FUNDAMENTAL STUDY ON A SECURE PRINTING PROCESS USING NANOWORK STENCILS FOR 01005 COMPONENTS
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- 英文论文题名：FUNDAMENTAL STUDY ON A SECURE PRINTING PROCESS USING NANOWORK STENCILS FOR 01005 COMPONENTS
- 论文作者：Stefan Hrter ; Jrg Franke ; Carmina Lntzsch
- 英文论文作者：Stefan H?rter ; J?rg Franke ; Carmina L?ntzsch ; Institute for Factory Automation and Production Systems (FAPS) ; Friedrich-Alexander University Erlangen-Nürnberg (FAU) ; Laser Job GmbH ; Fürstenfeldbruck
- 年：2016
- 作者机构：Institute for Factory Automation and Production Systems (FAPS),Friedrich-Alexander University Erlangen-Nürnberg (FAU);Laser Job GmbH, Fürstenfeldbruck;
- 英文论文关键词：stencil printing ; nano-coating ; nanowork ; transfer efficiency ; area ratio ; 01005 ; 03015mm ; solder paste inspection ; SPI
- 会议召开时间：2016-11-10
- 会议录名称：2016中国高端SMT学术会议论文集
- 语种：英文
- 分类号：TN405
- 学会代码：SMTS
- 会议名称：2016中国高端SMT学术会议
- 会议地点：中国福建厦门
- 主办单位：四川省电子学会SMT专委会、广东省电子学会SMT专委会、厦门市技师协会SMT专委会、陕西省电子学会SMT专委会、山东省电子制造技术专委会、上海市电子学会SMT专委会、安徽省电子学会SMT专委会、南京市电子学会SMT专委会、清华大学伟创力SMT实验室、SMTA China、英国环球SMT与封装、EM Asia、电子工艺技术杂志社、广东技术师范学院SMT实训中心
- 学会名称：四川省电子学会SMT专业委员会
- 页数：14
- 文件大小：540k
- 原文格式：D
- 会议级别：全国
摘要
The ongoing trend of miniaturization has induced many developments towards size reduction of electronic components for highly integrated electronic products.To meet the increasing requirements on the surface mount technology each step of the process chain has to be considered as well as cross-process observations.The process of solder paste printing occupies a key position in electronics production and will be focused in this study.Based on literature,about 50%to80%of all process defects originate in the stencil printing process[1–5].Despite the exact percentage of failures the process of stencil printing needs to be characterized for miniaturized printed structures as the complexity of this process step increases using materials for high integration like fine-grained solder paste materials and stencils with small openings of the apertures.For this study,a double-sided FR4 printed circuit board was developed that allows numerous variations within the entire process chain of assembly and interconnection technology.In previous investigations on the printing process,the solder paste types were identified as a major effect,therefore different solder paste materials will be evaluated.Various stencil foil thicknesses and aperture geometries are employed and studied.The alloy of the solder paste is a lead-free tin/silver/copper(SAC305)of type 4 as well as type 5.The stencils for the study are laser-cutted,nano-coated and optimized for small aperture geometries and aspect ratios.Aims of the experiments are findings on process windows for components of the size 01005 for a secure printing process.To give an outlook the results will be adapted for even smaller passive components as the component size of 03015mm and 008004,respectively.
The ongoing trend of miniaturization has induced many developments towards size reduction of electronic components for highly integrated electronic products. To meet the increasing requirements on the surface mount technology each step of the process chain has to be considered as well as cross-process observations. The process of solder paste printing occupies a key position in electronics production and will be focused in this study. Based on literature, about 50 % to80 % of all process defects originate in the stencil printing process[1–5]. Despite the exact percentage of failures the process of stencil printing needs to be characterized for miniaturized printed structures as the complexity of this process step increases using materials for high integration like fine-grained solder paste materials and stencils with small openings of the apertures. For this study, a double-sided FR4 printed circuit board was developed that allows numerous variations within the entire process chain of assembly and interconnection technology. In previous investigations on the printing process, the solder paste types were identified as a major effect, therefore different solder paste materials will be evaluated. Various stencil foil thicknesses and aperture geometries are employed and studied. The alloy of the solder paste is a lead-free tin/silver/copper(SAC305) of type 4 as well as type 5. The stencils for the study are laser-cutted, nano-coated and optimized for small aperture geometries and aspect ratios. Aims of the experiments are findings on process windows for components of the size 01005 for a secure printing process. To give an outlook the results will be adapted for even smaller passive components as the component size of 03015 mm and 008004, respectively.
