影响金刚石微粉化学镀镍品质的因素
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摘要
用化学镀的方法在线锯用金刚石微粉表面镀覆一层镍,通过正交试验、SEM,探究镀液配比和工艺条件对金刚石微粉化学镀结果的影响。结果表明:镀液中络合剂对化学镀增重影响的主次排序为:柠檬酸>氨水>柠檬酸钠,但去掉柠檬酸钠会降低增重;化学镀增重率与金刚石颗粒表面沉积的镍晶粒大小有关,且镀液pH为4左右时,能得到漏镀少连晶少的镀覆金刚石微粉;当溶液中不添加稳定剂时,会有镍渣生成,而添加量过多又会抑制反应进行,此时若增大分散剂的量,可以使不反应的溶液正常发生反应;随着金刚石装载量变大,增重率降低,且装载量以6 g为好;随着温度增高,增重率变大,最佳温度应选取在80～85℃。
A layer of nickel is coated on the surface of diamond powder by electroless plating. The effects of the plating bath composition and plating conditions on the results of electroless plating of diamond powder are investigated by orthogonal experiments and SEM. The results show that the influence order of complexant on weight gain is as follows: citric acid > ammonia > sodium citrate, and that the weight gain will be reduced without adding sodium citrate. The weight gain rate of electroless plating is related to the nickel grain size deposited on the surface of diamond powder, and the coated diamond powder with less leakage and less continuous crystals can be obtained when pH value is about 4. Nickel slag will be formed when not adding stabilizer, and excessive addition of stabilizer will inhibit the reaction. The reaction will proceed normally if the amount of dispersant is increased at excessive stabilizer. With the increase of diamond addition, the weight gain rate decreases and the best coating would be achieved at diamond addition of 6 g. With the increase of temperature, the rate of weight gain increases and 80～85 ℃ is the optimum range.
A layer of nickel is coated on the surface of diamond powder by electroless plating. The effects of the plating bath composition and plating conditions on the results of electroless plating of diamond powder are investigated by orthogonal experiments and SEM. The results show that the influence order of complexant on weight gain is as follows: citric acid > ammonia > sodium citrate, and that the weight gain will be reduced without adding sodium citrate. The weight gain rate of electroless plating is related to the nickel grain size deposited on the surface of diamond powder, and the coated diamond powder with less leakage and less continuous crystals can be obtained when pH value is about 4. Nickel slag will be formed when not adding stabilizer, and excessive addition of stabilizer will inhibit the reaction. The reaction will proceed normally if the amount of dispersant is increased at excessive stabilizer. With the increase of diamond addition, the weight gain rate decreases and the best coating would be achieved at diamond addition of 6 g. With the increase of temperature, the rate of weight gain increases and 80～85 ℃ is the optimum range.
引文
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[2] 郑莲.人造金刚石表面金属化工艺及性能研究 [D].郑州:中原工学院,2014.ZHENG Lian.Investigation on the technology and properties on the metallization of man-made diamond surface [D].Zhengzhou:Zhongyuan University of Technology,2014.
[3] 王秦生,王小军.金刚石表面镀层在磨具中的作用机理 [J].金刚石与磨料磨具工程,2006(5):5–9.WANG Qinsheng,WANG Xiaojun.Effect mechanism of diamond surface coating in diamond tools [J].Diamond & Abrasives Engineering,2006(5):5-9.
[4] 王蕊,刘新宽,徐斌,等.电镀金刚石线锯制备及应用的研究现状 [J].电镀与涂饰,2017,36(12):660–663.Wang Rui,Liu Xinkuan,Xu Bin,et al.Research status of preparation and application of electroplated diamond wire saw [J].Electroplating & Finishing,2017,36(12):660-663.
[5] 代晓南,何伟春,栗正新.电镀金刚石线锯研究进展 [J].超硬材料工程,2017,29(1):52–54.DAI Xiaonan,HE Weichun,LI Zhengxin.Research progress of electroplated diamond wire saw [J].Superhard Material Engineering,2017,29(1):52-54.
[6] 朱振宇,黎德育,李宁,等.甘氨酸为配位剂的化学镀铜动力学研究 [C]// 中国腐蚀与防护学会.第十届全国化学镀会议论文集.长沙:中国腐蚀与防护学会,2010.ZHU Zhenyu,LI Deyu,LI Ning,et al.Kinetics study of electroless copper plating using glycine as complexing agent [C]// Chinese Society for Corrosion and Protection.10th China Electroless Plating Conference Proceedings.Changsha:Chinese Society for Corrosion and Protection:2010.
[7] 李茂东,张永君,吴丹,等.基于三元复合络合剂的高磷Ni–P化学镀 [J].中国表面工程,2015,28(6):70–80.LI Maodong,ZHANG Yongjun,WU Dan,et al.Electroless plating of Ni-P alloys with high P contend based on ternary compound complexing agents [J].China Surface Engineering,2015,28(6):70-80.
[8] 朱理北,赵海涛,孙杰,等.硫脲对TC4表面低磷化学镀Ni–P镀层的影响 [J].沈阳理工大学学报,2016,35(1):63–66.ZHU Libei,ZHAO Haitao,SUN Jie,et al.The Influence of thiourea to the low-phosphorus electroless Ni-P plating on the surface of TC4 [J].Journal of Shenyang Ligong University,2016,35(1):63-66.
[9] 徐利,周峻峰,王树根.涤纶织物化学镀膜金属晶粒尺寸与分散剂的关系的研究 [J].表面技术,2004,33(3):35–36.XU Li,ZHOU Junfeng,WANG Shugen.Study on electroless plating of polyester of relation between size of metal crystal and dispersant [J].Surface Technology,2004,33(3):35-36.