applications to Filters, IEEE transactions on microwave theory and techniques, vol.56,NO.2,Feb,2008
[46] J.S.Hong, and M.J.Lancaster,‘Microstrip Filters for RF/ Microwave Application’. New York, NY: Wiley, 2001
[47] Y.Konishi , K.Venakada ;“The design of a bandpass filter with inductive strip-planar circuit mounted in waveguide”IEEE Trans. MTT , 1974;22 (10):869-878
[48] W. Hong, Y. Wang, Q. H. Lai, and B. Liu,“Half mode substrate integrated waveguide: A new guided wave structure for microwave and millimeter wave application,”in Proc. Joint 31st Int. Conf. Infr. Millim. Waves 14th Int. Conf. Terahertz Electron., Shanghai, China,Sep. 18–22, 2006.
[49] B. Liu, W. Hong, Y. Q. Wang, Q. H. Lai, and K. Wu,“Half mode substrate integrated waveguide (HMSIW) 3 dB coupler,”IEEE Microw. Wireless Compon. Lett., vol. 17, no. 1, pp. 22–24, Jan. 2007
[50] Y.Q. Wang, W. Hong, Y. D. Dong, B. Liu, H.J. Tang, J.X. Chen, X.X. Yin and K. Wu,“Half mode substrate integrated waveguide (HMSIW) bandpass filter,”IEEE Microw. Wireless Compon. Lett., vol. 17, no.4, pp. 265–267, Apr. 2007
[51] Shuiping Zhou, Zhigang Wang, Ruimin Xu, and Dili Shen“A Novel X-band Half Mode Substrate Integrated Waveguide (HMSIW) Bandpass Filter”,2009 Asia Pacific Microwave Conference
[52]毛睿杰. Ka波段低噪声接收前端研究.成都:电子科技大学硕士学位论文,2005: 57~66
[53]税兰英. Q波段宽带四倍频器的研制.成都:电子科技大学硕士学位论文,2007:5~6
[54]黄香馥,陈天麒,张开智.微波固体电路.成都:成才电讯工程学院出版社, 1988
[55]廖承恩.微波技术基础.西安:西安电子科技大学出版社,1994
[56]赖邱亮.毫米波宽带收发组件技术研究.成都:电子科技大学硕士学位论文,2009: 27~43
[57] David M.Pozar(张肇仪等译) .微波工程.北京:电子工业出版社,2006年
[58]顾其铮,项家桢,袁孝康.微波集成电路设计.北京:人民邮电出版社,1978年
[59]薛良金.毫米波工程基础.哈尔滨:哈尔滨工业大学出版社,2004
[60]杨非.毫米波T/R组件的研究与设计.成都:电子科技大学硕士学位论文,2005:62~63.
[61]周水平,王志刚,李平,徐锐敏“基于介质集成波导(SIW)的三路零相位功率分配合成器”, 2009年全国微波毫米波会议