采用正交试验优化设计Sn-Bi-Ag-Cu-Ce无铅焊料的性能分析
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摘要
采用正交试验优化设计新型Sn-Bi-Ag-Cu-Ce五元无铅焊料,对焊料熔点、铺展系数及抗拉强度进行测试,通过方差分析确定五元无铅焊料的最佳配方,并对比分析最佳焊料的强度及润湿铺展性能。结果表明:Sn-Bi-Ag-Cu-Ce五元无铅焊料的熔点接近Sn-37Pb焊料,为203.4℃;焊料组织中的富Bi相、Ag3Sn相和Cu6Sn5相得到细化,焊料抗拉强度明显提高,达到56.3 MPa;焊料铺展系数相较SAC305、SAC0307焊料提高9.4%、13.8%。
The Sn?Bi?Ag?Cu?Ce five?element lead?free solder was optimized by orthogonal test. The melting point,spreading coefficient and tensile strength of the solder were tested. Then the best formula of the five?element alloy solder was obtained by variance analysis of the orthogonal test results. The performance of the best solder was analyzed and compared. The results show that Sn?Bi?Ag?Cu?Ce five?element lead?free solder has a melting point close to that of Sn?37 Pb solder,which is 203.4 ℃. The Bi?rich phase,Ag_3Sn phase and Cu_6Sn_5 phase in the solder structure are refined,and the tensile strength of the solder is obviously improved,reaching 56.3 MPa. The solder spreading coefficient increases by 9.4% and 13.8% than that of SAC305 and SAC0307 solder,respectively.
The Sn?Bi?Ag?Cu?Ce five?element lead?free solder was optimized by orthogonal test. The melting point,spreading coefficient and tensile strength of the solder were tested. Then the best formula of the five?element alloy solder was obtained by variance analysis of the orthogonal test results. The performance of the best solder was analyzed and compared. The results show that Sn?Bi?Ag?Cu?Ce five?element lead?free solder has a melting point close to that of Sn?37 Pb solder,which is 203.4 ℃. The Bi?rich phase,Ag_3Sn phase and Cu_6Sn_5 phase in the solder structure are refined,and the tensile strength of the solder is obviously improved,reaching 56.3 MPa. The solder spreading coefficient increases by 9.4% and 13.8% than that of SAC305 and SAC0307 solder,respectively.
引文
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[7]李少亮,宗晓明,王俊涛,等. Sn-3.5Ag-0.5Cu无铅焊料力学性能与组织特征研究[J].电子工艺技术,2015,36(3):134-137.
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[19]廖春丽.稀土元素Er对SnCu基无铅钎料组织与性能的影响[J].铸造技术,2017,38(11):2734-2736.
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[21]刘文胜,邓涛,马运柱,等.稀土元素对无铅焊料性能的影响[J].材料科学与工程学报,2011,29(5):800-805.
[22]张亮,NING TU KING,郭永环,等.稀土元素Eu对SnAgCu钎料组织与性能影响[J].稀有金属,2015,39(1):11-15.
[23]孙磊,张亮,钟素娟,等. Sn1.0Ag0.5Cu和Sn3.0Ag0.5Cu钎料组织与性能对比研究[J].稀有金属,2015,39(7):589-593.
[24]徐佳琛,薛松柏,薛鹏,等. Sn-0.3Ag-0.7Cu-xNd钎料显微组织及性能[J].焊接学报,2015,36(1):83-86.
[25]马鑫,董本霞.无铅钎料发展现状[J].电子工艺技术,2002,23(2):47-52.
[26]罗庭碧.低Ag含量Sn-Ag-Zn系无铅焊料的研究[D].上海:上海交通大学,2014.
[27]BUBAN J P,MATSUNAGA K,CHEN Jun,et al. Grain bound?ary strengthening in alumina by rare earth impurities[J]. Sci?ence,2006,311(5758):212-215.
[2]SUGANUMA K. Advances in lead?free electronics soldering[J]. Current Opinion in Solid State and Materials Science,2001,5(1):55-64.
[3]田华存.浅谈低Ag系Sn-Ag-Cu焊料的发展[J].中国新技术新产品,2017(17):52-53.
