Evaluation of curing kinetic parameters of an epoxy/polyaminoamide/nano-glassflake system by non-isothermal differential scanning calorimetry

详细信息	查看全文 | 推荐本文 |

• 作者：Mehdi Ghaffari^a ; ^b ; ^c ; Morteza Ehsani^a ; ^{m.ehsani@ippi.ac.ir} ; Hossein Ali Khonakdar^a ; Guy Van Assche^b ; Herman Terryn^c
• 关键词：Epoxy ; Polyaminoamide ; Nano-glassflakes ; Curing kinetics ; Differential scanning calorimetry ; Non-isothermal
• 刊名：Thermochimica Acta
• 出版年：2012
• 期刊代码：110_00406031
• 类别：ch
• 出版时间：10 April, 2012
• 卷：533
• 期：Complete
• 页码：10-15
• 文件大小：448 K

摘要

The curing kinetics of diglycidyl ether of bisphenol-A epoxy resin cured with a polyaminoamide in the absence and presence of nano-glassflakes were studied by means of non-isothermal differential scanning calorimetry experiments at four heating rates. The data were analyzed by different approaches. The experimental data for both neat and nano-glassflakes filled systems are well-represented by an nth-order behavior. The calculated ln(A/s^鈭?), E_a, and n for the neat system and nano-glassflakes filled systems are 9.52, 49.6 kJ mol^鈭?, and 1.00, and 8.98, 47.83 kJ mol^鈭?, and 0.97, respectively. Model-free methods show that the activation energy is roughly constant in both with and without NGF. In all analyses, E_a values of the nano-glassflake filled system are lower than those of the neat epoxy/polyaminoamide throughout the curing reaction, despite lower differences.