双酚E型氰酸酯的固化度与性能的关系研究
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摘要
制备了不同固化度的双酚E型氰酸酯浇铸体,研究了双酚E型氰酸酯树脂的固化动力学,并通过导热性能、吸水性能及介电性能测试研究了氰酸酯固化度与其性能的关系。结果表明:双酚E型氰酸酯固化反应属于自催化反应,材料的导热性能随着固化度的增加而提高,当固化度从50%增加至99.5%时,热导率从0.21增加到0.23 W/(m·K)。随着固化度的增加,介电损耗tanδ显著降低。固化度对材料的吸水性能影响较小。
The bisphenol E type cyanate castings with different curing degrees were prepared. The curing kinetics of bisphenol E type cyanate resin was studied. The relationship between cyanate ester curing degree and its performance was studied by testings of thermal conductivity,water absorption and dielectric property. The results showed that the bisphenol E type cyanate curing reaction was an autocatalytic reaction. The thermal conductivity of the materials was increased with the increasing of curing degree. When the curing degree was increased from 50% to 99.5%,the thermal conductivity was increased from 0.21 to 0.23 W/(m·K). With the increasing of curing degree,the dielectric loss tan δ was decreased significantly and the curing degree had little effect on the water absorption properties of the materials.
The bisphenol E type cyanate castings with different curing degrees were prepared. The curing kinetics of bisphenol E type cyanate resin was studied. The relationship between cyanate ester curing degree and its performance was studied by testings of thermal conductivity,water absorption and dielectric property. The results showed that the bisphenol E type cyanate curing reaction was an autocatalytic reaction. The thermal conductivity of the materials was increased with the increasing of curing degree. When the curing degree was increased from 50% to 99.5%,the thermal conductivity was increased from 0.21 to 0.23 W/(m·K). With the increasing of curing degree,the dielectric loss tan δ was decreased significantly and the curing degree had little effect on the water absorption properties of the materials.
引文
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[2] Dong Y. Review on curing agents for functional epoxy resin[J]. Thermosetting Resin,1997,12(2):55-57.
[3] Sun Y,Xun R X,Wang J,et al. Study on the modified cyanate ester resin system for resin transfer molding process[J]. Thermosetting Resin,2016,31(5):48-51.
[4] Schawe J E K. A Description of chemical and diffusion control in isothermal kinetics of cure kinetics[J]. Thermochimica Act,2002,388(1/2):299-312.
[5] Liu T S,Zhang B Y,Chen X B. Study on the cure kinetics of middle temperature curing epoxy resin system[J]. Journal of Aeron Autical Materials,2005,25(1):45-47.
[6]益小苏.先进树脂基复合材料高性能化理论与实践[M].北京:国防工业出版社,2011.
[7] Guo Zh Sh,Du Sh Y,Zhang B M,et al. Cure kinetics and chemo rheological behavior of epoxy resin used in advanced composites[J].Acta Materiae Compositae Sinica,2004,21(4):146-151.
[8]代晓青,肖加余.等温DSC法研究RFI用环氧树脂固化动力学[J].复合材料学报,2008,25(4):19-23.
[9] Ng S J,Boswell R,Laus S J,et al. Degree of cure,heat of reaction and viscosity of 8552 and 977-3 HM epoxy resins[J]. Journal of Advanced Materials,2002,34(2):33-37.