Three-Dimensional Metallic Microstructures Fabricated by Soft Lithography and Microelectrodeposition
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- 作者：Rebecca J. Jackman ; Scott T. Brittain ; Allan Adams ; Hongkai Wu ; Mara G. Prentiss ; Sue Whitesides ; and George M. Whitesides
- 刊名：Langmuir
- 出版年：1999
- 出版时间：February 2, 1999
- 年：1999
- 卷：15
- 期：3
- 页码：826 - 836
- 全文大小：658K
- 年卷期：v.15,no.3(February 2, 1999)
- ISSN：1520-5827
文摘
Soft lithography offers a convenient set of methods for the transfer of patterns to planar and nonplanarsubstrates. Microelectrodeposition can transform thin metal patterns into self-supporting microstructures,weld components together, and strengthen microstructures after deformations. Together, soft lithographyand electrochemistry provide synergistic technologies and the basis for a strategy for converting planarpatterns into three-dimensional (3D) microstructures with complex topologies. This strategy is illustratedin the formation of folded tetrahedra, square-based pyramids, cylinders with joints, "pop-up" cubes, andlinked chains and knots.