Effect of current density on microstructure and mechanical property of Cu micro-cylinders electrodeposited in through silicon vias
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- 作者：Huiying Wanga ; Ping Chenga ; pcheng2008@sjtu.edu.cn" class="auth_mail" title="E-mail the corresponding author ; Hong Wanga ; Rui Liub ; Liming Sunc ; Qunli Raoc ; Zhaoyu Wanga ; Ting Gua ; Guifu Dinga ; gfding@sjtu.edu.cn" class="auth_mail" title="E-mail the corresponding author
- 关键词：Cu-TSVs ; Current density ; Mechanical property ; Microstructure ; EBSD ; XPS
- 刊名：Materials Characterization
- 出版年：2015
- 出版时间：November 2015
- 年：2015
- 卷：109
- 期：Complete
- 页码：164-172
- 全文大小：2637 K
文摘
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The yield strength of the electrodeposited Cu micro-cylinders was measured using a self-made micro-compression system.
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The influence of the current density on the microstructure and strength of Cu micro-cylinders was studied.
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The factors influencing the yield strength of Cu micro-cylinders were revealed.