Microstructural characterization and mechanical property of active soldering anodized 6061 Al alloy using Sn-3.5Ag-xTi active solders

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• 作者：Wei-Lin Wang ; ^{wangwl77@gmail.com} ; Yi-Chia Tsai¹ ; ^{tij@itri.org.tw}
• 关键词：Metals and alloys ; Mechanical properties ; Microstructure ; Transmission electron microscopy (TEM)
• 刊名：Materials Characterization
• 出版年：2012
• 期刊代码：57_10445803
• 类别：ms
• 出版时间：June, 2012
• 卷：68
• 期：Complete
• 页码：42-48
• 文件大小：1383 K

摘要

Active solders Sn-3.5Ag-xTi varied from x = 0 to 6 wt.%Ti addition were prepared by vacuum arc re-melting and the resultant phase formation and variation of microstructure with titanium concentration were analyzed using X-ray diffraction, optical microscopy and scanning electron microscopy. The Sn-3.5Ag-xTi active solders are used as metallic filler to join with anodized 6061 Al alloy for potential applications of providing a higher heat conduction path. Their joints and mechanical properties were characterized and evaluated in terms of titanium content. The mechanical property of joints was measured by shear testing. The joint strength was very dependent on the titanium content. Solder with a 0.5 wt.%Ti addition can successfully wet and bond to the anodized aluminum oxide layers of Al alloy and posses a shear strength of 16.28 卤 0.64 MPa. The maximum bonding strength reached 22.24 卤 0.70 MPa at a 3 wt.%Ti addition. Interfacial reaction phase and chemical composition were identified by a transmission electron microscope with energy dispersive spectrometer. Results showed that the Ti element reacts with anodized aluminum oxide to form Al₃Ti-rich and Al₃Ti phases at the joint interfaces.