Ti/Cu/Nb作中间层脉冲加压瞬间液相连接TiC金属陶瓷与不锈钢（英文）
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摘要
部分瞬间液相焊接(PTLP)综合了钎焊和固相扩散连接的优点,且对连接母材表面粗糙度比传统固相连接相对较低,因此在陶瓷和金属异种材料连接方向上具有较大的优势。采用Ti–Cu–Nb金属中间层,对TiC金属陶瓷与06Cr19Ni10不锈钢进行PTLP连接试验。通过SEM、EDS、XRD和拉伸试验等方法,研究了活性元素中间层、工艺参数对TiC/Ti CuNb/06Cr19Ni10瞬间液相焊接头性能与界面微观结构的影响规律。结果表明,在连接温度885°C、脉冲压力2~10 MPa的工艺条件下保温5 min时接头剪切强度达到最大值(~106.7 MPa)。微观组织表征发现,在TiC金属陶瓷一侧,Ti–Cu层在高于共晶点的连接温度时发生熔化,与TiC金属陶瓷、核心金属层Nb产生界面反应;而在304SS侧,Nb与304SS进行固相扩散,形成具有固相扩散特征的连接结构,连接后界面形成06Cr19Ni10/σ/Nb/CuTi/CuTi2/α+βTi/Ti C过渡结构。连接接头的裂纹沿着Ti–Cu金属化合物层向TiC陶瓷母材扩展,呈脆性解理断裂特征。
Partial transient liquid phase(PTLP) bonding of Ti C cermet to 06Cr19Ni10 stainless steel was carried out. Impulse pressuring was used to reduce the bonding time, and a Ti/Cu/Nb interlayer was employed to alleviate the detrimental effect of interfacial reaction products on the bonding strength. Successful bonding was achieved at 885 °C under a pulsed pressure of 2–10 MPa within durations in the range of 2–8 min, which was notably shortened in comparison with conventional PTLP bonding. Microstructure characterization revealed the σ phase with a limit solubility of Nb, a sequence of Ti–Cu intermetallic phases and solid solutions of Ni and Cu in α+β Ti in the reaction zone. The maximum shear strength of 106.7 MPa was obtained when the joint was bonded for 5 min, indicating that a robust metallurgical bonding was achieved. Upon shear loading, the joints fractured along the Ti–Cu intermetallics interface and spread to the interior of Ti C cermet in a brittle cleavage manner.
Partial transient liquid phase(PTLP) bonding of Ti C cermet to 06Cr19Ni10 stainless steel was carried out. Impulse pressuring was used to reduce the bonding time, and a Ti/Cu/Nb interlayer was employed to alleviate the detrimental effect of interfacial reaction products on the bonding strength. Successful bonding was achieved at 885 °C under a pulsed pressure of 2–10 MPa within durations in the range of 2–8 min, which was notably shortened in comparison with conventional PTLP bonding. Microstructure characterization revealed the σ phase with a limit solubility of Nb, a sequence of Ti–Cu intermetallic phases and solid solutions of Ni and Cu in α+β Ti in the reaction zone. The maximum shear strength of 106.7 MPa was obtained when the joint was bonded for 5 min, indicating that a robust metallurgical bonding was achieved. Upon shear loading, the joints fractured along the Ti–Cu intermetallics interface and spread to the interior of Ti C cermet in a brittle cleavage manner.
引文
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[2]SUN K N,YIN Y S,LI A M.Intermetallics/ceramic matrix composite[M].Beijing:China Machine Press,2002.(in Chinese)
[3]TRAVESSA D,FERRANTE M,DEN O G.Diffusion bonding of aluminium oxide to stainless steel using stress relief interlayers[J].Mater Sci Eng A,2002,337(1):287–296.
[4]SHEN X Q,LI Y J,PUTCHKOV U A.Finite-element analysis of residual stresses in Al2O3–Ti C/W18Cr4V diffusion bonded joints[J].Comp Mater Sci,2009,45(2):407–410.
[5]YE D M,XIONG W H.Vacuum brazing of Ti(C,N)based cermets to 45 Steel[J].Rare Metal Mat Eng,2008,37(7):1281–1284.
