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无溶剂绝缘有机硅浸渍树脂研究进展
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  • 英文篇名:Recent Advances on Solvent-Free Insulation Organosilicon Impregnating Resin
  • 作者:李美江 ; 侯新瑞 ; 吴化军
  • 英文作者:LI Meijiang;HOU Xinrui;WU Huajun;Key Laboratory of Organosilicon Chemistry and Material Technology,Ministry of Education,Hangzhou Normal University;Jiaxing Hindailo Mechanical and Electrical Co.,Ltd.;
  • 关键词:浸渍树脂 ; 绝缘 ; 硅树脂 ; 无溶剂 ; 耐高温
  • 英文关键词:impregnating resin;;insulation;;organosilicon resin;;solvent-free;;heat-resistant
  • 中文刊名:XJKB
  • 英文刊名:Materials China
  • 机构:杭州师范大学有机硅化学及材料技术教育部实验室;嘉兴市新大陆机电有限公司;
  • 出版日期:2018-04-12 09:57
  • 出版单位:中国材料进展
  • 年:2018
  • 期:v.37;No.435
  • 语种:中文;
  • 页:XJKB201803006
  • 页数:7
  • CN:03
  • ISSN:61-1473/TG
  • 分类号:34-40
摘要
绝缘浸渍树脂是电子电气产品绕组的主要绝缘材料,可提高绝缘结构的介电、导热、机械和防护性能。电机电器设备向大容量、轻量化、智能化的发展以及变压器向高电压、远距离传输的发展,对绝缘树脂的质量、可靠性,特别是耐热性提出了更高的要求。无溶剂绝缘有机硅浸渍树脂相较于其他绝缘浸渍树脂,兼具无机和有机材料特点,综合性能优异,是最具发展前景的耐高温浸渍树脂。首先介绍有机硅浸渍树脂分子结构、特性、分类,重点阐述无溶剂绝缘有机硅浸渍树脂的组成、性能以及应用领域,特别对基础树脂和催化剂的制备技术进行了综述。最后,指出无溶剂绝缘有机硅浸渍树脂目前存在的问题和发展趋势。
        Insulation impregnating resin is a kind of important insulation materials of electric and electronic equipment winding,it can improve the dielectric,thermal conductivity,mechanical and protective properties of the insulation system.Along with the high-capacity,lightweight and intelligent development of motor or electrical equipment,as well as the high voltage and long distance transmission development of power transformer,people have put forward a higher requirement for quality and reliability,especially the heat-resistant performance of insulation resin. Comparing with other insulation impregnating resin,solvent-free insulation organosilicon impregnating resin with organic-inorganic hybrid materials characteristics and excellent comprehensive performance,is the most promising heat-resistant insulation impregnating resin. In this review,the molecular structure,peculiarity and classify of insulation organosilicon impregnating resin are firstly introduced,mainly focusing on the composition,properties and application field,especially on the preparation method of solvent-free insulation organosilicon impregnating resin. This review ends with a summary and some perspectives on the challenges and new directions in this exciting and still emerging area of research.
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