室温固化环氧灌封胶的制备与性能研究
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摘要
以环氧树脂(E-51)为基体、1,4-丁二醇缩水甘油醚为稀释剂、甲基丙烯酸甲酯-丁二烯-苯乙烯三元共聚物为核壳增韧剂、硅微粉为填料、三乙烯四胺为固化剂,以及消泡剂、防沉剂等助剂制备室温固化环氧灌封胶,研究了混合黏度、压缩强度、压缩模量和玻璃化转变温度(T_g)以及固化放热等各项性能。结果表明,当固化剂掺量为环氧树脂质量的15%时,该室温固化环氧灌封胶综合性能最好。采用一次非等温DSC法进行固化动力学研究,得到不同温度下的固化反应程度(固化度)与反应时间的简易数学模型:α=1-exp[-46313775·exp(-8428.38/T)·t]。
Using epoxy resin(E-51) as the matrix material, 1,4-butanediol diglycidyl ether as the thinner, MB(methyl methacrylate-butadiene-styrene terpolymer) as the flexibilizer, triethylenetetramine as the curing agent, silica powder as the filler, defoamer and anti-sedimentation agent, the room temperature curable epoxy pouring sealants were prepared. The viscosity, compression strength, compression modulus, T_g and curing exothermic behavior of the sealant were investigated. The results showed that the room temperature curable epoxy pouring sealant had the best combination properties when the content of curing agent was 15% by the epoxy resin weight. The curing kinetics was studed by one-step non-isothermal DSC method. A simple mathematical model of curing reaction degree(curing degree) versus reaction time at different temperature was obtained: α=1-exp[-46313775 exp(-8428.38/T)t].
Using epoxy resin(E-51) as the matrix material, 1,4-butanediol diglycidyl ether as the thinner, MB(methyl methacrylate-butadiene-styrene terpolymer) as the flexibilizer, triethylenetetramine as the curing agent, silica powder as the filler, defoamer and anti-sedimentation agent, the room temperature curable epoxy pouring sealants were prepared. The viscosity, compression strength, compression modulus, T_g and curing exothermic behavior of the sealant were investigated. The results showed that the room temperature curable epoxy pouring sealant had the best combination properties when the content of curing agent was 15% by the epoxy resin weight. The curing kinetics was studed by one-step non-isothermal DSC method. A simple mathematical model of curing reaction degree(curing degree) versus reaction time at different temperature was obtained: α=1-exp[-46313775 exp(-8428.38/T)t].
引文
[1]孙曼灵.环氧树脂应用原理与技术[M].北京:机械工业出版社,2003.
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[4]王浩,陈亚菊,李印柏,等.室温固化高强度无卤离火自熄型环氧浇注体及其制备方法[P].CN201410787735.3,2016-09-21.
[5]王浩,师力.机械设备定位浇注型环氧树脂垫片的制备与性能研究[J].中国胶粘剂,2017,26(8):24-28.
[6]Matthias Wagner,陆立明.热分析应用基础[M].上海:东华大学出版社,2011.
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[3]廖宏,马玉珍,魏大超,等.低黏度室温固化环氧灌封胶的研制[J].粘接,2004,25(1):12-14.
[4]王浩,陈亚菊,李印柏,等.室温固化高强度无卤离火自熄型环氧浇注体及其制备方法[P].CN201410787735.3,2016-09-21.
[5]王浩,师力.机械设备定位浇注型环氧树脂垫片的制备与性能研究[J].中国胶粘剂,2017,26(8):24-28.
[6]Matthias Wagner,陆立明.热分析应用基础[M].上海:东华大学出版社,2011.
[7]张竞,李全步,蒋英,等.非等温DSC法研究高韧性低收缩环氧体系固化动力学[J].高分子材料科学与工程,2009,25(6):99-102.