Wafer-Scale Pattern Transfer of Metal Nanostructures on Polydimethylsiloxane (PDMS) Substrates via Holographic Nanopatterns
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- 作者：Ke Du ; Ishan Wathuthanthri ; Yuyang Liu ; Wei Xu ; Chang-Hwan Choi
- 刊名：ACS Applied Materials & Interfaces
- 出版年：2012
- 出版时间：October 24, 2012
- 年：2012
- 卷：4
- 期：10
- 页码：5505-5514
- 全文大小：686K
- 年卷期：v.4,no.10(October 24, 2012)
- ISSN：1944-8252
文摘
In this paper, we report on a cost-effective and simple, nondestructive pattern transfer method that allows the fabrication of metallic nanostructures on a polydimethylsiloxane (PDMS) substrate on a wafer scale. The key idea is to use holographic nanopatterns of a photoresist (PR) layer as template structures, where a metal film is directly deposited in order to replicate the nanopatterns of the PR template layer. Then, the PDMS elastomer is molded onto the metal film and the metal/PDMS composite layer is directly peeled off from the PR surface. Many metallic materials including Ti, Al, and Ag were successfully nanopatterned on PDMS substrates by the pattern transfer process with no use of any adhesion promoter layer or coating. In case of Au that has poor adhesion to PDMS material, a salinization of the metal surface with 3-(aminopropyl)-triethoxysilane (APTES) monolayer promoted the adhesion and led to successful pattern transfer. A series of adhesion tests confirmed the good adhesion of the transferred metal films onto the molded PDMS substrates, including scotch-tape and wet immersion tests. The inexpensive and robust pattern transfer approach of metallic nanostructures onto transparent and flexible PDMS substrates will open the new door for many scientific and engineering applications such as micro-/nanofluidics, optofluidics, nanophotonics, and nanoelectronics.