摘要
借助扫描电子显微镜(SEM)和X射线衍射(XRD)对AZ31-xCu(x=0,0.5,1.5,3,质量分数,%)合金的铸态组织、相结构及表面腐蚀形貌进行测试和分析。采用浸泡试验和电化学试验对研究合金在3.5%氯化钠溶液中的腐蚀行为进行系统地对比研究。结果表明:随铜含量的增加,研究合金中的主要第二相AlCuMg相递增;腐蚀过程的主要腐蚀机制是微电偶腐蚀,AlCuMg相作为微电偶腐蚀阴极与镁基体阳极构成微电偶腐蚀对,随AlCuMg相体积分数增加,形成的微电偶腐蚀对增多,相应的腐蚀速率增大。当铜含量为3%时,研究合金的腐蚀速率最大,研究合金的析氢速率和腐蚀电流密度分别为:75mL/(cm~2·d)和698μA/cm~2。
The as-cast microstructure, phase composition and surface corrosion morphologies of AZ31-x Cu(x=0, 0.5, 1.5,3, mass fraction, %) alloys were observed by scanning electron microscope(SEM) equipped with energy dispersive spectroscope(EDS) and X-ray diffraction(XRD). The corrosion behavior of the alloys in 3.5% NaCl solution was investigated by immersion test and electrochemical test. The results indicate that the content of AlCuMg phase, main secondary phase in the Cu-containing alloys, is positively dependent on copper concentration. Acceleration of corrosion rate is found in Cu-containing alloys due to micro-galvanic corrosion. AlCuMg phase acts as micro-galvanic cathode against anodic magnesium matrixes. The corrosion rate of the alloy with Cu content of 3% is the fastest. The AZ31-3 Cu alloy exhibits the maximum hydrogen evolution rate of 275 mL/(cm~2·d~(---1)) and corrosion current density of 698 μA/cm~2.
引文
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