累积叠轧Cu/Nb复合板材在形变与退火过程中的组织及性能演变
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摘要
采用金相显微镜、SEM、抗拉强度及硬度测试等手段,对累积叠轧Cu/Nb复合板材的组织结构、断口形貌及力学性能进行研究,分析了累积叠轧、退火处理对Cu/Nb金属复合板材微观组织结构及室温拉伸断裂行为的影响作用。结果表明:累积叠轧使Cu/Nb复合板材的强度和硬度升高,退火使Cu/Nb复合板材的强度和硬度下降。当退火温度为300℃时,能使Cu/Nb复合板材强度和硬度分别下降至约240 MPa和75 HV。当退火温度提高时,Cu/Nb复合板材的硬度在70~80 HV的范围内波动。在试验温度范围内退火,Cu/Nb界面处也无Cu、Nb元素扩散。此外,增加焊合界面的轧制次数及退火处理有助于Cu/Nb复合板材焊合界面结合强度的提高。
The microstructure,fracture morphology and mechanical properties of the Cu/Nb composite plates produced by accumulative rollbonding( ARB) process were investigated using optical microscopy,scanning electron microscopy,strength and hardness measurements.The effect of ARB and annealing on microstructure and tensile deformation behavior of ARBed Cu/Nb composite plates was analyzed. The results show that the strength and hardness of the Cu/Nb composite plates increased after ARB process. The strength and hardness of ARBed Cu/Nb composite plates decrease after annealing treatment,to 240 MPa and 75 HV after annealed at 300 ℃ for 1 h respectively. With annealing temperature increasing,the hardness of the annealed samples is in the range of 70-80 HV. The diffusion between Cu/Nb interfaces does not occur during annealing. In addition,the increased number of ARB cycles and the annealing treatment are helpful to the bonding efficiency of Cu/Cu interfaces in the Cu/Nb composite plates.
The microstructure,fracture morphology and mechanical properties of the Cu/Nb composite plates produced by accumulative rollbonding( ARB) process were investigated using optical microscopy,scanning electron microscopy,strength and hardness measurements.The effect of ARB and annealing on microstructure and tensile deformation behavior of ARBed Cu/Nb composite plates was analyzed. The results show that the strength and hardness of the Cu/Nb composite plates increased after ARB process. The strength and hardness of ARBed Cu/Nb composite plates decrease after annealing treatment,to 240 MPa and 75 HV after annealed at 300 ℃ for 1 h respectively. With annealing temperature increasing,the hardness of the annealed samples is in the range of 70-80 HV. The diffusion between Cu/Nb interfaces does not occur during annealing. In addition,the increased number of ARB cycles and the annealing treatment are helpful to the bonding efficiency of Cu/Cu interfaces in the Cu/Nb composite plates.
引文
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[17]张清龙,王军丽,侯健,等.LZ91合金在累积叠轧焊合过程中的界面焊合研究[J].金属热处理,2017,42(4):58-63.Zhang Qinglong,Wang Junli,Hou Jian,et al.Interface bonding of LZ91 alloy by accumulative roll bonding[J].Heat Treatment of Metals,2017,42(4):58-63.
[2]Lecouturier F,Spencer K,Thilly L,et al.Perspectives for Cu/SS macrocomposite and Cu/X nanofilamentary conductors used in nondestructive high-field pulsed magnets under cryogenic conditions[J].Physica B Condensed Matter,2004,346(1):582-588.
[3]Deng L P,Yang X F,Han K,et al.Microstructure and texture evolution of Cu-Nb composite wires[J].Materials Characterization,2013,81(1):124-133.
[4]Spitzig W A,Downing H L,Laabs F C,et al.Strength and electrical conductivity of a deformation-processed Cu-5 Pct Nb composite[J].Metallurgical Transactions A,1993,24(1):7-14.
[5]Thilly L,Veron M,Ludwig O,et al.High-strength materials:in-situ investigations of dislocation behaviour in Cu-Nb multifilamentary nanostructured composites[J].Philosophical Magazine A,2002,82(5):925-942.
[6]Ekiz E H,Lach T G,Averback R S,et al.Microstructural evolution of nanolayered Cu-Nb composites subjected to high-pressure torsion[J].Acta Materialia,2014,72:178-191.
[7]Hosseini S A,Manesh H D.High-strength,high-conductivity ultra-fine grains commercial pure copper produced by ARB process[J].Materials and Design,2009,30(8):2911-2918.
[8]Saito Y,Utsunomiya H,Tsuji N,et al.Novel ultra-high straining process for bulk materials—development of the accumulative rollbonding(ARB)process[J].Acta Materialia,1999,47(2):579-583.
[9]李敏,姜庆伟.预退火时间对累积叠轧超细晶铜室温拉伸断裂行为的影响[J].中国有色金属学报,2017,27(11):2307-2314.Li Min,Jiang Qingwei.Effect of pre-annealing time on tensile deformation behavior of accumulative rolling bonding ultrafine grained Cu at room temperature[J].The Chinese Journal of Nonferrous Metals,2017,27(11):2307-2314.
[10]Wang L J,Shi Q N,Qian T C,et al.Recrystallized microstructural evolution of UFG copper prepared by asymmetrical accumulative rolling-bonding process[J].Transactions of Nonferrous Metals Society of China,2010,20(4):559-563.
[11]Huang X,Hansen N,Tsuji N.Hardening by annealing and softening by deformation in nanostructured metals[J].Science,2006,312:249-251.
[12]庄丽敏,赵永好,梁宁宁,等.累积叠轧制备超细晶纯铜多层板的组织和性能[J].材料科学与工程学报,2015,33(5):650-656.Zhuang Limin,Zhao Yonghao,Liang Ningning,et al.Microstructure evolution and mechanical of ultrafine grained copper sheet by accumulative roll bonding[J].Journal of Materials Science and Engineering,2015,33(5):650-656.
[13]Min G,Lee J M,Kang S B,et al.Evolution of microstructure for multilayered Al/Ni composites by accumulative roll bonding process[J].Materials Letters,2006,60(27):3255-3259.
[14]Hmlinen M,Jskelinen K,Luoma R,et al.A thermodynamic analysis of the binary alloy systems Cu-Cr,Cu-Nb and Cu-V[J].Calphad,1990,14(2):125-137.
[15]Vidal V,Thilly L,Van Petegem S,et al.Plasticity of nanostructured Cu-Nb-based wires:Strengthening mechanisms revealed by in situ deformation under neutrons[J].Scripta Materialia,2009,60(3):171-174.
[16]李敏,刘静,姜庆伟.退火温度对ARB-Cu室温拉伸断裂行为的影响[J].金属学报,2017,53(8):1001-1010.Li Min,Liu Jing,Jiang Qingwei.Effect of annealing temperature on tensile fracture behavior of ARB-Cu at room temperature[J].Acta Metallurgica Sinica,2017,53(8):1001-1010.
[17]张清龙,王军丽,侯健,等.LZ91合金在累积叠轧焊合过程中的界面焊合研究[J].金属热处理,2017,42(4):58-63.Zhang Qinglong,Wang Junli,Hou Jian,et al.Interface bonding of LZ91 alloy by accumulative roll bonding[J].Heat Treatment of Metals,2017,42(4):58-63.