[4]吴炜,张佳,樊湘芳. Ag含量对Sn-x%Ag-0.5%Cu(x≤3)系无铅焊料合金性能的影响[J].轻工科技,2016(7):55-56.
[5]刘平,顾小龙,钟海峰,等.新型低银钎料SAC0307X的研究[J].电子元件与材料,2015(12):93-97.
[6]张春红,张信永,王世敏,等.无铅复合钎料的研究及发展[J].机械,2018,45(4):51-55.
[7]李少亮,宗晓明,王俊涛,等. Sn-3.5Ag-0.5Cu无铅焊料力学性能与组织特征研究[J].电子工艺技术,2015,36(3):134-137.
[8]CHENG Fangjie,GAO Feng,ZHANG Jianyou,et al. Tensile properties and wettability of SAC0307 and SAC105 low Ag lead?free solder alloys[J]. Journal of Materials Science,2011,46(10):3424-3429.
[9]LI BO,SHI Yaowu,LEI Yongping,et al. Effect of rare earth el?ement addition on the microstructure of Sn?Ag?Cu solder joint[J]. Journal of Electronic Materials,2005,34(3):217-224.
[10]赖忠民,游庆荣,孔幸达,等. Sn-18Bi-XCu低温无铅钎料微观组织及力学性能[J].江苏科技大学学报(自然科学版),2018,32(1):27-30.
[11]陈旭. Sn-Bi基焊料组织与性能研究[D].南京:东南大学,2017.
[12]张彦娜,朱宪忠,刘刚,等. Bi对Sn-3.0Ag-0.5Cu无铅焊料微观组织和性能的影响[J].热加工工艺,2011,40(23):187-189.
[13]李元山,雷晓娟,陈振华,等.新型锡铋系无铅焊料的开发[J].机械工程材料,2007(5):24-26.
[14]HUANG M L,WU C M L,LAI J K L,et al. Microstructural evolution of a lead?free solder alloy Sn?Bi?Ag?Cu prepared by mechanical alloying during thermal shock and aging[J]. Jour?nal of Electronic Materials,2000,29(8):1021-1026.
[15]赵振兴. Sn-Ag-Cu-Bi无铅钎料液—液结构转变及其对组织和性能的影响[D].合肥:合肥工业大学,2012.
[16]王丽凤,孙凤莲,刘晓晶,等. Sn-Ag-Cu-Bi钎料合金设计与组织性能分析[J].焊接学报,2008(7):9-12.
[17]何鹏,赵智力,钱乙余. Sn-Bi-Ag-Cu钎料波峰焊焊点的剥离现象[J].中国有色金属学报,2005(7):993-999.
[18]熊丽媛,薛松柏,王禾.稀土元素Pr,Nd对无铅钎料组织和性能的影响[J].焊接,2017(12):9-17.
[19]廖春丽.稀土元素Er对SnCu基无铅钎料组织与性能的影响[J].铸造技术,2017,38(11):2734-2736.
[20]沈艳兰.微量稀土对SnAgCu系无铅焊料性能和组织的影响[D].中国计量学院,2012.
[21]刘文胜,邓涛,马运柱,等.稀土元素对无铅焊料性能的影响[J].材料科学与工程学报,2011,29(5):800-805.
[22]张亮,NING TU KING,郭永环,等.稀土元素Eu对SnAgCu钎料组织与性能影响[J].稀有金属,2015,39(1):11-15.
[23]孙磊,张亮,钟素娟,等. Sn1.0Ag0.5Cu和Sn3.0Ag0.5Cu钎料组织与性能对比研究[J].稀有金属,2015,39(7):589-593.
[24]徐佳琛,薛松柏,薛鹏,等. Sn-0.3Ag-0.7Cu-xNd钎料显微组织及性能[J].焊接学报,2015,36(1):83-86.
[25]马鑫,董本霞.无铅钎料发展现状[J].电子工艺技术,2002,23(2):47-52.
[26]罗庭碧.低Ag含量Sn-Ag-Zn系无铅焊料的研究[D].上海:上海交通大学,2014.
[27]BUBAN J P,MATSUNAGA K,CHEN Jun,et al. Grain bound?ary strengthening in alumina by rare earth impurities[J]. Sci?ence,2006,311(5758):212-215.