SEM&EDS技术在集成电路失效分析中的应用和实例分析
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摘要
通过外观检查、X-ray、SAM、电性测试、DECAP等对失效样品做了系统分析,最终通过SEM&EDS发现了失效发生的机理以及金属元素污染对器件的破坏机理。研究表明,封装过程中金属元素污染渗入在包封塑粉料中,造成污染部分的塑粉参杂了金属,而使其绝缘性质改变成导电性质,致使不相连的管脚导通发生短路而造成产品功能失效。实践证明SEM&EDS技术在集成电路失效分析中的重要及关键性分析作用,值得应用和推广。
Through visual inspection,X-ray,SAM,DECAP,Electrical test to do analysis of the failure samples,finally found SEM&EDS failure mechanism and metal contamination of device failure mechanism. Research shows that,in the encapsulation process of metal contamination in the envelope into the plastic powder,the pollution caused by the part of the plastic powder mixed with metal,and the insulating properties change into conductive properties,the pin is not connected via short-circuit caused by product failure. Practice has proved that SEM&EDS technology in integrated circuit failure analysis and critical analysis of the important role,it is worth of application and promotion.
Through visual inspection,X-ray,SAM,DECAP,Electrical test to do analysis of the failure samples,finally found SEM&EDS failure mechanism and metal contamination of device failure mechanism. Research shows that,in the encapsulation process of metal contamination in the envelope into the plastic powder,the pollution caused by the part of the plastic powder mixed with metal,and the insulating properties change into conductive properties,the pin is not connected via short-circuit caused by product failure. Practice has proved that SEM&EDS technology in integrated circuit failure analysis and critical analysis of the important role,it is worth of application and promotion.
引文
[1]张阳.了解集成电路失效分析的步骤[EB/OL].电子发烧友网,http://m.elecfans.com/article/760567.html.[2018-09-05].
[2]Jerry Gao.开短路测试基本原理[EB/OL].集成电路技术,http://www.kanwoda.com/blog/archives/0316150412153.html.[2015-03-12].
[3]费庆宇.集成电路失效分析新技术[J].电子产品可靠性与环境试验,2005,23(4):1-6.
[4]刘炜,汪忠林.浅析电测试在集成电路失效分析中的应用[J].通讯世界,2015(8):209-210.
[5]翟青霞,黄海蛟,刘东,刘克敢.解析SEM&EDS分析原理及应用[J].印制电路信息,2012,(5):66-70.
[2]Jerry Gao.开短路测试基本原理[EB/OL].集成电路技术,http://www.kanwoda.com/blog/archives/0316150412153.html.[2015-03-12].
[3]费庆宇.集成电路失效分析新技术[J].电子产品可靠性与环境试验,2005,23(4):1-6.
[4]刘炜,汪忠林.浅析电测试在集成电路失效分析中的应用[J].通讯世界,2015(8):209-210.
[5]翟青霞,黄海蛟,刘东,刘克敢.解析SEM&EDS分析原理及应用[J].印制电路信息,2012,(5):66-70.