The ongoing trend of miniaturization has induced many developments towards size reduction of electronic components for highly integrated electronic products. To meet the increasing requirements on the surface mount technology each step of the process chain has to be considered as well as cross-process observations. The process of solder paste printing occupies a key position in electronics production and will be focused in this study. Based on literature, about 50 % to80 % of all process defects originate in the stencil printing process[1–5]. Despite the exact percentage of failures the process of stencil printing needs to be characterized for miniaturized printed structures as the complexity of this process step increases using materials for high integration like fine-grained solder paste materials and stencils with small openings of the apertures. For this study, a double-sided FR4 printed circuit board was developed that allows numerous variations within the entire process chain of assembly and interconnection technology. In previous investigations on the printing process, the solder paste types were identified as a major effect, therefore different solder paste materials will be evaluated. Various stencil foil thicknesses and aperture geometries are employed and studied. The alloy of the solder paste is a lead-free tin/silver/copper(SAC305) of type 4 as well as type 5. The stencils for the study are laser-cutted, nano-coated and optimized for small aperture geometries and aspect ratios. Aims of the experiments are findings on process windows for components of the size 01005 for a secure printing process. To give an outlook the results will be adapted for even smaller passive components as the component size of 03015 mm and 008004, respectively.
引文
[1]C.-H.Mangin,“Where quality is lost on SMT boards,”Circuits Assembly Magazin,pp.63–64,1991.
[2]R.S.Clouthier,“The complete solder paste printing processes,”Surface Mount Technology,vol.13,pp.6–8,1999.
[3]C.Combet and M.-M.Chang,“01005 Assembly,the AOI route to optimizing yield:Technical Article,”Vi TECHNOLOGY,France,Jul.2009.
[4]J.Yang,J.C.Y.Huang,V.Lee,J.Tsai,C.-L.Ku,K.-C.Li,A.Hsieh,and C.Y.Chen,“Stencil evaluation of ultra fine pitch solder paste printing process,”in Proceedings of the 5th International Microsystems Packaging Assembly and Circuits Technology Conference(IMPACT),Taipei,2010,pp.1–4.
[5]K.Vijay,“Miniaturization-Solder Paste Attributes for Maximizing the Print&Reflow Manufacturing Process Window,”in Proceedings of the 18th European Microelectronics and Packaging Conference(EMPC),Brighton,2011,pp.26–29.
[6]Murata Manufacturing Co,Ltd,[PR]Evolving Capacitors Monolithic Ceramic Capacitors.Available:http://www.murata.com/products/article/pp09e1/3.html(2013,Nov.14).
[7]N.Heilmann,“01005 Assembly–From Board Design To The Reflow Process,”On Board Technology,pp.54–59,2008.
[8]R.Jarvina,S.Greiner,and R.Warren,“01005 SMT component assembly for wireless SIP modules,”in Proceedings of the 55th Electronic Components and Technology Conference(ECTC),Lake Buena Vista,FL,2005,pp.1500–1505.
[9]R.Mohanty,M.S.Ramkumar,C.Anglin,and T.Oda,“Effect of Nano-Coated Stencil on 01005Printing,”in Proceedings of the International Printed Circuits APEX EXPO Technical Conference(IPC),Las Vegas,NV,2011,pp.1727–1736.
[10]V.Shah,R.Mohanty,A.S.Ramasubramanian,R.Lasky,and T.Jensen,“Investigating the01005-component assembly process requirements,”in Proceedings of the International Printed Circuits EXPO,APEX and the Designers Summit(IPC),2008,pp.1076–1084.
[11]C.Shea,L.Hozer,H.Kida,and M.Tsunoda,“01005 Chip Components In A Lead-Free System,”On Board Technology,pp.28–30,2007.
[12]K.Vishwanathan,S.Nambir,D.Santos,A.S.Ramasubramanian,and R.Mohanty,“Process Capability Indices for 01005 Stencil Printing Process,”in Proceedings of the 40th International Symposium on Microelectronics(IMAPS),San Jose,CA,2007,pp.292–299.
[13]Stencil Design Guidelines,IPC-7525A,2007.
[14]M.R?sch and J.Franke,“Characteristics and potentials of nano-coated stencils for stencil printing optimization,”in Proceedings of the Surface Mount Technology Association International Conference(SMTAI),Orlando,FL,2010,pp.816–822.
[15]Requirements for Soldering Pastes,IPC-J-STD 005,1995.
[16]Weichlotpasten-Teil 1:Zusammensetzung,Technische Lieferbedingungen,DIN 32513-1,2005.
[17]Murata Manufacturing Co,Ltd,Murata's World's Smallest 008004 Size(0.25 x 0.125 mm)Chip Ferrite Bead,2013.
