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硅微通道板微加工技术研究
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  • 英文篇名:Micromachining Processes for Si Microchannel Plates
  • 作者:王国政 ; 袁云龙 ; 杨超 ; 凌海容 ; 王蓟 ; 杨继凯 ; 李野 ; 端木庆铎
  • 英文作者:WANG Guo-zheng;YUAN Yun-long;YANG Chao;LING Hai-rong;WANG Ji;YANG Ji-kai;LI Ye;DUANMU Qing-duo;School of Science,Changchun University of Science and Technology;
  • 关键词:硅微通道板 ; 光电化学腐蚀 ; 原子层沉积 ; 微加工技术
  • 英文关键词:silicon microchannel plate;;photo-electrochemical etching;;atomic layer deposition;;micromachining
  • 中文刊名:BIGO
  • 英文刊名:Acta Armamentarii
  • 机构:长春理工大学理学院;
  • 出版日期:2018-09-15
  • 出版单位:兵工学报
  • 年:2018
  • 期:v.39;No.258
  • 基金:国家自然科学基金项目(61107027、51502023);; 吉林省科技厅重点科技研发项目(20180201033GX);; 吉林省教育厅项目(20160358)
  • 语种:中文;
  • 页:BIGO201809018
  • 页数:7
  • CN:09
  • ISSN:11-2176/TJ
  • 分类号:143-149
摘要
微通道板(MCP)是二维通道电子倍增器,广泛用于电子、离子、紫外辐射和X-射线的探测与成像。提出一种硅微通道板(Si-MCP)制备工艺,分别采用干法刻蚀和电化学腐蚀微加工技术制备了硅微通道阵列(SMA)。重点研究了硅感应耦合等离子体刻蚀和光电化学腐蚀的特性,结果表明:硅光电化学腐蚀技术易于制备高长径比微通道,微通道侧壁更光滑、可制备倾斜通道、更适合制备Si-MCP.制备出通道周期为6μm、长径比大于50的SMA结构。采用厚层氧化实现了Si-MCP基体绝缘,采用原子层沉积工艺制备了连续倍增极,制作出Si-MCP样品。测试结果表明,采用半导体微加工技术制备的Si-MCP电子增益特性具有可行性。
        Microchannel plate( MCP) is a two-dimensional electronic multiplier widely used for detecting and imaging of electrons,ions,UV radiation,and X-ray. A method for fabricating Si-MCP was proposed and studied. Silicon microchannel arrays( SMA) are prepared by dry etching technology and electrochemical etching process, respectively. The characteristics of multiplex inductively coupled plasma( ICP) etching and photo-electrochemical etching are investigated and discussed. The results indicate that Si photo-electrochemical etching can be used to easily fabricate high aspect ratio microchannel arrays with smooth sidewall and sloped channel,and is more suitable for the preparation of Si-MCP. Si microchannel arrays with 6 μm spacing and more than 50 aspect ratio of microchannel were prepared. The insulation of Si-MCP substrate is solved using thick-layer oxidation. The continuous dynode is prepared by atomic layer deposition( ALD) process. Si-MCP samples were prepared. The measured results indicate that the electron gain of Si-MCP based on micromachining process is feasible.
引文
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