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某种高温合金550℃高温应变测试
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  • 英文篇名:Thermal strain test of high temperature alloy at 550℃
  • 作者:李丽霞 ; 蒋军亮 ; 郝庆瑞 ; 秦强
  • 英文作者:Li Lixia;Jiang Junliang;Hao Qingrui;Qin Qiang;Aircraft Strength Research Institute, Aviation Industry Corporation of China;
  • 关键词:稳态温度场 ; 高温合金 ; 高温应变 ; 高温应变误差
  • 英文关键词:steady temperature,high temperature alloy,thermal strain,error of thermal strain
  • 中文刊名:YYLX
  • 英文刊名:Chinese Journal of Applied Mechanics
  • 机构:中国航空工业集团公司中国飞机强度研究所;
  • 出版日期:2015-06-16 17:06
  • 出版单位:应用力学学报
  • 年:2015
  • 期:v.32;No.133
  • 语种:中文;
  • 页:YYLX201503006
  • 页数:7
  • CN:03
  • ISSN:61-1112/O3
  • 分类号:36-41+179
摘要
随着航空、航天技术的发展,飞行器热端部件的温度越来越高,载荷情况越来越复杂。为了更好地研究这些结构在高温环境下的力学特性,需要测试结构的高温应变并验证高温应变测试方法的可靠性。本文利用高温应变性能鉴定机测试四点弯曲高温合金梁在550℃稳态温度场条件下的高温应变。测试共进行三次,测试过程中温度的温升率为3℃/min。测试完成后,利用高温应变理论公式对高温应变试验数据进行处理,得到四点弯曲梁的真实应变值,并进行误差计算,四个应变片的误差分别为3%、20%、3%、7%,测试获得了较为满意的结果。此项试验结果表明:本文给出的四点弯曲高温合金梁高温应变测试方案合理可行,使用的高温应变计粘贴方案可靠性较高,四点弯曲梁高温应变测试方法可以作为今后进一步深入研究高温应变测试技术的参考资料和基础,为将来更高温度、更复杂的温度场环境下的高温应变测试提供技术支持。
        As aerospace technology develops, the temperature of aircraft hot components gets higher and higher while the loads are more and more complex. To better understand the thermal mechanical behaviors of these structures, it is necessary to measure the thermal strain of these structures. In this paper, the thermal strain of a high temperature alloy beam is tested in a thermal strain performance identification machine at a steady temperature of 550℃.The measurement is repeated for three times with an appropriate temperature rise rate 3℃/min. Then the thermal strain experimental data is processed according to the thermal strain theory to obtain the true strain values of the beam. Error analysis is conducted and appropriate results are obtained. The test results show that four-point bend high temperature alloy beam plan for thermal strain test is feasible. And the bonding of high-temperature strain gauge is reliable. Thermal output measuring technology and high thermal strain modification method supply a suitable foundation and supports for further investigation of thermal strain test technology with higher and more complex temperature environment.
引文
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