In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction

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• 作者：Q.K. Zhang ; Z.F. Zhang ; ^{zhfzhang@imr.ac.cn}
• 关键词：Sn&ndash ; 4Ag solder ; In situ tensile creep ; Electron backscatter diffraction (EBSD) ; Polygonization ; Grains subdivision
• 刊名：Scripta Materialia
• 出版年：2012
• 期刊代码：157_13596462
• 类别：et
• 出版时间：August, 2012
• 卷：67
• 期：3
• 页码：289-292
• 文件大小：745 K

摘要

In this study, the in situ tensile creep behaviors of Sn-4Ag/Cu solder joints were observed, and microstructural evolutions of the solder during the deformation processes were characterized by electron backscatter diffraction. The results reveal that slow plastic deformation or grain rotation occurs inside different solder grains, depending on their orientations and distance from the joint interface. When the strain increases to a certain extent, dynamic recovery occurs inside some solder grains, resulting in polygonization and grain subdivision.