[6]PIERSON H O.Handbook of refractory carbides&nitrides:Properties,characteristics,processing and apps[M].William Andrew,1996.
[7]GOMEZ-DE-SALAZAR J M,BARRENA M I.Dissimilar fusion welding of AA7020/MMC reinforced with Al2O3particles,microstructure and mechanical properties[J].Mater Sci Eng A,2003,352(1):162–168.
[8]BARRENA M I,GOMEZ-DE-SALAZAR J M,MATESANZ L.Ni–Cu alloy for diffusion bonding cermet/steel in air[J].Mater Lett,2009,63(24):2142–2145.
[9]LI Z R,FENG J C,CAO J.Vacuum diffusion bonding of Ti B2 cermet to Ti Al based alloys[J].Mater Sci Tech-Lond,2004,20(12):1666–1668.
[10]HUANG W Q,LI Y,WANG J.Microstructure and fracture of Ti C-Al2O3/W18Cr4V diffusion bonded joint[J].Kovove Mater,2010,48:227–231.
[11]CHEN Z,CAO M S,ZHAO Q Z.Interfacial microstructure and strength of partial transient liquid-phase bonding of silicon nitride with Ti/Ni multi-interlayer[J].Mater Sci Eng A,2004,380(1):394–401.
[12]ZHENG C,LOU H,FEI Z.Partial transient liquid-phase bonding of Si3N4 with Ti/Cu/Ni multi-interlayers[J].J Mater Sci Lett,1997,16(24):2026–2028.
[13]WANG G,LANNUTTI J J.Chemical thermodynamics as a predictive tool in the reactive metal brazing of ceramics[J].Metall Mater Trans A,1995,26(6):1499–1505.
[14]MASSALSKI T B,OKAMOTO H,SUBRAMANIAN P R.Binary alloy phase diagrams[M].Materials Park,OH:ASM International,1990.
[15]YANG M,ZOU Z D,SONG S L.Effect of interlayer thickness on strength and fracture of Si3N4 and Inconel600joint[J].Key Eng Mater,2005,297:2435–2440.
[16]MARKS R A,SUGAR J D,GLAESER A M.Ceramic joining IV.Effects of processing conditions on the properties of alumina joined via Cu/Nb/Cu interlayers[J].J Mater Sci,2001,36(23):5609–5624.
[17]SHACKELFORD J F,ALEXANDER W.CRC materials science and engineering handbook[M].CRC Press,2010.
[18]HAN J,SHENG G M,ZHOU X L.Pulse pressuring diffusion bonding of Ti alloy/austenite stainless steel processed by surface self-nanocrystallization[J].ISIJ Int,2009,49(1):86–91.
[19]SUN X J,GU J L,BAI B Z,CHEN N P.Fabrication of submicron grained titanium alloy by compressive deformation[J].Acta Metall Sin-Engl,2009,13(2):638–644.
[20]LIU G M,ZOU G S,WU A P.Improvements of the Si3N4brazed joints with intermetallics[J].Mater Sci Eng A,2006,415(1):213–218.
[21]XU H,DU Y,HUANG B.Phase equilibria of the Cu–Nb–Ti system at 850°C[J].J Alloy Compd,2005,399(1):92–95.
[22]KUNDU S,CHATTERJEE S.Characterization of diffusion bonded joint between titanium and 304 stainless steel using a Ni interlayer[J].Mater Charact,2008,59(5):631–637.
[23]ZDANIEWSKI W A,CONWAY J C,KIRCHNER H P.Effect of joint thickness and residual stresses on the properties of ceramic adhesive joints:II,Experimental results[J].J Am Ceram Soc,1987,70(2):110–118.
[24]BLUGAN G,KUEBLER J,BISSIG V.Brazing of silicon nitride ceramic composite to steel using Si C-particlereinforced active brazing alloy[J].Ceram Int,2007,33(6):1033–1039.
[25]SINGH M,MARTINEZ F J,ASTHANA R.Interfacial characterization of silicon nitride/silicon nitride joints brazed using Cu-base active metal interlayers[J].Ceram Int,2012,38(4):2793–2802.