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半固态成型工艺对A390合金显微组织及力学性能的影响
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摘要
本文研究了半固态成型工艺对A390合金显微组织与力学性能的影响。本文通过重力铸造,电磁搅拌,半固态成型,三种工艺进行对比研究,结果表明:与重力铸造相比,在半固态成型工艺下,合金的显微组织得到明显改善,多边形Si相,尺寸略有减小,圆整化明显。力学性能大幅提高,在半固态成型工艺下,抗拉强度为212.67MPa,伸长率为2.63%,硬度值为102.5HB。对半固态成型工艺下A390合金的不同部位进行研究,结果表明:在合金的二分之一部位的组织及性能最佳。
Effect of Semi-solid molding process on microstructure and mechanical properties of A390 Alloy was investigated.The influence of different molding processes on organization and properties of the A3 90 alloy.Its molding process of gravity casting,electromagnetic stirring,semi-solid molding process.The results show that the microstructure of the alloy had changed obviously and the mechanical properties of the alloy were improved remarkably under the effect of semi-solid molding process.The size of the primary silicon reduced slightly and the shape of the primary silicon changed into spherical.The tensile strength reached 212.67 MPa,elongation reached2.63%and the hardness readier 102.5HB.Different parts of the A390 alloy under semi-solid forming process is investigated,the results show that the alloy microstructure and properties of one-half part is the best.
引文
[1]杨卯生,毛卫民,钟雪友.半固态合金成形的技术现状与展望[刀.包头钢铁学院学报,2001,20(2):187-194.
    [2]袁晓光,赵树国,李胜等.半固态挤压Al-Si-Fe合金组织与性能.铸造,2006,55(6):466-468.
    [3]Flemings MC.Behavior of Metal Alloys in the Semi-Solid[J].MetalTransA,1991,22A(4):957~981
    [4]杨永健,张绪平,朱洪睿,等.过共晶铝硅合金新型变质剂的研究[J].轻金属,2011,(8):62-64.
    [5]胥锴,刘徽平,袁帮谊,等.过共晶铝硅合金变质处理的研究进展[J].热加工工艺,2009,38(3):32-34.
    [6]乐秀伟,韦吉华,王道胤,等.过共晶铝硅合金活塞的挤压铸造[J].北京理工大学学报,1994,14(2):125-130.
    [7]彭晋民,钱翰城.铸态铸造铝硅合金的现状和发展[J].铸造技术,2000,(6):32-34.
    [8]L.Lass,J.M..Rodriguez-Ibabe.Wear Behaviour of Eutectic and Hypereutectic Al-Si-Cu-Mg Casting Alloys Tested against a Composite Brake Fad[J].Materials Science and Engineering,A363(2003),193-202.
    [9]程慈玲,吴守端,董定福,等.铝硅合金的液态模锻[J].上海金属,1988,1(9):41-47.
    [10]韩延峰,刘相法,杨志强,等.压力铸造对Al-Si-Cu合金组织的影响[J].铸造,2001,50(4):183-186.

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