Hierarchical Three-Dimensional Layer-by-Layer Assembly of Carbon Nanotube Wafers for Integrated Nanoelectronic Devices
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- 作者：Takeo Yamada ; Natsumi Makiomoto ; Atsuko Sekiguchi ; Yuki Yamamoto ; Kazufumi Kobashi ; Yuhei Hayamizu ; Yoshiki Yomogida ; Hiroyuki Tanaka ; Hisashi Shima ; Hiroyuki Akinaga ; Don N. Futaba ; Kenji Hata
- 刊名：Nano Letters
- 出版年：2012
- 出版时间：September 12, 2012
- 年：2012
- 卷：12
- 期：9
- 页码：4540-4545
- 全文大小：559K
- 年卷期：v.12,no.9(September 12, 2012)
- ISSN：1530-6992
文摘
We report a general approach to overcome the enormous obstacle of the integration of CNTs into devices by bonding single-walled carbon nanotubes (SWNTs) films to arbitrary substrates and transferring them into densified and lithographically processable 鈥淐NT wafers鈥? Our approach allows hierarchical layer-by-layer assembly of SWNTs into organized three-dimensional structures, for example, bidirectional islands, crossbar arrays with and without contacts on Si, and flexible substrates. These organized SWNT structures can be integrated with low-power resistive random-access memory.