[18]ROHM CO,LTD,Through out-of-the-box miniaturization,ROHM has developed the world's smallest*"03015 Size"chip resistor,2013.
[19]W.E.Coleman and C.Anglin,“Stencil Options for Printing Solder Paste for.3 mm CSP's and 01005Chip Components,”in Proceedings of the International Printed Circuits APEX EXPO(IPC),Las Vegas,NV,2010,pp.2604–2663.
[20]M.Whitmore and C.Ashmore,“The Development of New SMT Printing Techniques For Mixed Technology(Heterogeneous)Assembly,”in Proceedings of the 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium(IEMT),Melaka,2010,pp.1–8.
[2]R.S.Clouthier,“The complete solder paste printing processes,”Surface Mount Technology,vol.13,pp.6–8,1999.
[3]C.Combet and M.-M.Chang,“01005 Assembly,the AOI route to optimizing yield:Technical Article,”Vi TECHNOLOGY,France,Jul.2009.
[4]J.Yang,J.C.Y.Huang,V.Lee,J.Tsai,C.-L.Ku,K.-C.Li,A.Hsieh,and C.Y.Chen,“Stencil evaluation of ultra fine pitch solder paste printing process,”in Proceedings of the 5th International Microsystems Packaging Assembly and Circuits Technology Conference(IMPACT),Taipei,2010,pp.1–4.
[5]K.Vijay,“Miniaturization-Solder Paste Attributes for Maximizing the Print&Reflow Manufacturing Process Window,”in Proceedings of the 18th European Microelectronics and Packaging Conference(EMPC),Brighton,2011,pp.26–29.
[6]Murata Manufacturing Co,Ltd,[PR]Evolving Capacitors Monolithic Ceramic Capacitors.Available:http://www.murata.com/products/article/pp09e1/3.html(2013,Nov.14).
[7]N.Heilmann,“01005 Assembly–From Board Design To The Reflow Process,”On Board Technology,pp.54–59,2008.
[8]R.Jarvina,S.Greiner,and R.Warren,“01005 SMT component assembly for wireless SIP modules,”in Proceedings of the 55th Electronic Components and Technology Conference(ECTC),Lake Buena Vista,FL,2005,pp.1500–1505.
[9]R.Mohanty,M.S.Ramkumar,C.Anglin,and T.Oda,“Effect of Nano-Coated Stencil on 01005Printing,”in Proceedings of the International Printed Circuits APEX EXPO Technical Conference(IPC),Las Vegas,NV,2011,pp.1727–1736.
[10]V.Shah,R.Mohanty,A.S.Ramasubramanian,R.Lasky,and T.Jensen,“Investigating the01005-component assembly process requirements,”in Proceedings of the International Printed Circuits EXPO,APEX and the Designers Summit(IPC),2008,pp.1076–1084.
[11]C.Shea,L.Hozer,H.Kida,and M.Tsunoda,“01005 Chip Components In A Lead-Free System,”On Board Technology,pp.28–30,2007.
[12]K.Vishwanathan,S.Nambir,D.Santos,A.S.Ramasubramanian,and R.Mohanty,“Process Capability Indices for 01005 Stencil Printing Process,”in Proceedings of the 40th International Symposium on Microelectronics(IMAPS),San Jose,CA,2007,pp.292–299.
[13]Stencil Design Guidelines,IPC-7525A,2007.
[14]M.R?sch and J.Franke,“Characteristics and potentials of nano-coated stencils for stencil printing optimization,”in Proceedings of the Surface Mount Technology Association International Conference(SMTAI),Orlando,FL,2010,pp.816–822.
[15]Requirements for Soldering Pastes,IPC-J-STD 005,1995.
[16]Weichlotpasten-Teil 1:Zusammensetzung,Technische Lieferbedingungen,DIN 32513-1,2005.
[17]Murata Manufacturing Co,Ltd,Murata's World's Smallest 008004 Size(0.25 x 0.125 mm)Chip Ferrite Bead,2013.
[18]ROHM CO,LTD,Through out-of-the-box miniaturization,ROHM has developed the world's smallest*"03015 Size"chip resistor,2013.
[19]W.E.Coleman and C.Anglin,“Stencil Options for Printing Solder Paste for.3 mm CSP's and 01005Chip Components,”in Proceedings of the International Printed Circuits APEX EXPO(IPC),Las Vegas,NV,2010,pp.2604–2663.
[20]M.Whitmore and C.Ashmore,“The Development of New SMT Printing Techniques For Mixed Technology(Heterogeneous)Assembly,”in Proceedings of the 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium(IEMT),Melaka,2010,pp.1–8.