摘要
星载电子设备通常要经历各种振动环境,在恶劣的随机振动环境中,设备中的元器件管脚及焊点容易出现疲劳问题。文章应用Miner疲劳损伤累积理论及三带宽技术,提出了一种实用有效的分析元器件管脚及焊点进行随机振动疲劳寿命的方法。
Spacecraft electronic equipments often suffer all kinds of vibration environments.The lead and solder may be fatigue in the rough stochastic vibration.The paper presents a practical and effective method to analyze the fatigue of lead and solder in the stochastic vibration on the basis of Miner′s Cumulative Damage and Three Band Technique.
引文
[1]Steinberg D S.Vibration analysis for electronic equipment[M].USA John Wiley&Sons,INC 2000
[2]庄表中,陈乃立.随机振动的理论及实例分析[M].北京:地震出版社,1985
[3]倪振华.振动力学[M].西安:西安交通大学出版社,1986
[4]李裕奇.随机过程[M].北京:国防工业出版,2003
[5]Clough R W.Dynamics of structures[M].USA Comput-ers&Structures,Inc.1995,University Ave.Berkeley,CA94704