溶剂对PMMA基底上金属薄膜形貌的影响
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摘要
为了研究溶剂对金属薄膜/聚合物基底结构的表界面破坏的影响,利用直流磁控溅射法在PMMA基底上沉积金属钛、铜、铝和镍薄膜,采用无水乙醇、丙酮、三氯甲烷和水四种溶剂接触金属薄膜/基底的表面,用光学显微镜观测薄膜的形貌变化。结果表明:除了水以外,其他溶剂通过薄膜缺陷处渗透到薄膜/基底界面后接触PMMA基底,无水乙醇和丙酮与PMMA基底发生溶胀反应,导致膜基界面断裂,薄膜脱离界面发生屈曲,并发生动态扩展直至稳定;三氯甲烷与PMMA基底发生溶解反应,使得膜基界面断裂,薄膜先脱离界面产生屈曲然后塌陷至界面形成褶皱。薄膜基底结构界面的破坏涉及到溶剂与聚合物基底的物化反应,即能否与基底发生溶胀或者溶解。由此可见,溶剂会对金属膜/聚合物基底结构的完整性产生影响,并且缩短结构的使用寿命。但是可以通过这种方式来制造规则、可控的薄膜屈曲模式。
In order to study the effect of solvents on the surface and interface damage of metal film/polymer substrate structures, we deposited metal titanium, copper, aluminum and nickel thin films on poly(methyl methacrylate)(PMMA) substrates by dc magnetron sputtering method. Four kinds of solvent including anhydrous ethanol, acetone, chloroform and water were used to contact the surface of film/substrate respectively. An optical microscope was used to observe the film morphology. Results show that other than water, the ethanol and acetone penetrated to the film/substrate interface, and then swelled the PMMA substrate, causing interface failure and buckles of the film from the interface, as well as some dynamic propagations. While chloroform dissolved the PMMA substrate, causing interface failure and buckles of the film then collapsing to the substrate. Interface damages are related to physicochemical reaction between solvents and polymers, that is to say whether can solvents swell or dissolve with the substrate. Film delaminating mechanism relies on the stress state of thin film, interfacial toughness as well as the sensitivity of the solvent to the polymer substrate. It can be seen that the solvent will affect the integrity of the metal film/polymer substrate structure and reduce its service life. Yet to the other hand, through this method, regular and controllable patterns of thin films will be manufactured by perfecting experiments and theories.
In order to study the effect of solvents on the surface and interface damage of metal film/polymer substrate structures, we deposited metal titanium, copper, aluminum and nickel thin films on poly(methyl methacrylate)(PMMA) substrates by dc magnetron sputtering method. Four kinds of solvent including anhydrous ethanol, acetone, chloroform and water were used to contact the surface of film/substrate respectively. An optical microscope was used to observe the film morphology. Results show that other than water, the ethanol and acetone penetrated to the film/substrate interface, and then swelled the PMMA substrate, causing interface failure and buckles of the film from the interface, as well as some dynamic propagations. While chloroform dissolved the PMMA substrate, causing interface failure and buckles of the film then collapsing to the substrate. Interface damages are related to physicochemical reaction between solvents and polymers, that is to say whether can solvents swell or dissolve with the substrate. Film delaminating mechanism relies on the stress state of thin film, interfacial toughness as well as the sensitivity of the solvent to the polymer substrate. It can be seen that the solvent will affect the integrity of the metal film/polymer substrate structure and reduce its service life. Yet to the other hand, through this method, regular and controllable patterns of thin films will be manufactured by perfecting experiments and theories.
引文
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16 薛秀丽.沉积在聚合物基底上微纳米金属薄膜的屈曲和断裂行为研究.博士学位论文,天津大学,2014.
17 贾海坤.基底上金属纳米薄膜屈曲行为及其破坏机理研究,博士学位论文,天津大学,2013.
18 Vandeparre H,Damman P.Physical Review Letters,2008,101(12),124301.
19 Baffoun A,Haidara H,Dupuis D,et al.Langmuir,2007,23(18),9447.
2 Taylor A A,Cordill M J,Bowles L,et al.Thin Solid Films,2013,531,354.
3 M?ller J,Reiche D,Bobeth M,et al.Surface and Coatings Technology,2002,150(1),8.
4 Waters P,Volinsky A A.Experimental Mechanics,2006,47(1),163.
5 Uchiyama T,Kato M,Yoshida T.Journal of Power Sources,2012,206,37.
6 Peponas S,Guedda M,Benlahsen M.Solid State Communications,2008,146(1),78.
7 Andreeva D V,Fix D,et al.Advanced Materials,2008,20(14),2789.
8 Som T,Bhargava S,Malhotra M,et al.Applied Physics Letters,1998,72(23),3014.
9 Vlassak J J,Lin Y,Tsui T Y.Materials Science and Engineering:A,2005,391(1),159.
10 Lin Y,Tsui T Y,Vlassak J J.Acta Materialia,2007,55(7),2455.
11 Lin Y,Vlassak J J,Tsui T Y,et al.MRS Proceedings,2011,766,E9.4.
12 Abdallah A A,Bouten P C P,den Toonder J M J,et al.Thin Solid Films,2008,516(6),1063.
13 Vandeparre H,Gabriele S,Brau F,et al.Soft Matter,2010,6(22),5751.
14 Vandeparre H,Damman P.Physical Review Letters,2008,101(12),124301
15 Lee K,Lee S,Khang D Y,et al.Soft Matter,2010,6(14),3249.
16 薛秀丽.沉积在聚合物基底上微纳米金属薄膜的屈曲和断裂行为研究.博士学位论文,天津大学,2014.
17 贾海坤.基底上金属纳米薄膜屈曲行为及其破坏机理研究,博士学位论文,天津大学,2013.
18 Vandeparre H,Damman P.Physical Review Letters,2008,101(12),124301.
19 Baffoun A,Haidara H,Dupuis D,et al.Langmuir,2007,23(18),9447.