Evolution of Ag₃Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging

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• 作者：T.H. Chuang^a ; L.C. Tsao^b ; ^{tlclung@mail.npust.edu.tw} ; Chien-Han Chung^b ; S.Y. Chang^c
• 关键词：A. Non-ferros metals and alloys ; D. Brazing and soldering ; F. Microstructure
• 刊名：Materials and Design
• 出版年：2012
• 期刊代码：56_02613069
• 类别：ms
• 出版时间：August, 2012
• 卷：39
• 期：Complete
• 页码：475-483
• 文件大小：2086 K

摘要

This paper presents the microstructure and Vickers microhardness of Sn3.5Ag0.5Cu solder doped with trace amounts of TiO₂ nanopowders, obtained with different cooling rate and aging conditions. The experiment results that the coupling effect by cooling rate and TiO₂ nanopowders additions significantly affected primary 尾-Sn phase, Ag₃Sn grain size and spacing of the Ag₃Sn phase, as well as the morphology of Ag₃Sn. Ag₃Sn was relatively spherical at the water-cooling rate and had a needle-like morphology at the air-cooling rate. However, the Ag₃Sn IMC not obviously roughed after aging time at 125 掳C for 7 days. Due to both nano-Ag₃Sn IMC and uniform microstructure of the nano-composite solders, the Vickers microhardness improved, in good agreement with the prediction of the classic theory of dispersion strengthening. It appears that adding trace TiO₂ nanopowders are an efficient way to develop novel high-performance solders.